BBY57... Silicon Tuning Diode * Excellent linearity * High Q hyperabrupt tuning diode * Low series resistance * High capacitance ratio * Designed for low tuning voltage operation for VCO's in mobile communications equipment * For control elements such as TCXOs and VCXOs * Pb-free (RoHS compliant) package 1) * Qualified according AEC Q101 BBY57-02L BBY57-02V BBY57-02W BBY57-05W ! , , Type BBY57-02L BBY57-02V BBY57-02W BBY57-05W Package TSLP-2 SC79 SCD80 SOT323 Configuration single single single common cathode LS(nH) 0.4 0.6 0.6 1.4 Marking 55 5 55 D5s Maximum Ratings at TA = 25C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 10 V Forward current IF 20 mA Operating temperature range Top -55 ... 125 C Storage temperature Tstg -55 ... 150 1Pb-containing Value Unit package may be available upon special request 1 2007-04-20 BBY57... Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Values Parameter min. typ. Unit max. DC Characteristics Reverse current IR nA VR = 8 V - - 10 VR = 8 V, TA = 85 C - - 100 AC Characteristics Diode capacitance pF CT VR = 1 V, f = 1 MHz 16.5 17.5 18.6 VR = 2.5 V, f = 1 MHz - 9.35 - VR = 3 V, f = 1 MHz - 7 - VR = 4 V, f = 1 MHz 4 4.7 5.5 CT1/C T3 - 2.45 - CT1/C T4 3 3.7 4.5 Capacitance ratio VR = 1 V, VR = 3 V, f = 1 MHz Capacitance ratio VR = 1 V, VR = 4 V, f = 1 MHz Series resistance rS VR = 1 V, f = 470 MHz, BBY57-02L - 0.35 - VR = 1 V, f = 470 MHz, all others - 0.3 - 2 2007-04-20 BBY57... Diode capacitance CT = (VR) Normalized diode capacitance f = 1MHz C(TA)/C(25C)= (TA); f = 1MHz 40 1.06 - pF 1.04 CTA/C25 CT 30 25 1V 1.03 4V 1.02 1.01 20 1 15 0.99 0.98 10 0.97 5 0.96 0 0 0.5 1 1.5 2 2.5 3 V 0.95 -30 4 VR -10 10 30 50 70 C 100 TA Temperature coefficient of the diode capacitance TCc = (VR) 10 -2 TCC 1/C 10 -3 10 -4 0 0.5 1 1.5 2 2.5 3 V 4 VR 3 2007-04-20 Package SC79 BBY57... Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 0.1 0.2 0.05 10MAX. 1.6 0.1 1 0.3 0.05 Cathode marking 10MAX. 1.2 0.1 A 2 0.55 0.04 0.35 1.35 Foot Print 0.35 Marking Layout (Example) 2005, June Date code BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel o330 mm = 10.000 Pieces/Reel Cathode marking 0.4 0.93 0.2 8 1.96 Reel with 2 mm Pitch 2 1.33 Standard 4 Cathode marking 4 0.66 2007-04-20 Package SCD80 BBY57... Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 0.1 0.2 0.05 10MAX. 1.7 0.1 1 0.3 0.05 Cathode marking 7 1.5 1.3 0.1 A 2 0.7 0.1 0.35 1.45 Foot Print 0.35 Marking Layout (Example) 2005, June Date code BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel o330 mm = 10.000 Pieces/Reel Reel with 2 mm Pitch 2 0.2 2.5 8 1.45 Standard 4 Cathode marking 0.4 0.9 Cathode marking 5 0.7 2007-04-20 BBY57... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 2 0 04 2005 2006 2 0 07 2008 2009 2010 2011 2012 2 0 13 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 6 2007-04-20 Package SOT323 BBY57... Package Outline 0.9 0.1 2 0.2 0.3 +0.1 -0.05 0.1 MAX. 3x 0.1 M 0.1 A 1 2 1.25 0.1 0.1 MIN. 2.1 0.1 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 0.8 1.6 0.6 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) BCR108W Type code Pin 1 Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 7 2007-04-20 Package TSLP-2-1 BBY57... Package Outline Top view Bottom view 0.4 +0.1 0.6 0.05 0.05 MAX. 1 1) 1) 0.5 0.035 Cathode marking 0.25 0.035 2 1 1 0.05 0.650.05 2 1) Dimension applies to plated terminal Foot Print 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Copper Solder mask 0.375 0.275 0.35 1 0.3 0.925 0.35 0.45 Stencil apertures Marking Layout (Example) BAS16-02L Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 15.000 Pieces/Reel Reel o330 mm = 50.000 Pieces/Reel (optional) 0.5 1.16 Cathode marking 8 4 0.76 8 2007-04-20 BBY57... Edition 2006-02-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 2007-04-20 List of affected