2007-04-20
1
BBY57...
Silicon Tuning Diode
• Excellent linearity
• High Q hyperabrupt tuning diode
• Low series resistance
• High capacitance ratio
• Designed for low tuning voltage operation
for VCO's in mobile communications equipment
• For control elements such as TCXOs and VCXOs
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
BBY57-02L
BBY57-02V
BBY57-02W
BBY57-05W
!
,
,
Type Package Configuration L
S
(nH) Marking
BBY57-02L
BBY57-02V
BBY57-02W
BBY57-05W
TSLP-2
SC79
SCD80
SOT323
single
single
single
common cathode
0.4
0.6
0.6
1.4
55
5
55
D5s
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR10 V
Forward current IF20 mA
Operating temperature range Top -55 ... 125 °C
Storage temperature Tstg -55 ... 150
1Pb-containing package may be available upon special request
2007-04-20
2
BBY57...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Reverse current
VR = 8 V
VR = 8 V, TA = 85 °C
IR
-
-
-
-
10
100
nA
AC Characteristics
Diode capacitance
VR = 1 V, f = 1 MHz
VR = 2.5 V, f = 1 MHz
VR = 3 V, f = 1 MHz
VR = 4 V, f = 1 MHz
CT
16.5
-
-
4
17.5
9.35
7
4.7
18.6
-
-
5.5
pF
Capacitance ratio
VR = 1 V, VR = 3 V, f = 1 MHz CT1/CT3 - 2.45 -
Capacitance ratio
VR = 1 V, VR = 4 V, f = 1 MHz CT1/CT4 3 3.7 4.5
Series resistance
VR = 1 V, f = 470 MHz, BBY57-02L
VR = 1 V, f = 470 MHz, all others
rS
-
-
0.35
0.3
-
-
Ω
2007-04-20
3
BBY57...
Diode capacitance CT = ƒ (VR)
f = 1MHz
0 0.5 1 1.5 2 2.5 3 V4
VR
0
5
10
15
20
25
30
pF
40
CT
Normalized diode capacitance
C(TA)/C(25°C)= ƒ(TA); f = 1MHz
-30 -10 10 30 50 70 °C 100
TA
0.95
0.96
0.97
0.98
0.99
1
1.01
1.02
1.03
1.04
-
1.06
CTA/C25
1V
4V
Temperature coefficient of the diode
capacitance TCc = ƒ (VR)
0 0.5 1 1.5 2 2.5 3 V4
VR
-4
10
-3
10
-2
10
1/°C
TCC
2007-04-20
4
BBY57...
Package SC79
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
±0.1
1.6
0.3
1
2
marking
Cathode
0.8 ±0.1
10
˚
MAX.
±0.1
1.2
A
±0.05
10
˚
MAX.
0.13
A0.2
M
+0.05
-0.03
±0.04
0.55
±0.05
0.2
0.35
0.35
1.35
BAR63-02V
Type code
Cathode marking
Laser marking
2
0.66
0.93
0.4
1.33
1.96
8
0.2
Cathode
marking
4
Cathode
marking
Standard Reel with 2 mm Pitch
2005, June
Date code
2007-04-20
5
BBY57...
Package SCD80
Package Outline
Foot Print
Marking Layout (Example)
±0.1
1.7
0.3
1
2
marking
Cathode
0.8
±0.1
10
˚
MAX.
±0.1
0.7
±0.1
1.3 7
˚
0.13
±0.05
+0.05
-0.03
±1.5
˚
0.2
M
A
A
±0.05
0.2
0.35
0.35
1.45
BAR63-02W
Type code
Cathode marking
Laser marking
0.7
20.2
0.9
0.4
8
4
1.45
2.5
Standard Reel with 2 mm Pitch
Cathode
marking
Cathode
marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
2005, June
Date code
2007-04-20
6
BBY57...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSdsDSdsDS
05et ETet ETet ET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08hxHXhxHXhxHX
09jyJYjyJYjyJY
10kzKZkzKZkzKZ
11l 2L4l 2L4l 2L4
12n3N5n3N5n3N5
2007-04-20
7
BBY57...
Package SOT323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.25
±0.1
0.1 MAX.
2.1
±0.1
0.15
+0.1
-0.05
0.3
+0.1
±0.1
0.9
12
3A
±0.2
2
-0.05
0.650.65
M
3x 0.1
0.1 MIN.
0.1
M
0.2 A
0.2
4
2.15 1.1
8
2.3
Pin 1
Pin 1
2005, June
Date code (YM)
BCR108W
Type code
0.6
0.8
1.6
0.65 0.65
Manufacturer
2007-04-20
8
BBY57...
Package TSLP-2-1
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
For board assembly information please refer to Infineon website "Packages"
