PZU8.2B3,115 - NXP Semiconductors / Philips Semiconductors

1. Product profile

1.1 General description

General-purpose Zener diodes in a SOD323F (SC-90) very small and fla t lead S urfa c e

Mounted Device (SMD) plastic package.

1.2 Features

Total power dissipation: ≤310 mW

Tolerance series: B: approximately ±5 %; B1, B2, B3: sequential, approximately ±2%

Small plastic package suitable for surface mounted design

Wide working volta ge range: nominal 2.4 V to 36 V

1.3 Applications

General regulation functions

1.4 Quick reference data

[1] Pulse test: tp≤300 μs; δ≤0.02

[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.

PZUxB series

Single Zener diodes in a SOD323F package

Rev. 02 — 15 November 2009 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF=100mA [1] --1.1V

Ptot total power dissipation Tamb ≤25 °C[2] --310mW

[3] --550mW

Product data sheet Rev. 02 — 15 November 2009 2 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F pack age

2. Pinning information

[1] The marking bar indicates the cathode

3. Ordering information

[1] The series consists of 97 types with nominal working voltages from 2.4 V to 36 V.

4. Marking

Table 2. Pinning

Pin Description Simplified outline Symbol

1 cathode [1]

2 anode 21

sym06

Table 3. Ordering information

Type number Package

Name Description Version

PZU2.4B to

PZU36B[1] SC-90 plastic surface mounted package; 2 leads SOD323F

Table 4. Marking codes

Type number Marking code Type number Marking code

BB1 B2 B3 BB1 B2 B3

PZU2.4 G3 - - - PZU10 GJ FH HF KB

PZU2.7 G4 F3 H1 - PZU11 GK FJ HG KC

PZU3.0 G5 F4 H2 - PZU12 GL FK HH KD

PZU3.3 G6 F5 H3 - PZU13 GM FL HJ KE

PZU3.6 G7F6H4-PZU14 --HK-

PZU3.9 G8 F7 H5 - PZU15 GN FM HL KF

PZU4.3 G9 F8 H6 HS PZU16 GP FN HM KG

PZU4.7 GA F9 H7 HT PZU18 GQ FP HN KH

PZU5.1 GB FA H8 HU PZU20 GR FQ HP KJ

PZU5.6 GC FB H9 HV PZU22 GS FR HQ KK

PZU6.2 GD FC HA HW PZU24 GT FS HR KL

PZU6.8 GE FD HB HX PZU27 GU - - -

PZU7.5 GF FE HC HY PZU30 GV - - -

PZU8.2 GG FF HD HZ PZU33 GW - - -

PZU9.1 GH FG HE KA PZU36 GX - - -

Product data sheet Rev. 02 — 15 November 2009 3 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

5. Limiting values

[1] tp=100μs; square wave; Tj=25°C prior to surge

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.

[3] Soldering point of cathode tab

7. Characteristics

[1] Pulse test: tp≤300 μs; δ≤0.02

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

IFforward current - 200 mA

IZSM non-repetitive peak reverse

current - see Table 8

and 9

PZSM non-repetitive peak reverse

power dissipation [1] -40W

Ptot total power dissipation Tamb ≤25 °C[2] - 310 mW

[3] - 550 mW

Tjjunction temperature - 150 °C

Tamb ambient temperature −65 +150 °C

Tstg storage temperature −65 +150 °C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) ther mal resistance from

junction to ambient in free air [1] --400K/W

[2] --230K/W

Rth(j-sp) ther mal resistance from

junction to solder point [3] --55K/W

Table 7. Characteristics

Tj=25

C unless otherwise specified

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF=10mA [1] --0.9V

IF=100mA [1] --1.1V

Product data sheet Rev. 02 — 15 November 2009 4 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

[1] f = 1 MHz; VR=0V

[2] tp= 100 μs; square wave; Tj=25°C prior to surge

Table 8. Characteristics per type; PZU2.4B to PZU5.6B3

Tj=25

C unless otherwise specified

PZU

xxx Sel Working

voltage

VZ(V);

IZ=5mA

Maximum differential

resistance

rdif (Ω)

Reverse

current

IR(μA)

Temperature

coefficient

SZ(mV/K);

IZ=5mA

Diode

capacitance

Cd(pF)[1]

Non-repetitive peak

reverse current

IZSM (A)[2]

