Technical Data 4084 Effective September 2015
Supersedes November 2009
Description
• Low profile shielded drum core
• Compact footprint utilizes less board space
• Inductance Range from 1.0μH to 1,000μH
• Current range from 0.083 to 2.94 amps
• 3.2 x 3.2mm footprint surface mount package
in a 1.8mm height
• Ferrite core material
• Halogen free, lead free, RoHS compliant
Applications
• Mobile/smart phones
• Tablets/e-readers
• Media players
• Digital cameras
• Small LED driver and LCD displays
• Handheld/mobile equipment
Environmental Data
• Storage temperature range (Component):
-40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient + self-temperature rise)
• Solder reflow temperature: J-STD-020D
compliant
Pb
HALOGEN
HF
FREE
SD3118
Low profile power inductors
2
Technical Data 4084
Effective September 2015
SD3118
Low profile power inductors
www.eaton.com/elx
Product Specifications
Part Number6
OCL1
(μH)
Part marking
designator
Irms
2
(amps)
Isat
3
(amps)
DCR (Ω) typical
@ +20°C K-factor4
SD3118-1R0-R 1.04±30% A 2.01 3.07 0.041 84
SD3118-1R5-R 1.44±30% B 1.81 2.42 0.051 68
SD3118-2R2-R 2.12±30% C 1.50 2.00 0.074 57
SD3118-3R3-R 3.36±30% D 1.22 1.59 0.11 56
SD3118-4R7-R 4.90±30% E 1.02 1.31 0.16 39
SD3118-6R8-R 6.72±30% F 0.85 1.12 0.23 32
SD3118- 8R2-R 8.10±30% G 0.81 1.02 0.26 29
SD3118- 100-R 10.4±30% H 0.75 0.90 0.30 26
SD3118-150-R 14.9±30% I 0.62 0.75 0.44 21
SD3118-220-R 22.5±30% J 0.50 0.61 0.68 18
SD3118-330-R 33.1±30% K 0.41 0.51 0.99 14
SD3118-470-R 47.5±30% L 0.37 0.42 1.2 12
SD3118-221-R 222±20% M 0.182 0.177 4.8 6
SD3118-331-R 330±20% N 0.146 0.145 7.4 5
SD3118-471-R 470±20% O 0.130 0.122 9.2 4
SD3118-681-R 680±20% P 0.107 0.101 14 3
SD3118-102-R 999±20% Q 0.087 0.083 21 3
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, @ +25°C
2. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating
conditions verified in the end application.
3. Isat: Peak current for approximately 30% rolloff @ +20°C
4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (mTesla), K: (K-factor from table),
L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps).
5. Part Number Definition: SD3118-xxx-R
SD3118 = Product code and size
xxx= Inductance value in uH, R= decimal point, if no R is present then last character equals number of zeros
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: dot for pin 1 indicator (orientation purposes only)
xxx = 3 digit marking (first digit indicates inductance value per letter in
Part marking designator, second digit is bi-weekly date code, third digit is
last digit of year produced)
All soldering surfaces to be coplanar within 0.10 millimeters
PCB tolerances are ±0.1 millimeters unless stated otherwise
Do not route traces or vias underneath the inductor
Recommended Pad Layout
Schematic
1
2
0.8
1.70
2.40
1.5 typ
3.9
max
1.8
max
Pin #1 indicator
3.2 max3.2 max
3
Technical Data 4084
Effective September 2015
SD3118
Low profile power inductors
www.eaton.com/elx
Packaging information (mm)
Supplied in tape and reel packaging, 4,100 parts per 13” diameter reel
Temperature rise vs. total loss
0
10
20
30
40
50
60
70
80
90
0
Total Loss(W)
0.05 0.10.15 0.20.25 0.30.35 0.
40.45
Temperature Rise (°C)
A1
Ao
4.00
Ko
SECTION A-A
Bo
2
1
10.2512.0
±0.3
8.0
B1
A
A
Ao = 4.0mm
A1 = 0.93mm
Bo = 4.20mm
B1 = 1.25mm
Ko = 2.00mm
2.00
3.4
Direction of feed
3.4
5.50
1.75
1.2 Dia.
min.
1.5 Dia.
+0.1/-0.0
4
Technical Data 4084
Effective September 2015
SD3118
Low profile power inductors
www.eaton.com/elx
Core loss vs. Bp-p
Inductance characteristics
1MHz
500kHz
300kHz
200kHz
100kHz
50kHz
B
p-p
(mT)
Core Loss (W)
100
1000
1010
10
1
0.1
0.01
0.001
0.0001
0.00001
% of L initial
0%
10%
20%
0% 10%20% 30%40% 50%60% 70%80% 90%100%110%120%1
30% 140%
85°C
25°C
-40°C
30%
40%
50%
60%
70%
80%
90%
100%
110%
120%
OCL vs. l
sat
% of lsat
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 4084 BU-MC15028
September 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Technical Data 4084
Effective September 2015
SD3118
Low profile power inductors
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
