IS37SML01G1
IS38SML01G1
1Gb SLC-1b ECC
3.3V SERIAL NAND FLASH MEMORY WITH 104MHZ MULTI I/O SPI
INTERFACE
PRELIMINARY DATA SHEET
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 2
Rev. 0A
06/16/2017
FEATURES
Flexible & Efficient Memory
Architecture
- Organization:
- Memory Cell Array: (128M + 4M) x 8bit
- Data Register: (2K + 64) x 8bit
- Page Size: (2K + 64) Byte
- Block Erase: (128K + 4K) Byte
- Memory Cell: 1bit/Memory Cell
Highest performance
- Frequency : 104MHz
- Internal ECC Implementation: 1-bit ECC
- Read Performance
- Read from Cell to Register with Internal
ECC: 100us
- Write Performance
- Program time: 400us - typical
- Block Erase time: 4ms – typical
Low Power with Wide Temp. Ranges
- Single 3.3V (2.7V to 3.6V) Voltage
Supply
- 10 mA Active Read Current
- 8 µA Standby Current
- Temp Grades:
- Industrial: -40°C to +85°C
- Extended: -40°C to +105°C
- Automotive, A1: -40°C to +85°C
- Automotive, A2: -40°C to +105°C
Reliable CMOS Floating Gate
Technology
- Internal ECC Requirement: 1bit/512Byte
- Endurance: 100K Program/Erase cycles
- Data Retention: 10 years
Efficient Read and Program modes
- Support SPI-Mode 0 and SPI-Mode 3
- Bus Width: x1, x2(1), x4
- Command Register Operation
- NOP: 4 cycles
- OTP Operation
- Bad-Block-Protect
- Boot Read
Advanced Security Protection
- Hardware Data Protection
- Program/Erase Lockout during Power
Transitions
Industry Standard Pin-out & Packages
- M =16-pin SOIC 300mil
- L = 8-contact WSON 8x6mm
Note:
1. X2 Program Operation is not defined.
1Gb 3.3V SPI-NAND FLASH MEMORY WITH 104MHZ MULTI I/O SPI
INTERFACE with 1b ECC PRELIMINARY INFORMATION
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 3
Rev. 0A
06/16/2017
GENERAL DESCRIPTION
The serial electrical interface follows the industry-standard serial peripheral interface (SPI), providing a
cost-effective non- volatile memory storage solution in systems where pin count must be kept to a
minimum.
The ISSI IS37/38SML01G1 is a 1Gb SLC SPI-NAND Flash memory device based on the standard
parallel NAND Flash, but new command protocols and registers are defined for SPI operation. It is also
an alternative to SPI-NOR, offering superior write performance and cost per bit over SPI-NOR.
The command set resembles common SPI-NOR command set, modified to handle NAND-specific
functions and new features. New features include user-selectable internal ECC. With internal ECC
enabled, ECC code is generated internally when a page is written to memory array. The ECC code is
stored in the spare area of each page. When a page is read to the cache register, the ECC code is
calculated again and compared with the stored value. Errors are corrected if necessary. The device
either outputs corrected data or returns an ECC error status.
The memory is divided into blocks that can be erased independently so it is possible to preserve valid
data while old data is erased. The device contains 1024 blocks, composed by 64 pages consisting in
two NAND structure of 32 series connected Flash cells. Each page consists 2112-Byte and is further
divided into a 2048-Byte data storage area with a separate 64-Byte spare area. The 64-Byte area is
typically used for memory and error management.
The copy back function allows the optimization of defective blocks management: when a page program
operation fails, the data can be directly programmed in another page inside the same array section
without the time consuming serial data insertion phase.
The pins serve as the ports for signals. The device has six signal lines plus Vcc and ground (GND, Vss).
The signal lines are SCK (serial clock), SI (command and data input), SO (response and data output),
and control signals CS#, HOLD#, WP#.
