© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 1
One world. One KEMET
Benets
• -55°C to +125°C operating temperature range
• Pb-Free and RoHS Compliant
• EIA 0805, 1206, 1210, 1812, 1825, 2220, and 2225 case sizes
• DC voltage rating of 250 V
• Capacitance offerings ranging from 1,000 pF to 6.8 μF
• Available capacitance tolerances of ±10% and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination nish that allows for
excellent solderability
• SnPb termination nish option available upon request (5%
minimum)
• Flexible termination option available upon request
Overview
KEMET’s 250 V DC Tip and Ring MLCCs in X7R dielectric are
designed and rated for telecommunication ringer circuits where
the capacitor is used to block -48 V to -52 V DC of line voltage
and pass a 16 – 25 Hz AC signal pulse of 70 VRMs to 90 VRMs.
Serving as an excellent replacement for high voltage leaded
lm devices, these smaller surface mount technology footprints
save valuable board space which is critical when creating new
designs.
KEMET Tip and Ring capacitors feature a 125°C maximum
operating temperature and are considered “temperature
stable.” The Electronics Components, Assemblies & Materials
Association (EIA) characterizes X7R dielectric as a Class II
material. Components of this classication are xed, ceramic
dielectric capacitors suited for bypass and decoupling applications
or for frequency discriminating circuits where Q and stability
of capacitance characteristics are not critical. X7R dielectric
exhibits a predictable change in capacitance with respect to time
and voltage and boasts a minimal change in capacitance with
reference to ambient temperature. Capacitance change is limited
to ±15% from -55°C to +125°C.
These devices are able to withstand today’s higher lead-free reow
processing temperatures and offer superior high frequency ltering
characteristics and low ESR.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom “Tip and Ring” X7R Dielectric, 250 VDC
(Commercial Grade)
Ordering Information
C1825 C105 K A R A CTU
Ceramic Case Size
(L" x W")
Specication/
Series
Capacitance
Code (pF)
Capacitance
Tolerance Voltage Dielectric Failure Rate/
Design Termination Finish1Packaging/Grade
(C-Spec)2
0805
1206
1210
1812
1825
2220
2225
C = Standard
X = Flexible
Termination
2 Signicant Digits +
Number of Zeros
J = ±5%
K = ±10%
M = ±20%
A = 250 V R = X7R A = N/A C = 100% Matte Sn
L = SnPb (5%
minimum)
Blank = Bulk
TU = 7" Reel
Unmarked
TM = 7" Reel
Marked
1 Additional termination nish options may be available. Contact KEMET for details.
2 Additional reeling or packaging options may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Dimensions – Millimeters (Inches) – Standard Termination
Ceramic Surface Mount
WL
TB
S
100% Tin or SnPb Plate
Nickel Plate
Conductive Metalization
Electrodes
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
See Table 2 for
Thickness
0.50 (0.02) ± 0.25 (.010) 0.75 (.030) Solder Wave or
Solder Reow
1206 3216 3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
N/A
1210 3225 3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
Solder Reow Only
1812 4532 4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012) 0.60 (.024) ± 0.35 (.014)
1825 4564 4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
2220 5650 5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
2225 5664 5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
Dimensions – Millimeters (Inches) – Flexible Termination
Ceramic Surface Mount
WL
TB
S
EIA
Size
Code
Metric
Size
Code
L Length W Width T
Thickness B Bandwidth
S
Separation
Minimum
Mounting
Technique
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
See Table 2 for
Thickness
0.50 (0.02) ± 0.25 (.010) 0.75 (.030) Solder Wave or
Solder Reow
1206 3216 3.30 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008) 0.60 (.024) ± 0.25 (.010)
N/A
1210 3225 3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008) 0.60 (.024) ± 0.25 (.010)
Solder Reow Only
1812 4532 4.50 (.178) ± 0.40 (.016) 3.20 (.126) ± 0.30 (.012) 0.70 (.028) ± 0.35 (.014)
1825 4564 4.60 (.181) ± 0.40 (.016) 6.40 (.252) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014)
2220 5650 5.90 (.232) ± 0.75 (.030) 5.00 (.197) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014)
2225 5664 5.90 (.232) ± 0.75 (.030) 6.40 (.248) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014)
Applications
Typical applications include telecommunication ringing circuits, switch mode power supply snubber circuits, high voltage DC blocking
and high voltage coupling. Markets include telephone lines, analog and digital modems, facsimile machines, wireless base stations,
cable and digital video recording set-top boxes, satellite dishes, high voltage power supply, DC/DC converters, and Ethernet, POS and
ATM hardware.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Qualication/Certication
Commercial Grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Environmental Compliance
Pb-Free and RoHS Compliant (excluding SnPb termination nish option).
