Part No. Page 1 of 5
L200TAG3KB
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
DWG NO. DSDD0215
5mm, Flanged Cylindrical, 8.6mm Height
40° viewing angle
(I
Aqua Green
L200TAG3KB
REVISION LTR: A
DWG BY:
06-28-07
01-20-09
BL / GP
01-20-09
PL
CHK BY:
L200TAG3KB
Part No. Page 2 of 5
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
DWG NO. DSDD0215
2.0(.079) MIN.
25.4(1.0) MIN.
8.62(.339)
2.54(.10) NOM.
0.5(.02)
SQ. TYP.
1.5(.059) MAX.
1.0(.04)
5.0(.197)
Green Anode
Green
Zener
Green Cathode
5.7(.22)
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
● Features: ●Package dimensions:
1. Chip material: InGaN
2. Emitted color : Green
3. Lens Appearance : Green Diffused
4. Low power consumption.
5. High efficiency.
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
8. 5mm diameter package
9. This product is RoHS compliant.
●Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
● Absolute maximum ratings(Ta=25℃)
Parameter Symbol Rating Unit
Wm 021 dP noitapissiD rewoP
I tnerruC drawroF F Am 03
Peak Forward Current*1 IFP Am 051
Reverse Voltage V R V 5
Operating Temperature Topr -40℃~85℃
Storage Temperature Tstg -40℃~100℃
Soldering Temperature Tsol 260℃max (for 5 seconds)
Hand Soldering Temperature Tsol 350℃max(for 3 seconds )
*1Condition for IFP is pulse of 1/10 duty and 0.1msec width.
L200TAG3KB
Part No. Page 3 of 5
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
DWG NO. DSDD0215
●Electrical and optical characteristics(Ta=25℃)
Parameter Symbol Condition Min. Typ. Max. Unit
Forward Voltage VFIF=20mA - 3.2 4.0 V
Luminous Intensity Iv IF=20mA mcd
Reverse Current IRVR=5V - - 100
-
µA
mW/sr
-
nm
5500
12
518-
-
Peak Wave Length λpIF=20mA
-nm525-
Dominant Wave Length λdIF=20mA
IF=20mA
Spectral Line Half-width ∆λIF=20mA - 33 - nm
Viewing Angle 2
Radiant Intensity -
-
-
θ1/2 IF=20mA - 40 - deg
IF=20mA
Chromaticity Coordinates -
X
Y
-
-
0.15
0.73
● Typical Electro-Optical Characteristics Curves
ytisnetni suonimul evitaleR 4.giFegatlov drawroF .sv tnerruc drawroF 3.giF
1.5
Relative luminous intensity(@20mA)
0
0.5
1.0
Forward current (mA)
2010 30 40 50
Fig.5 Relative luminous intensity
2.0
0
Forward current(mA)
20
10
30
40
50
vs. Forward current
2
Forward voltage(V)
1 3 54
Relative radiant intensity
Ambient temperature Ta( )℃
vs. Ambient temperature
0.5
Fig.6 Radiation diagram
-40
0-20 200
2.0
Relative luminous intensity
1.0
1.5
2.5
3.0
6040
Fig.1 Relative intensity vs. Wavelength
Relative radiant intensity
475
0
0.5
1.0
Wavelength λ(nm)
575525
Ambient temperature Ta( )℃
vs. Ambient temperature
Fig.2 Forward current derating curve
Forward current(mA)
0
20
0101
30
20 40 60
40
50
60
10080
0.30.5
0.7
0.8
0.9
1.0
70
0.40.1 0.2 0.6
80
90
60
50
40
30
0 10 20
L200TAG3KB
Part No. Page 4 of 5
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
DWG NO. DSDD0215
● Bin Limits
1. Intensity bin limits (At IF= 20mA)
Bin Code Min. (mcd) Max. (mcd)
X 1600 2400
Y 2400 3700
Z 3700 5550
ZA 5550 8325
ZB 8325 12488
2. Color Bin Limits (At IF=20mA) : Dominant Wave Length λd(nm)
Bin Code Min. (nm) Max. (nm)
6 520 525
7 525 530
● Bin：x x
color bin code
Intensity bin code
NOTES:1.Tolerance of measurement of luminous intensity. :± 1 5 %
2 . Tolerance of measurement of dominant wavelength :±1.0nm
L200TAG3KB
Part No. Page 5 of 5
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
DWG NO. DSDD0215
●DIP soldering (Wave Soldering)
Preheating : 120℃,within 120~180 sec.
Operation heating : 255℃±5℃within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Temperature
Time
120~180 sec.
Preheat
255 ±5℃ within 5 sec.
Soldering heat Max. 260 ℃
120℃