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 4
Rev. 0A
06/16/2017
TABLE OF CONTENTS
FEATURES ............................................................................................................................................................ 2
GENERAL DESCRIPTION .................................................................................................................................... 3
TABLE OF CONTENTS ......................................................................................................................................... 4
1. PIN CONFIGURATION ................................................................................................................................... 6
2. PIN DESCRIPTIONS ...................................................................................................................................... 7
3. BLOCK DIAGRAM .......................................................................................................................................... 8
4. Command Set ................................................................................................................................................. 9
5. ELECTRICAL CHARACTERISTICS ............................................................................................................. 10
5.1 ABSOLUTE MAXIMUM RATINGS (1) ..................................................................................................... 10
5.2 Recommended Operating Conditions .................................................................................................... 10
5.3 DC CHARACTERISTICs ........................................................................................................................ 11
5.4 Valid Block .............................................................................................................................................. 11
5.5 AC Measurement Condition .................................................................................................................... 12
5.6 AC PIN CAPACITANCE (TA = 25°C, VCC=3.3V, 1MHz) ...................................................................... 12
5.7 READ/PROGRAM/ERASE PERFORMANCne ...................................................................................... 12
5.8 General Timing Characteristics .............................................................................................................. 13
6. Operations and Timing Diagrams ................................................................................................................. 14
6.1 Read Operations and Serial Output........................................................................................................ 14
6.2 Program Operations and Serial Input ..................................................................................................... 17
6.3 Internal Data Move.................................................................................................................................. 23
6.4 Erase Operation ...................................................................................................................................... 23
6.5 Read ID ................................................................................................................................................... 25
6.6 WP# Timing ............................................................................................................................................ 26
6.7 HOLD# Timing ........................................................................................................................................ 27
6.8 Power-Up ................................................................................................................................................ 28
7. BUS/FEATURE OPERATION AND ERROR MANAGEMENT ..................................................................... 29
7.1 BUS Operation ..................................................................................................................................... 29
7.2 Feature Operations .............................................................................................................................. 30
7.3 Array Write Enable / Disable ................................................................................................................ 32
7.4 Status Register .................................................................................................................................... 33
7.5 Error Management ............................................................................................................................... 34
7.5.1 Mask Out Initial Invalid Blocks ............................................................................................................. 34
7.5.2 Identifying Initial Invalid BlockS ........................................................................................................... 34
7.5.3 Block Replacement .............................................................................................................................. 36
7.5.4 ECC Protection .................................................................................................................................... 37
7.6 Addressing for Programming Operation .............................................................................................. 38
8. PACKAGE TYPE INFORMATION ................................................................................................................ 39
8.1 16-LEAD PLASTIC SMALL OUTLINE PACKAGE (300 MILS BODY WIDTH) (M) ............................. 39
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 5
Rev. 0A
06/16/2017
8.2 8-CONTACT ULTRA-THIN SMALL OUTLINE NO-LEAD (WSON) PACKAGE 8x6mm (L) ................ 40
9. ORDERING INFORMATION – Valid Part Numbers ..................................................................................... 41
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 6
Rev. 0A
06/16/2017
1. PIN CONFIGURATION
16-pin SOIC 300mil
(1)
6
3
CS#
Vcc
SCK
SI (IO0)
7
8
5
4
1
2
Vss
WP# (IO2)
SO (IO1)
HOLD# (IO3)
8-contact WSON 8x6mm
12
10
11
9
13
15
14
5
7
6
8
4
2
3
16
1
Vcc
HOLD# (IO3)
SCK
CS#
WP# (IO2)
Vss
NC
NC
NC
NC
NC
SI (IO0)
SO (IO1)
NC
NC
NC
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 7
Rev. 0A
06/16/2017
2. PIN DESCRIPTIONS
SYMBOL
TYPE
DESCRIPTION
CS#
INPUT
Chip Select:
The device is activated/deactivated as CS# is driven LOW (1) /HIGH (2).
After power-on, the device requires a falling edge on CS# before any command can
be written. The device goes to standby mode when no PROGRAM, ERASE, or
WRITE STATUS REGISTER operation is in progress.
HOLD# / IO3
INPUT/
OUTPUT
HOLD#/IO3:
Hold pauses any serial communication with the device without deselecting it.(3) When
driven LOW, SO is at high impedance (Hi-Z), and all inputs in SI and SCK are ignored;
CS# also should be driven LOW.
HOLD# must not be driven during x4 operation.
WP# / IO2
INPUT/
OUTPUT
Write Protect#/IO2:
WP# is driven LOW to prevent overwriting the block-lock bits (BP0,BP1 and BP2). If
block register write disable (BRWD) bit is set. (4)
WP# must not be driven during x4 operation.