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range -55°C to +125°C
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15%
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
Dielectric Withstanding Voltage (DWV) 250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Dissipation Factor (DF) Maximum Limit @ 25ºC 5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)
Insulation Resistance (IR) Limit @ 25°C
See Insulation Resistance Limit Table
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance >10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage Capacitance
Value
Dissipation Factor
(Maximum %) Capacitance
Shift
Insulation
Resistance
X7R
> 25
All
3.0
±20% 10% of Initial Limit16/25 5.0
< 16 7.5
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Insulation Resistance Limit Table
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
0201 N/A ALL
0402 < 0.012 µF ≥ 0.012 µF
0603 < 0.047 µF ≥ 0.047 µF
0805 < 0.047 µF ≥ 0.047 µF
1206 < 0.22 µF ≥ 0.22 µF
1210 < 0.39 µF ≥ 0.39 µF
1808 ALL N/A
1812 < 2.2 µF ≥ 2.2 µF
1825 ALL N/A
2220 < 10 µF ≥ 10 µF
2225 ALL N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Table 1 – Capacitance Range/Selection Waterfall (0805 – 2225 Case Sizes)
Capacitance Capacitance
Code
Series C0805 C1206 C1210 C1812 C1825 C2220 C2225
Voltage Code AAAAAAA
Voltage DC 250 250 250 250 250 250 250
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
180 pF 181 J K M DC
220 pF 221 J K M DC
270 pF 271 J K M DC
330 pF 331 J K M DC
390 pF 391 J K M DC
470 pF 471 J K M DC
560 pF 561 J K M DC
680 pF 681 J K M DC
820 pF 821 J K M DC
1000 pF 102 J K M DC EB
1200 pF 122 J K M DC EB
1500 pF 152 J K M DC EB
1800 pF 182 J K M DC EB
2200 pF 222 J K M DC EB FB
2700 pF 272 J K M DC EB FB
3300 pF 332 J K M DC EB FB
3900 pF 392 J K M DC EB FB
4700 pF 472 J K M DC EB FB
5600 pF 562 J K M DC EB FB
6800 pF 682 J K M DC EB FB GB
8200 pF 822 J K M DC EB FB GB
10000 pF 103 J K M DC EB FB GB
12000 pF 123 J K M DC EB FB GB
15000 pF 153 J K M DC EB FB GB
18000 pF 183 J K M DC EB FB GB
22000 pF 223 J K M DC EB FB GB HB
27000 pF 273 J K M EB FB GB HB
33000 pF 333 J K M EB FB GB HB
39000 pF 393 J K M EB FB GB HB
47000 pF 473 J K M ED FC GB HB
56000 pF 563 J K M ED FC GB HB
68000 pF 683 J K M ED FC GB HB
82000 pF 823 J K M ED FF GB HB JC
0.1 µF 104 J K M EM FG GB HB JC KC
0.12 µF 124 J K M GB HB JC KC
0.15 µF 154 J K M GE HB JC KC
0.18 µF 184 J K M GG HB JC KC
0.22 µF 224 J K M GG HB JC KC
0.27 µF 274 J K M GG HB JC KC
0.33 µF 334 J K M GG HB JC KC
0.39 µF 394 J K M GG HD JC KC
0.47 µF 474 J K M GJ HD JC KD
0.56 µF 564 J K M HD JD KD
0.68 µF 684 J K M HD JD KD
0.82 µF 824 J K M HF JF KE
1 µF 105 J K M HF JF KE
1.2 µF 125 J K M KE
Capacitance Capacitance
Code
Voltage DC 250 250 250 250 250 250 250
Voltage Code AAAAAAA
Series C0805 C1206 C1210 C1812 C1825 C2220 C2225
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Table 2 – Chip Thickness/Packaging Quantities
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
DC
0.78 ± 0.10
4,000
10,000
0
0
EB
0.78 ± 0.10
4,000
10,000
4,000
10,000
ED
1.00 ± 0.10
0
0
2,500
10,000
EM
1.25 ± 0.15
0
0
2,500
10,000
FB
0.78 ± 0.10
0
0
4,000
10,000
FC
0.90 ± 0.10
0
0
4,000
10,000
FF
1.10 ± 0.10
0
0
2,500
10,000
FG
1.25 ± 0.15
0
0
2,500
10,000
GB
1.00 ± 0.10
0
0
1,000
4,000
GE
1.30 ± 0.10
0
0
1,000
4,000
GG
1.55 ± 0.10
0
0
1,000
4,000
GJ
1.70 ± 0.15
0
0
1,000
4,000
HB
1.10 ± 0.15
0
0
1,000
4,000
HD
1.30 ± 0.15
0
0
1,000
4,000
HF
1.50 ± 0.15
0
0
1,000
4,000
JC
1.10 ± 0.15
0
0
1,000
4,000
JD
1.30 ± 0.15
0
0
1,000
4,000
JF
1.50 ± 0.15
0
0
1,000
4,000
KC
1.10 ± 0.15
0
0
1,000
4,000
KD
1.30 ± 0.15
0
0
1,000
4,000
KE
1.40 ± 0.15
0
0
1,000
4,000
Thickness
Code Case
Size Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity Plastic Quantity
Package quantity based on nished chip thickness specications.