1
2
0.45
0.275 0.275
0.375
0.925
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
BAS16-02L
Type code
Cathode marking
Laser marking
0.76
4
1.16
8
0.5
Cathode
marking
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
0.4
0.05 MAX.
+0.1
Cathode
marking
1) Dimension applies to plated terminal
Top view Bottom view
1
2
±0.05
0.65
±0.035
0.25
1)
1
±0.05
1)
±0.035
0.5
±0.05
0.6
2007-04-20
9
BBY57...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
List of affected products 1_cip08187_a1
Changes for PG-SC79 and PG-SCD80 products
Assembly and final test site Transfer from IFX Mal to IFX Wuxi
Plating site Transfer from IFX Mal to our subcontractor used for already established PG-SOT23 production
Wire bonding thickness and material Change from Au to Cu wire. Wire thickness depends on product. See details below
Marking on device As illustrated in PCN document, page 2
SP number (ordering code) Details see below
30.06.2010 / 30.12.2010
PCN samples
Type Sales Name New Sales Name
E substitued by H
Package Current Au wire
thickness
New Cu wire
thickness
Current SP
number
New SP
number
Sample
availability
PCN 2008-187-A1
Implementation of Cu wire bonding for halogen free products
assembled in lead-free packages PG-SC79 and PG-SCD80
and Transfer of assembly and final test to Infineon Technologies (Wuxi) Co., Ltd., China
Last order date / Last delivery date
of unchanged product
Available: Lead types
* All other types will have a leadtime of 6 weeks from customer sample order till sample delivery
Silicon Tuning Diode
BBY 55-02W E6327 BBY 55-02W H6327 PG-SCD80-2-1 33 µm 38 µm SP000012232 SP000743558 Available
Silicon Tuning Diode
BBY 56-02W E6327 BBY 56-02W H6327 PG-SCD80-2-1 33 µm 38 µm SP000012233 SP000734340 Available
Silicon Tuning Diode
BBY 57-02W E6327 BBY 57-02W H6327 PG-SCD80-2-1 33 µm 38 µm SP000012234 SP000743562 Available
Silicon Tuning Diode
BBY 58-02W E6327 BBY 58-02W H6327 PG-SCD80-2-1 33 µm 38 µm SP000012235 SP000743570 Available
BA 892-02V E6127 BA 892-02V H6127 PG-SC79-2-1 20 µm 22 µm SP000104706 SP000745052 *
BA 892-02V E6327
BA 892-02V H6327
PG-SC79-2-1
20 µm
22 µm
SP000013174
SP000745054
Available
BA 892-02V E6327
BA 892-02V H6327
PG-SC79-2-1
20 µm
22 µm
SP000013174
SP000745054
Available
BA 892-02V E6433 BA 892-02V H6433 PG-SC79-2-1 20 µm 22 µm SP000013175 SP000745060 *
Silicon PIN Diode
BAR 50-02V E6327 BAR 50-02V H6327 PG-SC79-2-1 20 µm 22 µm SP000012921 SP000742882 Available
Silicon PIN Diode
BAR 63-02V E6327 BAR 63-02V H6327 PG-SC79-2-1 20 µm 22 µm SP000010162 SP000742888 Available
Silicon PIN Diode
BAR 64-02V E6327 BAR 64-02V H6327 PG-SC79-2-1 20 µm 22 µm SP000010361 SP000743408 Available
Silicon PIN Diode
BAR 65-02V E6327 BAR 65-02V H6327 PG-SC79-2-1 20 µm 22 µm SP000010359 SP000743446 Available
Silicon PIN Diode
BAR 67-02V E6327 BAR 67-02V H6327 PG-SC79-2-1 20 µm 22 µm SP000010369 SP000743448 Available
Silicon PIN Diode
BAR 88-02V E6327 BAR 88-02V H6327 PG-SC79-2-1 20 µm 22 µm SP000013484 SP000743452 Available
Silicon Switching Diode
BAS 16-02V E6327 BAS 16-02V H6327 PG-SC79-2-1 20 µm 22 µm SP000014911 SP000752008 Available
Silicon Switching Diode
BAS 3005A-02V E6327 BAS 3005A-02V H6327 PG-SC79-2-1 38 µm 38 µm SP000297683 SP000749684 *
Silicon Switching Diode
BAS 3005B-02V E6327 BAS 3005B-02V H6327 PG-SC79-2-1 38 µm 38 µm SP000065626 SP000749682 *
Silicon Switching Diode
BAS 52-02V E6327 BAS 52-02V H6327 PG-SC79-2-1 38 µm 38 µm SP000013936 SP000749808 Available
Silicon Schottky Diode
BAT 54-02V E6327 BAT 54-02V H6327 PG-SC79-2-1 20 µm 22 µm SP000232851 SP000749828 *
Silicon Schottky Diode
BAT 63-02V E6327 BAT 63-02V H6327 PG-SC79-2-1 20 µm 22 µm SP000273992 SP000743526 Available
Silicon Tuning Diode
BB 555-02V E7902 BB 555-02V H7902 PG-SC79-2-1 33 µm 38 µm SP000013176 SP000745088 Available
Silicon Tuning Diode
BB 555-02V E7912 BB 555-02V H7912 PG-SC79-2-1 33 µm 38 µm SP000104717 SP000745092 *
Silicon Tuning Diode
BB 565-02V E7902 BB 565-02V H7902 PG-SC79-2-1 33 µm 38 µm SP000013416 SP000745098 *
Silicon Tuning Diode
BB 659C-02V E7902 BB 659C-02V H7902 PG-SC79-2-1 33 µm 38 µm SP000013179 SP000745108 Available
Silicon Tuning Diode
BB 659C-02V E7908 BB 659C-02V H7908 PG-SC79-2-1 33 µm 38 µm SP000013180 SP000745110 *
Silicon Tuning Diode
BB 659C-02V E7912 BB 659C-02V H7912 PG-SC79-2-1 33 µm 38 µm SP000104719 SP000745112 *
Silicon Tuning Diode
BB 664-02V E7902 BB 664-02V H7902 PG-SC79-2-1 33 µm 38 µm SP000013418 SP000745118 *
Silicon Tuning Diode
BB 689-02V E7902 BB 689-02V H7902 PG-SC79-2-1 33 µm 38 µm SP000013414 SP000745124 *
2009-12-08 Page 2 of 3 CoolMOS
TM
technology products