SCK
INPUT
Serial Clock:
SCK provides serial interfacing timing.
Address, commands, and data in SI are latched on the rising edge of SCK.
Output (data out SO) is triggered after the falling edge of SCK.
The clock is valid only when the device is active. (5)
SI / IO0
INPUT/OUTPUT
Serial Data Input/IO0:
SI transfers data serially into the device. Device latches addresses, commands, and
program data in SI on the rising-edge of SCK.
SI must not be driven during x2 or x4 READ operation.
SO / IO1
INPUT/OUTPUT
Serial Data Output/IO1:
SO transfers data serially out of the device on the falling edge of SCK.. K.
SO must not be driven during x2 or x4 PROGRAM operation.
Vcc(6)
POWER
Vcc is the power supply for device.
Vss(6)
GROUND
Ground
NC
Unused
No Connection
Not internally connected.
Notes:
1. CS# places the device in active power mode.
2. CS# deselects the device and places SO at high impedance.
3. It means HOLD# input doesn’t terminate any READ, PROGRAM, or ERASE operation currently in progress.
4. If the BRWD bit is set to 1 and WP# is LOW, the block protect bits can’t be altered.
5. SI and SO can be triggered only when the clock is valid.
6. Connect all Vcc and Vss pins of each device to common power supply outputs. Do not leave Vcc or Vss
disconnected.
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 8
Rev. 0A
06/16/2017
3. BLOCK DIAGRAM
Figure 3.1 Functional Block Diagram
Figure 3.2 Array Organization
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 9
Rev. 0A
06/16/2017
4. Command Set
Table 4.1 Command Set
Command
Op Code
Address Bytes
Dummy Bytes
Data Bytes
Block Erase
D8h
3
0
0
Get Feature(1)
0Fh
1
0
1
Set Feature
1Fh
1
0
1
Write Disable
04h
0
0
0
Write Enable
06h
0
0
0
Program Load
02h
2
0
1 to 2112
Program Load x4(2)
32h
2
0
1 to 2112
Program Load Random Data
84h
2
0
1 to 2112
Program Load Random Data x4(2)
34h
2
0
1 to 2112
Program Execute
10h
3
0
0
Page Read
13h
3
0
0
Read from Cache
03h, 0Bh
2
1
1 to 2112
Read from Cache x2
3Bh
2
1
1 to 2112
Read from Cache x4(2)
6Bh
2
1
1 to 2112
Read ID(3)
9Fh
1
0
2
RESET
FFh
0
0
0
Notes:
1. Refer to Feature Register.
2. Command/Address is 1-bit input per clock period, data is 4-bit input/output per clock period.
3. Address is 00h to get JEDEC ID.
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 10
Rev. 0A
06/16/2017
5. ELECTRICAL CHARACTERISTICS
5.1 ABSOLUTE MAXIMUM RATINGS (1)
Storage Temperature
-65°C to +150°C
Surface Mount Lead Soldering Temperature
Standard Package
240°C 3 Seconds
Lead-free Package
260°C 3 Seconds
Input Voltage with Respect to Ground on All Pins
-0.6V to +4.6V
All I/O Voltage with Respect to Ground
-0.6V to VCC + 0.3V( < 4.6V)
VCC
-0.6V to +4.6V
Short Circuit Current
5mA
Electrostatic Discharge Voltage (Human Body Model)(2)
-2000V to +2000V
Notes:
1. Applied conditions greater than those listed in “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
2. ANSI/ESDA/JEDEC JS-001
5.2 RECOMMENDED OPERATING CONDITIONS
Part Number
IS37/38SML01G1
Operating Temperature (Industrial Grade)
-40°C to 85°C
Operating Temperature (Extended Grade)
-40°C to 105°C
Operating Temperature (Automotive Grade A1)
-40°C to 85°C
Operating Temperature (Automotive Grade A2)
-40°C to 105°C
VCC Power Supply
2.7V (VMIN) – 3.6V (VMAX); 3.3V (Typ)
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 11
Rev. 0A
06/16/2017
5.3 DC CHARACTERISTICS
(Under operating range)
Parameter
Symbol
Test Conditions
Min
Typ.