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
CY X V1 V2 CY X V1 V2 CY X V1 V2
01005 0402 0.33 0.46 0.43 1.60 0.90 0.28 0.36 0.33 1.30 0.70 0.23 0.26 0.23 1.00 0.50
0201 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.3 0 2.50 1.30 6.70 6.50 7.0 0
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
CY X V1 V2 CY X V1 V2 CY X V1 V2
0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.80 0.95 1.35 2.80 1.70
1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00
1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90
1808 4520 2.25 1.85 2.30 7.40 3.30 2.15 1.65 2.20 6.50 2.70 2.05 1.45 2.10 5.80 2.40
1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70
1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00
2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60
2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7. 20 7.0 0
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reow only
Recommended Soldering Prole:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnication 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling JESD22 Method JA–104 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Biased Humidity MIL–STD–202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
Moisture Resistance MIL–STD–202 Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
Thermal Shock MIL–STD–202 Method 107
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature uctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Construction – Standard Termination
Reference Item Material
ATermination
System
Finish 100% Matte Sn SnPb (5% min)
B Barrier Layer Ni
D Base Metal Cu
EInner Electrode Ni
FDielectric Material BaTiO
3
Note: Image is exaggerated in order to clearly identify all components of construction.
Construction – Flexible Termination
Reference Item Material
A
Termination
System
Finish
100% Matte Sn
SnPb (5% min)
B Barrier Layer Ni
CEpoxy Layer Ag
D Base Metal Cu
EInner Electrode Ni
FDielectric Material BaTiO
3
Note: Image is exaggerated in order to clearly identify all components of construction.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identi er(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Laser marking option is not available on:
• C0G and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
_
KA8
Capacitance (pF) For Various Alpha / Numeral Identi ers
Alpha
Character
Numeral
9 0 1 2 3 4 5 6 7 8
Capacitance (pF)
A 0.1 1 0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000
B 0.11 1.1 11 110 1,10 0 11,000 110,000 1,100,000 11,000,000 110,000,000
C 0.12 1 2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000
D 0.13 1 3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000
E 0.15 1 5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000
F 0.16 1 6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000
G 0.18 1 8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000
H 0.2 2 0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000
J 0.22 2 2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000
K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000
L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000
M 0.3 3 0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000
N 0.33 3 3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000
P 0.36 3 6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000
Q 0.39 3 9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000
R 0.43 4 3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000
S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000
T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000
U 0.56 5 6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000
V 0.62 6 2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000
W 0.68 6 8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000
X 0.75 7 5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000
Y 0.82 8 2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000
Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000
a 0.25 2 5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000
b 0.35 3 5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000
d 0.4 4 0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000
e 0.45 4 5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000
f 0.5 5 0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000
m 0.6 6 0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000
n 0.7 7 0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000
t 0.8 8 0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000
y 0.9 9 0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
Table 5 – Carrier Tape Con guration – Embossed Plastic & Punched Paper (mm)
EIA Case Size Tape Size (W)* Lead Space (P
1
)*
01005 – 0402 8 2
0603 – 1210 8 4
1805 – 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance speci cations.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5 +0.10/-0.0 (0.059
+0.004/-0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05 (0.079
±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm 1.5
(0.059)
30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm) 4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10 (0.315
±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm) 12.1
(0.476)
14.25
(0.561)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10 (0.315
±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P
1
ØDo Po
P
2
E
1
F
E
2
W
G
A
0
B
0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T
1
T
1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0E1P0P2T1 Maximum G Minimum
R Reference
Note 2
8 mm 1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suf cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier Punched
Carrier
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12 mm
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16 mm
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm Minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
Minimum Leader
400 mm Minimum
Figure 8 – Maximum Camber
Carrier Tape Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
KEMET Corporation
World Headquarters
2835 KEMET Way
Simpsonville, SC 29681
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Corporate Of ces
Fort Lauderdale, FL
Tel: 954-766-2800
North America
Southeast
Lake Mary, FL
Tel: 407-855-8886
Northeast
Wilmington, MA
Tel: 978-658-1663
Central
Novi, MI
Tel: 248-994-1030
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Europe
Southern Europe
Paris, France
Tel: 33-1-4646-1006
Sasso Marconi, Italy
Tel: 39-051-939111
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Kamen, Germany
Tel: 49-2307-438110
Northern Europe
Bishop’s Stortford, United Kingdom
Tel: 44-1279-460122
Espoo, Finland
Tel: 358-9-5406-5000
Asia
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Shenzhen, China
Tel: 86-755-2518-1306
Beijing, China
Tel: 86-10-5829-1711
Shanghai, China
Tel: 86-21-6447-0707
Taipei, Taiwan
Tel: 886-2-27528585
Southeast Asia
Singapore
Tel: 65-6586-1900
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
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Disclaimer
All product speci cations, statements, information and data (collectively, the “Information”) are subject to change without notice.
All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we
speci cally disclaim – any warranty concerning suitability for a speci c customer application or use. This Information is intended for use only by customers who have the requisite
experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the
use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.
Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or
redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1011_X7R_TIP_RING_SMD • 10/15/2012 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Digitally signed by Jeannette Calvo
DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing
Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com
Date: 2012.10.16 12:15:11 -04'00'