Min Max IZ=0.5mA IZ=5mA Max VR(V) Typ Max Max

2.4 B 2.3 2.6 1000 100 50 1 −1.6 450 8

2.7 B 2.5 2.9 1000 100 20 1 −2.0 440 8

B1 2.5 2.75

B2 2.65 2.9

3.0 B 2.80 3.20 1000 95 10 1 −2.1 425 8

B1 2.80 3.05

B2 2.95 3.20

3.3 B 3.10 3.50 1000 95 5 1 −2.4 410 8

B1 3.10 3.35

B2 3.25 3.50

3.6 B 3.40 3.80 1000 90 5 1 −2.4 390 8

B1 3.40 3.65

B2 3.55 3.80

3.9 B 3.70 4.10 1000 90 3 1 −2.5 370 8

B1 3.70 3.97

B2 3.87 4.10

4.3 B 4.01 4.48 1000 90 3 1 −2.5 350 8

B1 4.01 4.21

B2 4.15 4.34

B3 4.28 4.48

4.7 B 4.42 4.90 800 80 2 1 −1.4 325 8

B1 4.42 4.61

B2 4.55 4.75

B3 4.69 4.90

5.1 B 4.84 5.37 250 60 2 1.5 0.3 300 5.5

B1 4.84 5.04

B2 4.98 5.20

B3 5.14 5.37

5.6 B 5.31 5.92 100 40 1 2.5 1.9 275 5.5

B1 5.31 5.55

B2 5.49 5.73

B3 5.67 5.92

Product data sheet Rev. 02 — 15 November 2009 5 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

Table 9. Characteristics per type; PZU6.2B to PZU36B

Tj=25

C unless otherwise specified

PZU

xxx Sel Working

voltage

VZ(V);

IZ=5mA

Maximum differential

resistance

rdif (Ω)

Reverse

current

IR(nA)

Temperature

coefficient

SZ(mV/K);

IZ=5mA

Diode

capacitance

Cd(pF)[1]

Non-repetitive peak

reverse current

IZSM (A)[2]

Min Max IZ=0.5mA IZ=5mA Max VR(V) Typ Max Max

6.2 B 5.86 6.53 80 30 500 3 2.7 250 5.5

B1 5.86 6.12

B2 6.06 6.33

B3 6.26 6.53

6.8 B 6.47 7.14 60 20 500 3.5 3.4 215 5.5

B1 6.47 6.73

B2 6.65 6.93

B3 6.86 7.14

7.5 B 7.06 7.84 60 10 500 4 4.0 170 3.5

B1 7.06 7.36

B2 7.28 7.60

B3 7.52 7.84

8.2 B 7.76 8.64 60 10 500 5 4.6 150 3.5

B1 7.76 8.10

B2 8.02 8.36

B3 8.28 8.64

9.1 B 8.56 9.55 60 10 500 6 5.5 120 3.5

B1 8.56 8.93

B2 8.85 9.23

B3 9.15 9.55

10 B 9.45 10.55 60 10 100 7 6.4 110 3.5

B1 9.45 9.87

B2 9.77 10.21

B3 10.11 10.55

11 B 10.44 11.56 60 10 100 8 7.4 108 3

B1 10.44 10.88

B2 10.76 11.22

B3 11.10 11.56

12 B 11.42 12.60 80 10 100 9 8.4 105 3

B1 11.42 11.90

B2 11.74 12.24

B3 12.08 12.60

13 B 12.47 13.96 80 10 100 10 9.4 103 2.5

B1 12.47 13.03

B2 12.91 13.49

B3 13.37 13.96

14 B2 13.70 14.30 80 10 100 11 10.4 101 2

Product data sheet Rev. 02 — 15 November 2009 6 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

[1] f = 1 MHz; VR=0V

[2] tp= 100 μs; square wave; Tj=25°C prior to surge

15 B 13.84 15.52 80 15 50 11 11.4 99 2

B1 13.84 14.46

B2 14.34 14.98

B3 14.85 15.52

16 B 15.37 17.09 80 20 50 12 12.4 97 1.5

B1 15.37 16.01

B2 15.85 16.51

B3 16.35 17.09

18 B 16.94 19.03 80 20 50 13 14.4 93 1.5

B1 16.94 17.70

B2 17.56 18.35

B3 18.21 19.03

20 B 18.86 21.08 100 20 50 15 16.4 88 1.5

B1 18.86 19.70

B2 19.52 20.39

B3 20.21 21.08

22 B 20.88 23.17 100 25 50 17 18.4 84 1.3

B1 20.88 21.77

B2 21.54 22.47

B3 22.23 23.17

24 B 22.93 25.57 120 30 50 19 20.4 80 1.3

B1 22.93 23.96

B2 23.72 24.78

B3 24.54 25.57

27 B 25.1 28.9 150 40 50 21 23.4 73 1

30 B 28 32 200 40 50 23 26.6 66 1

33 B 31 35 250 40 50 25 29.7 60 0.9

36 B 34 38 300 60 50 27 33.0 59 0.8

Table 9. Characteristics per type; PZU6.2B to PZU36B …continued

Tj=25

C unless otherwise specified

PZU

xxx Sel Working

voltage

VZ(V);