Max
Unit
Operating
Current
Page Read
with Serial Access
ICC1
fC=104MHz,
CS#=VIL, IOUT=0mA
-
16
20
mA
Program
ICC2
-
-
16
Erase
ICC3
-
-
16
Stand-by Current (TTL)
ISB1
CS#=VIH, WP#=0V/Vcc
-
-
1
Stand-by Current (CMOS)
ISB2
CS#=VCC-0.2,
WP#=0V/Vcc
-
10
50
uA
Input Leakage Current
ILI
VIN=0 to Vcc (max)
-
-
+/-10
Output Leakage Current
ILO
VOUT=0 to Vcc (max)
-
-
+/-10
Input High Voltage
VIH (1)
0.7xVCC
-
Vcc+0.3
V
Input Low Voltage, All inputs
VIL (1)
-0.3
-
0.2xVCC
Output High Voltage Level
VOH
IOH=-20 uA
0.7xVCC
-
-
Output Low Voltage Level
VOL
IOL=1mA
-
-
0.15xVCC
Notes:
1. VIL can undershoot to - 2V and VIH can overshoot to Vcc + 2V for durations of 20 ns or less.
2. Typical value are measured at Vcc=3.3V, TA=25℃. Not 100% tested.
5.4 VALID BLOCK
Description
Requirement
Minimum / Maximum number of Valid block number
1004 / 1024
Bad Block Mark
Non FFh
Mark Location
Column 2048 of page 0 and page 1
Notes:
1. The device may include initial invalid blocks when first shipped. Additional invalid blocks may develop while being used. The number
of valid blocks is presented with both cases of invalid blocks considered. Invalid blocks are defined as blocks that contain one or more
bad bits which cause status failure during program and erase operation. Do not erase or program factory-marked bad blocks.
2. The 1st block, which is placed on 00h block address, is guaranteed to be a valid block at the time of shipment and is guaranteed to
be a valid block up to 1K program/erase cycles with 1bit/512Byte ECC.
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 12
Rev. 0A
06/16/2017
5.5 AC MEASUREMENT CONDITION
Symbol
Parameter
Min
Max
Units
CL
Output Load
1 TTL GATE and CL = 15pF
pF
TR,TF
Input Rise and Fall Times
-
2.4
ns
VIN
Input Pulse Voltages
0.2Vcc to 0.8 VCC
V
5.6 AC PIN CAPACITANCE (TA = 25°C, VCC=3.3V, 1MHZ)
Symbol
Parameter
Test Condition
Min
Typ
Max
Units
CIN
Input Capacitance
VIN = 0V
-
-
8
pF
CI/O
Input /Output Capacitance
VI/O = 0V
-
-
8
pF
Note:
1. These parameters are characterized and not 100% tested.
5.7 READ/PROGRAM/ERASE PERFORMANCNE
(Industrial: TA=-40 to 85℃, Automotive, A1: TA=-40 to 85℃, Vcc=2.7V ~ 3.6V)
Parameter
Symbol
Min
Typ
Max
Unit
Average Program Time
tPROG
-
400
900
us
Number of Partial Program Cycles in the Same Page
NOP
-
-
4
cycle
Block Erase Time
tBERS
-
4
10
ms
Data Transfer from Cell to Register with Internal ECC
tRD
-
-
100
us
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 13
Rev. 0A
06/16/2017
5.8 GENERAL TIMING CHARACTERISTICS
Note:
1. For the first RESET condition after power up, tRST will be 1ms MAX.
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 14
Rev. 0A
06/16/2017
6. Operations and Timing Diagrams
6.1 READ OPERATIONS AND SERIAL OUTPUT
The command sequence is as follows:
13th (PAGE READ to cache)
0Fh (GET FEATURE command to read the status)
0Bh or 03h (READ FROM CACHE x1)/ 3Bh (x2) / 6Bh (x4)
PAGE READ command requires 24-bit address with 8 dummy and a 16-bit row address. After row
address is registered, the device starts the transfer from the main array to the cache register, and is busy
for tR time. During this time, GET FEATURE command can be issued to monitor the status of the
operation. Following a status of successful completion, READ FROM CACHE command must be issued
to read the data out of the cache.
READ FRAM CACHE command requires 16-bit address with 4 dummy bits and 12-bit column address
for the starting byte. The starting byte can be 0 to 2111, but after the end of the cache register is reached,
the data does not wrap around and SO goes to a Hi-Z state.
