© Freescale Semiconductor, Inc., 2005. All rights reserved.
Freescale Semiconductor
Technical Data
This doc ument describes part-number-specific changes to
recommended operating conditions and revised electrical
specifica tions, as applica ble, from those descr ibed in the general
MPC8245 Integrated Processor Hardware Specifications (Ord er
No. MPC8245EC). The MPC8245 combines a PowerPC™
MPC603e core with a PCI bridge.
Specifications provide d in this document supers ede those in the
MPC8245 Integrated Processor Hardware Specifications ,
Revision 7 or later, for the part numbers listed in Table A only.
Specifications not addressed herein a re unchanged. Because this
document is frequently updated, refer to http://www .freescale.com
or to a local Frees cale s ales office fo r the lat es t versi on .
Note that headings and table numbers in this document are not
consecutively numbered. They correspond t o the he ading or t able
affected in the general hardware specification.
Part numbers addressed in this document are lis ted in Table A. F or
more detailed order ing inf ormatio n, se e Section 9, “Ordering
Information.”
Document Number: MPC8245ECS01AD
Rev. 1.1, 12/2005
Freescale Part Numbers Affected:
M
PC8245TVV266D
MPC8245TZU266D
MPC8245TVV300D
MPC8245TZU300D
MPC8245TVV333D
MPC8245TZU333D
MPC8245TVV350D
MPC8245TZU350D
MPC8245 Hardware Specification
Addendum for the
MPC8245T
XXnnnX
Series
MPC8245 Hardware Specification Addendum for the MPC8245TXXnnnX Series, Rev. 1.1
2Freescale Semiconductor
Ordering Information
4.1.3 DC Electrical Characteristics
Table 2 provides the recommended operat ing conditi ons for the MPC8245 part numbers desc ribed herein.
Pleas e consult the MPC8245 Inte grated Processor Hardware Specifications document f or mor e detai ls conce rning
the part’s specifications.
9 Ordering Information
Ordering infor mation for the parts f ully covered by this document is pr ovided in Secti on 9.1 , “Part Numbers Fu lly
Addressed by This Document.” This section also addresses the marking specifications.
9.1 Part Numbers Fully Addressed by This Document
Table 21 pro vides the orderi ng information for the MPC8245 parts describe d in this document . Note that the
individual part number s correspond to a maximum processor core frequency.
Table A. Part Numbers Addressed by This Data Sheet
Freescale
Part Number
Operating Conditions Significant
Differences from
Hardware
Specification
Processor
Version Register
Value
CPU
Frequency VDD TJ (°C)
MPC8245TVV266D
MPC8245TZU266D
266 MHz
1.7 V–2.1 V
–40 to 105 Extended temperature
range for additional part
offering
0x80811014
MPC8245TVV300D
MPC8245TZU300D
300 MHz
MPC8245TVV333D
MPC8245TZU333D
333 MHz
2.0 ± 100 mV
MPC8245TVV350D
MPC8245TZU350D
350 MHz
Note: The X prefix in a Freescale part number designates it as a ‘Pilot Production Prototype’ as defined by Freescale SOP 3-13.
These are part of a limited production volume of prototypes manufactured, tested, and Q.A. inspected on a qualified technology
to simulate normal production. These parts have only preliminary reliability and characterization data. Before pilot production
prototypes may be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging
the qualification status and the fact that product changes may still occur while shipping pilot production prototypes. Note that
the VV package refers to lead free TBGA and is only available in part revision D.
Table 2. Recommended Operating Conditions
Characteristic Symbol Recommended Value Unit
Die-junction temperature Tj–40 to 105 °C
Note: These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
MPC8245 Hardware Specification Addendum for the MPC8245TXXnnnX Series, Rev. 1.1
Freescale Semiconductor 3
Ordering Information
Table 21. Part Numbers Addressed by this document
9.3 Part Marking
Parts are marked as in the example shown in Figure 33.
Figure 33. Freescale Part Marking for TBGA Device
MPC
nnnn
X
xx nnn x
Product
Code
Part
Identifier
Process
Descriptor Package 1Processor
Frequency 2Revision Level
Processor
Version
Register Value
MPC 8245 T: –40° to 105°CZU=TBGA
V V3= Lead-free
TBGA
266 MHz, 300 MhZ:
1.7 V to 2.1 V
333 MHz, 350 MHz:
1.9 V to 2.2 V
D:1.4 Rev ID:0x14 0x80811014
Notes:
1.See Section 5, “Package Description,”in the
MPC8245 Integrated Processor Hardware Specifications
for more information on
available package types.
2.Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification
support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core
frequencies.
3.Note that the V V package option is only available in part revision D.
Notes:
MMMMM is the 5-digit mask number.
ATWLYYWW is Test traceability code.
MPC8245TXXnnnD
MMMMM
ATW LY Y WW
CCCCC
YWWLAZ
YWWLAZ is the Assembly traceability code.
CCCCC is the country code.
MPC8245 Hardware Specification Addendum for the MPC8245TXXnnnX Series, Rev. 1.1
4Freescale Semiconductor
Document Revision History
Document Revision History
Table B provides a revision history for this pa rt number specification.
Table B. Document Revision History
Revision Date Substantive Change(s)
1.1 12/2005 Changed all occurrences of XPC to MPC.
Table 21 and Figure 33 were updated to reflect current part nomenclature and marking.
1 10/05/04 Added range information regarding 1.7V to 2.1V for 266 MHz and 300 MHz parts. Changed title
wording from ‘Part Number Specification’ to ‘Hardware Specification Addendum’; adopted new
Document ID numbering scheme. This document replaces the earlier document
MPC8245TXXPNS.
0 03/14/04 Original version of MPC8245TXXPNS. Information in this document supersedes that of the
MPC8245TZUPNS as lead free (VV) information was added.
MPC8245 Hardware Specification Addendum for the MPC8245TXXnnnX Series, Rev. 1.1
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Document Number: MPC8245ECS01AD
Rev. 1.1
12/2005
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