IZ=5mA

Maximum differential

resistance

rdif (Ω)

Reverse

current

IR(nA)

Temperature

coefficient

SZ(mV/K);

IZ=5mA

Diode

capacitance

Cd(pF)[1]

Non-repetitive peak

reverse current

IZSM (A)[2]

Min Max IZ=0.5mA IZ=5mA Max VR(V) Typ Max Max

Product data sheet Rev. 02 — 15 November 2009 7 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

Tj=25°C PZU2.4B to PZU4.3B

Tj=25°C to 150 °C

Fig 1. Forward current as a function of forward

voltage; typical values Fig 2. Temperature coefficient as a function of

working current; typical va lues

PZU4.7B to PZU12B

Tj=25°C to 150 °CFR4 PCB, standard footprint

Fig 3. Temperature coefficient as a function of

working current; typica l values Fig 4. Power derating curve

VF (V)

0.6 10.8

mbg781

100

200

300

(mA)

060

−2

−3

−1

mgl273

20 40 IZ (mA)

(mV/K) 4.3

3.9

3.6

3.3

3.0

2.4

2.7

02016

−5

mgl274

4812 I

(mA)

(mV/K)

4.7

9.1

8.2

7.5

6.8 6.2

5.6

5.1

Tamb (°C)

0 20015050 100

006aaa687

200

100

300

400

Ptot

(mW)

Product data sheet Rev. 02 — 15 November 2009 8 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

8. Package outline

9. Packing information

[1] For further information and the availability of packing methods, see Section 14.

10. Soldering

Fig 5. Package outline SOD323F (SC-90)

04-09-13Dimensions in mm

0.80

0.65

0.25

0.10

0.5

0.3

2.7

2.3

1.8

1.6

0.40

0.25

1.35

1.15

Table 10. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

3000 10000

PZU2.4B to

PZU36B SOD323F 4 mm pitch, 8 mm tape and reel -115 -135

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 6. Reflow soldering footprint SOD323F (SC-90)

001aab169

1.65

0.50

(2×)

2.10

1.60

2.80

0.60

3.05

0.500.95

solder lands

solder resist

occupied area

solder paste

Product data sheet Rev. 02 — 15 November 2009 9 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

11. Mounting

PCB thickness = 1.6 mm PCB thickness = 1.6 mm

Fig 7. FR4 PCB, standard footprint Fig 8. FR4 PCB, mounting pad for

cathode 1cm2

006aaa487

Dimensions in mm

0.6

0.5

0.6

43.4

0.6

006aaa48

0.6

0.5

43.4

Dimensions in mm

Product data sheet Rev. 02 — 15 November 2009 10 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

12. Revision history

Table 11. Revision history

Document ID Release date Data sheet statu s Change notice Supersedes

PZUXB_SER_2 20091115 Product data sheet - PZUXB_SER_1

Modifications: •This data sheet was changed to reflec t the new company name NXP Semiconductors,

including new legal definitions and disclaimers. No changes were made to the technica l

content.

PZUXB_SER_1 20060307 Product data sheet - -

Product data sheet Rev. 02 — 15 November 2009 11 of 12

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warrant ies as to t he accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short dat a sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre va il.

13.3 Disclaimers

General — In formation in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give an y represent ations or

warranties, expressed or impli ed, as to the accuracy or completeness of such

information and shall have no liability for th e co nsequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are no t designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applic ations that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ra tings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other co nditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may af fect device reliability .

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/profile/terms, including those pertaini ng to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conflict between inf ormation in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Not hing in this document may be interpret ed or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respective ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors PZUxB series

Single Zener diodes in a SOD323F package

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of rele ase: 15 Novem ber 2009

Document identifier: PZUXB_SER_2

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

9 Packing information . . . . . . . . . . . . . . . . . . . . . 8

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Contact information. . . . . . . . . . . . . . . . . . . . . 11

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12