Figure 6.1 PAGE READ (13h) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 15
Rev. 0A
06/16/2017
Figure 6.2 READ FROM CACHE (03h or 0Bh) Timing
Figure 6.3 READ FROM CACHE x2 (3Bh) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 16
Rev. 0A
06/16/2017
Figure 6.4 READ FROM CACHE x4 (6Bh) Timing
Figure 6.5 SERIAL OUTPUT Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 17
Rev. 0A
06/16/2017
6.2 PROGRAM OPERATIONS AND SERIAL INPUT
6.2.1 Page Program
The command sequence is as follows:
06h (WRITE ENABLE)
02h (PROGRAM LOAD x1) / 32h (x4)
10h (PROGRAM EXECUTE)
0Fh (GET FEATURE command to read the status)
The page program operation sequence programs 1 byte to 2112 bytes of data within a page. WRITE
ENABLE command is not issued (WEL bit is not set), then the rest of the program sequence is ignored.
PROGRAM LOAD command requires 16-bit address with 4 dummy and a 12-bit column address, then
the data bytes to be loaded into cache register. Only four partial page programs are allowed on a single
page. If more than 2112 bytes are loaded, then those additional bytes are ignored by the cache register.
After the data is loaded, PROGRAM EXECUTE command must be issued to transfer the data from
cache register to main array, and is busy for tPROG time. PROGRAM EXECUTE command requires 24-
bit address with 8 dummy bits and a 16-bit row address.
Figure 6.6 PROGRAM LOAD (02h) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 18
Rev. 0A
06/16/2017
Figure 6.7 PROGRAM LOAD x4 (32h) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 19
Rev. 0A
06/16/2017
Figure 6.7 PROGRAM EXECUTE (10h) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 20
Rev. 0A
06/16/2017
6.2.2 Random Data Program
The command sequence is as follows:
06h (WRITE ENABLE)
84h (PROGRAM LOAD RANDOM DATA x1) / 34h (x4)
10h (PROGRAM EXECUTE)
0Fh (GET FEATURE command to read the status)
The random data program operation sequence programs or replaces data in a page with existing data.
PROGRAM LOAD RANDOM DATA command requires 16-bit address with 4 dummy bits and a 12-bit
column address. New data is loaded in the column address provided. If the random data is not sequential,
then another PROGRAM LOAD RANDOM DATA command must be issued with a new column address.
After the data is loaded, PROGRAM EXECUTE command can be issued to start the programming
operation.
Figure 6.8 PROGRAM LOAD RANDOM DATA (84h) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 21
Rev. 0A
06/16/2017
Figure 6.9 PROGRAM LOAD RANDOM DATA x4 (34h) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 22
Rev. 0A
06/16/2017
Figure 6.10 Serial Input and tCSCL Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 23
Rev. 0A
06/16/2017
6.3 INTERNAL DATA MOVE
The command sequence is as follows:
13h (PAGE READ to cache)
06h (WRITE ENABLE)
84h (PROGRAM LOAD RANDOM DATA x1) / 34h(x4); this is OPTIONAL in sequence
10h (PROGRAM EXECUTE)
0Fh (GET FEATURE command to read the status)
The INTERNAL DATA MOVE operation sequence programs or replaces data in a page with existing
data. Prior to performing an INTERNAL DATA MOVE operation, the target page content must be read
into the cache register. PAGE READ command must be followed with a WRITE ENABLE command to
change the contents of memory array.
6.4 ERASE OPERATION
The command sequence is as follows:
06h (WRITE ENABLE)
D8h (BLOCK ERASE)
0Fh (GET FEATURE command to read the status)
BLOCK ERASE command requires 24-bit address with 8 dummy bits and a 16-bit row address. If
WRITE ENABLE command is not issued (WEL bit is not set), then the rest of the erase sequence is
ignored. After the row address is registered, the control logic automatically controls the timing and the
erase-verify operations, and the device is busy for tBERS time. BLOCK ERASE command operates on one
block at a time.