products 1_cip08187_a1 PCN 2008-187-A1 Implementation of Cu wire bonding for halogen free products assembled in lead-free packages PG-SC79 and PG-SCD80 and Transfer of assembly and final test to Infineon Technologies (Wuxi) Co., Ltd., China Changes for PG-SC79 and PG-SCD80 products Assembly and final test site Transfer from IFX Mal to IFX Wuxi Plating site Transfer from IFX Mal to our subcontractor used for already established PG-SOT23 production Wire bonding thickness and material Change from Au to Cu wire. Wire thickness depends on product. See details below Marking on device As illustrated in PCN document, page 2 SP number (ordering code) Details see below Last order date / Last delivery date of unchanged product 30.06.2010 / 30.12.2010 PCN samples Available: Lead types * All other types will have a leadtime of 6 weeks from customer sample order till sample delivery Type Silicon Tuning Diode Silicon Tuning Diode Silicon Tuning Diode Silicon Tuning Diode Silicon RF Switching Diode Silicon RF Switching Diode Silicon RF Switching Diode Silicon PIN Diode Silicon PIN Diode Silicon PIN Diode Silicon PIN Diode Silicon PIN Diode Silicon PIN Diode Silicon Switching Diode Silicon Switching Diode Silicon Switching Diode Silicon Switching Diode Silicon Schottky Diode Silicon Schottky Diode Silicon Tuning Diode Silicon Tuning Diode Silicon Tuning Diode Silicon Tuning Diode Silicon Tuning Diode Silicon Tuning Diode Silicon Tuning Diode Silicon Tuning Diode 2009-12-08 Sales Name BBY 55-02W E6327 BBY 56-02W E6327 BBY 57-02W E6327 BBY 58-02W E6327 BA 892-02V E6127 BA 892-02V E6327 BA 892-02V E6433 BAR 50-02V E6327 BAR 63-02V E6327 BAR 64-02V E6327 BAR 65-02V E6327 BAR 67-02V E6327 BAR 88-02V E6327 BAS 16-02V E6327 BAS 3005A-02V E6327 BAS 3005B-02V E6327 BAS 52-02V E6327 BAT 54-02V E6327 BAT 63-02V E6327 BB 555-02V E7902 BB 555-02V E7912 BB 565-02V E7902 BB 659C-02V E7902 BB 659C-02V E7908 BB 659C-02V E7912 BB 664-02V E7902 BB 689-02V E7902 New Sales Name E substitued by H BBY 55-02W H6327 BBY 56-02W H6327 BBY 57-02W H6327 BBY 58-02W H6327 BA 892-02V H6127 BA 892-02V H6327 BA 892-02V H6433 BAR 50-02V H6327 BAR 63-02V H6327 BAR 64-02V H6327 BAR 65-02V H6327 BAR 67-02V H6327 BAR 88-02V H6327 BAS 16-02V H6327 BAS 3005A-02V H6327 BAS 3005B-02V H6327 BAS 52-02V H6327 BAT 54-02V H6327 BAT 63-02V H6327 BB 555-02V H7902 BB 555-02V H7912 BB 565-02V H7902 BB 659C-02V H7902 BB 659C-02V H7908 BB 659C-02V H7912 BB 664-02V H7902 BB 689-02V H7902 Package PG-SCD80-2-1 PG-SCD80-2-1 PG-SCD80-2-1 PG-SCD80-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 PG-SC79-2-1 Page 2 of 3 Current Au wire thickness 33 m 33 m 33 m 33 m 20 m 20 m 20 m 20 m 20 m 20 m 20 m 20 m 20 m 20 m 38 m 38 m 38 m 20 m 20 m 33 m 33 m 33 m 33 m 33 m 33 m 33 m 33 m New Cu wire thickness 38 m 38 m 38 m 38 m 22 m 22 m 22 m 22 m 22 m 22 m 22 m 22 m 22 m 22 m 38 m 38 m 38 m 22 m 22 m 38 m 38 m 38 m 38 m 38 m 38 m 38 m 38 m Current SP number SP000012232 SP000012233 SP000012234 SP000012235 SP000104706 SP000013174 SP000013175 SP000012921 SP000010162 SP000010361 SP000010359 SP000010369 SP000013484 SP000014911 SP000297683 SP000065626 SP000013936 SP000232851 SP000273992 SP000013176 SP000104717 SP000013416 SP000013179 SP000013180 SP000104719 SP000013418 SP000013414 New SP number SP000743558 SP000734340 SP000743562 SP000743570 SP000745052 SP000745054 SP000745060 SP000742882 SP000742888 SP000743408 SP000743446 SP000743448 SP000743452 SP000752008 SP000749684 SP000749682 SP000749808 SP000749828 SP000743526 SP000745088 SP000745092 SP000745098 SP000745108 SP000745110 SP000745112 SP000745118 SP000745124 Sample availability Available Available Available Available * Available * Available Available Available Available Available Available Available * * Available * Available Available * * Available * * * * CoolMOSTM technology products