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 24
Rev. 0A
06/16/2017
Figure 6.11 BLOCK ERASE (D8h) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 25
Rev. 0A
06/16/2017
6.5 READ ID
The device contains a product identification mode, initiated by writing 9Fh to the command register,
followed by an address input of 00h. Five read cycles sequentially output the manufacturer code (C8h)
and the device code and 3rd, 4th, 5th cycle ID respectively. The command register remains in Read ID
mode untial further commands are issued to it.
Figure 6.12 Read ID Timing
Part No.
1st Cycle
(Maker Code)
2nd Cycle
(Device Code)
3rd Cycle
4th Cycle
5th Cycle
IS37/38SML01G1
C8h
21h
7Fh
7Fh
7Fh
Table 6.1 ID Definition Table
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 26
Rev. 0A
06/16/2017
6.6 WP# TIMING
Figure 6.13 WP# Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 27
Rev. 0A
06/16/2017
6.7 HOLD# TIMING
HOLD# input provides a method to pause serial communication with the device but doesn’t terminate
any READ, PROGRAM, or ERASE operation currently in progress.
Hold mode starts at the falling edge of HOLD# provided SCK is also Low. If SCK is High when HOLD#
goes Low, hold mode begins after the next falling edge of SCK. Similarly, hold mode is exited at the
rising edge of HOLD# provided SCK is also Low. If SCK is High, hold mode ends after the next falling
edge of SCK.
During hold mode, SO is Hi-Z, and SCK inputs are ignored.
Figure 6.14 HOLD# Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 28
Rev. 0A
06/16/2017
6.8 POWER-UP
During power transitions, Vcc is internally monitored. 250us after Vcc has reached 2.5V, WP# is taken
High, the device automatically performs the RESET command. The first access to the SPI NAND device
can occur 1ms after WP# goes High, and then CS# can be driven Low, SCK can start, and the required
command can be issued to the device.
Figure 6.15 Power-Up and RESET Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 29
Rev. 0A
06/16/2017
7. BUS/FEATURE OPERATION AND ERROR MANAGEMENT
7.1 BUS OPERATION
SPI NAND supports two SPI modes:
(Mode 0) CPOL (clock polarity) = 0, CPHA (clock phase) = 0
(Mode 1) CPOL (clock polarity) = 1, CPHA (clock phase) = 1
Input data is latched in on the rising edge of SCK, and output data is available from the falling edge of SCK for
both modes.
When CS# is High, keep SCK at Vss (Mode 0) or Vcc (Mode 3). Do not begin toggling SCK until after CS# is
driven Low.
Figure 7.1 SPI Modes Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 30
Rev. 0A
06/16/2017
7.2 FEATURE OPERATIONS
The GET FEATURE (0Fh) and SET FEATURE (1Fh) commands are used to alter the device behavior
from the default power-on behavior. These commands use a 1-Byte feature address to determine which
feature is to be read or modified.
When a feature is set, it remains active until the device is power cycled or the feature is written to.
Unless otherwise specified in the below Table, once the device is set, it remains set, even if a RESET
(FFh) command is issued.
Table 7.1 Feature Settings
Notes:
1. 38h is the default data byte value for Block Lock Register after power-up.
2. 1-bit internal ECC for all READ and PROGRAM operations can be enabled (ECC enable = 1) or
disabled (ECC disable = 0); (10h) is the default data byte value for OTP Register after power-up.
3. WEL = 0 is the default data bit value for Status Register after power-up.
4. (20h) is the default data byte value for Output Driver Register after power-up
Table 7.2 Block Protect Bits of Block Lock Register
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 31
Rev. 0A
06/16/2017
Table 7.3 OTP Status Bits of OTP Register
Table 7.4 Driver Strength Bits of Output Driver Register
Figure 7.2 GET FEATURE (0Fh) Timing
Figure 7.2 SET FEATURE (1Fh) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 32
Rev. 0A
06/16/2017
7.3 ARRAY WRITE ENABLE / DISABLE
The WRITE ENABLE (06h) command sets the WEL bit (in status register) to 1. This required in the
following WRITE operations that change the contents of the memory array. PAGE PROGRAM, BLOCK
ERASE, and OTP PROGRAM.
Contrarily, the WRITE DISABLE (04h) command sets the WEL bit to 0. This disables PAGE PROGRAM,
BLOCK ERASE, and OTP PROGRAM.
Figure 7.3 WRITE ENABLE (06h) Timing
Figure 7.4 WRITE DISABLE (04h) Timing
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 33
Rev. 0A
06/16/2017
7.4 STATUS REGISTER
Software can read status register during the NAND device operation by issuing GET FEATURE (0Fh)
command, followed by the feature address C0h. The status register will output the status of the operation.
Refer to Table 7.1, Table 7.5 and Table 7.6.
Table 7.5 Bits of Status Register
Bit
Name
Mode
DESCRIPTION
[5:4]
ECC_S1,
ECC_S0
R
ECC_S1 and ECC_S0 are set to 00h either following a RESET, or at
the beginning of the READ. Then updated after the device completes a
valid READ operation.
ECC_S1/S0 are invalid if ECC is disabled. After power-up, ECC_S1
and ECC_S2 are set to reflect the contents of block 0, page 0.
[3]
Program Fail
R
P_Fail is set to “1” as a program failure has occurred. P_Fail = “1” will
also be set if the user attempts to program an invalid address or a
locked region.
P_Fail is set to “0” during the PROGRAM EXECUTE command
sequence or the RESET command.
[2]
Erase Fail
R
E_Fail is set to “1” as an erase failure has occurred. E_Fail = “1” will
also be set if the user attempts to erase a locked region, or if ERASE
operation fails.
E_Fail is set to “0” during the BLOCK ERASE command sequence or
the RESET command.
[1]
Write Enable
Latch
W
WEL must be set to ‘1” to indicate the current status of the write enable
latch, prior to issuing PROGRAM EXECUTE or BLOCK ERASE
command. It is set by issuing WRITE ENABLE command. WEL is
disabled (WEL=”0”) by issuing the WRITE DISABLE command.
[0]
Operation In
Progress
R
OIP is set to “1” when the device is busy; it means a PROGRAM
EXECUTE, PAGE READ, BLOCK ERASE, or RESET command is
executing. OIP is cleared to “0” as the interface is in ready state.
Table 7.6 ECC Status Bits of Status Register
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 34
Rev. 0A
06/16/2017
7.5 ERROR MANAGEMENT
7.5.1 MASK OUT INITIAL INVALID BLOCKS
Initial invalid blocks are defined as blocks that contain one or more initial invalid bits whose reliability is
not guaranteed by ISSI. The information regarding the initial invalid blocks is called the initial invalid block
information. Devices with initial invalid block(s) have the same quality level as devices with all valid blocks
and have the same AC and DC characteristics. An initial invalid block(s) does not affect the performance
of valid block(s) because it is isolated from the bit line and the common source line by a select transistor.
The system design must be able to mask out the initial invalid block(s) via address mapping.
The 1st block, which is placed on 00h block address, is guaranteed to be a valid block up to 1K
program/erase cycles with 1bit/512Byte ECC.
7.5.2 IDENTIFYING INITIAL INVALID BLOCKS
Unpredictable behavior may result from programming or erasing the defective blocks. Figure 7.5 below
illustrates an algorithm for searching factory-mapped defects, and the algorithm needs to be executed
prior to any erase or program operations.
A host controller has to scan blocks from block 0 to the last block using page read command and check
the data at the column address of 2,048 of page 0 and page 1. If the read data is not FFh, the block is
interpreted as an invalid block. Do not erase or program factory-marked bad blocks. The host controller
must be able to recognize the initial invalid block information and to create a corresponding table to
manage block replacement upon erase or program error when additional invalid blocks develop with
Flash memory usage.
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 35
Rev. 0A
06/16/2017
Check “FFh” at column address 2048
of the first page and the second page
For (i=0; i<Num_of_LUs; i++)
{
For (j=0; j<Blocks_Per_LU; j++)
{
Defect_Block_Found=False;
Read_Page(lu=i, block=j, page=0);
If (Data[coloumn=First_Byte_of_Spare_Area]!=FFh) Defect_Block_Found=True;
Read_Page(lu=i, block=j, 1);
If (Data[coloumn=First_Byte_of_Spare_Area]!=FFh) Defect_Block_Found=True;
If (Defect_Block_Found) Mark_Block_as_Defective(lu=i, block=j);
}
}
Figure 7.5 Algorithm for Bad Block Scanning
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 36
Rev. 0A
06/16/2017
7.5.3 BLOCK REPLACEMENT
Within its lifetime, number of invalid blocks may increase with NAND Flash memory. Refer to the
qualification report for the actual data. The following possible failure modes should be considered to
implement a highly reliable system. In the case of failure after ERASE or PROGRAM in status register,
block replacement should be done. Because PROGRAM status fail during a page program does not
affect the data of other pages in the same block, block replacement can be executed with a page-sized
buffer by finding an erased empty block and reprogramming the current target data and copying the rest
of the replaced block.
In case of READ, ECC must be employed. To improve the efficiency of memory space, it is
recommended that read or verification failure due to single bit error be reclaimed by ECC without any
block replacement. The additional block failure rate does not include those reclaimed blocks.
Figure 7.6 Blcok Replacement
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 37
Rev. 0A
06/16/2017
7.5.4 ECC PROTECTION
ECC is enabled after device power-up, so the default PROGRAM and READ commands operate with
internal ECC in the active state.
During a PROGRAM operation, the device calculates an ECC code on the 2KB page in the cache
register, before the page is written to the NAND Flash array. The ECC code is stored in the spare area
of the page in array.
During a READ operation, the page data is read from the array to the cache register, where ECC code
is calculated and compared with the ECC code value read from the array. If a single-bit data error is
discovered, the error is corrected in the cache register and only the corrected data is on the output pins.
Table 7.7 ECC Protection
Notes:
1. The user area must be programmed within a single partial-page programming operations so NAND
Flash device can calculate the proper ECC bytes.
2. When internal ECC is enabled, these areas are prohibited to be programming.
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 38
Rev. 0A
06/16/2017
7.6 ADDRESSING FOR PROGRAMMING OPERATION
Within a block, the page must be programmed consecutively from the LSB (Least Significant Bit) page
of the block to MSB (Most Significant Bit) pages of the block. Random page address programming is
prohibited. In this case, the definition of LSB page is the LSB among the pages to be programmed.
Therefore, LSB page doesn’t need to be page 0.
Figure 7.7 Addressing for Program Operation
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 39
Rev. 0A
06/16/2017
8. PACKAGE TYPE INFORMATION
8.1 16-LEAD PLASTIC SMALL OUTLINE PACKAGE (300 MILS BODY WIDTH) (M)
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 40
Rev. 0A
06/16/2017
8.2 8-CONTACT ULTRA-THIN SMALL OUTLINE NO-LEAD (WSON) PACKAGE 8X6MM (L)
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 41
Rev. 0A
06/16/2017
9. ORDERING INFORMATION – Valid Part Numbers
IS 37 SM L 01G 1 - M L I
TEMPERATURE RANGE
I = Industrial (-40°C to +85°C)
E = Industrial (-40°C to +105°C)
A1 = Automotive Grade (-40°C to +85°C)
A2 = Automotive Grade (-40°C to +105°C)
PACKAGING CONTENT
L = RoHS compliant
PACKAGE Type
L = 8-contact WSON (8x6mm)
M = 16-pin SOIC 300mil
Die Revision
Blank = First Gen.
ECC Requirement
1 = 1-bit ECC
Density
01G = 1 Gigabit
VDD
L = 3.3V
Technology
SM = SPI-NAND (SLC)
Product Family
37 = SPI-NAND
38 = Automotive SPI-NAND
BASE PART NUMBER
IS = Integrated Silicon Solution Inc.
Note:
1. Call Factory for other package options available.
IS37/38SML01G1
Integrated Silicon Solution, Inc.- www.issi.com 42
Rev. 0A
06/16/2017
VDD
Density
Bus
Temp. Grade
Order Part Number
Package
3.3V
1Gb
X8
Industrial
IS37SML01G1-MLI
16-pin SOIC 300mil
IS37SML01G1-LLI
8-contact WSON 8x6mm
Automotive (A1)
IS38SML01G1-MLA1
16-pin SOIC 300mil
IS38SML01G1-LLA1
8-contact WSON 8x6mm
Extended
IS37SML01G1-MLE
16-pin SOIC 300mil
IS37SML01G1-LLE
8-contact WSON 8x6mm
Automotive (A2)
IS38SML01G1-MLA2
16-pin SOIC 300mil
IS38SML01G1-LLA2
8-contact WSON 8x6mm
