MOTOROLA Order this document by MBRS1100T3/D SEMICONDUCTOR TECHNICAL DATA Schottky Power Rectifier MBRS1100T3 MBRS190T3 Surface Mount Power Package Schottky Power Rectifiers employ the use of the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. These state-of-the-art devices have the following features: * * * * * * Motorola Preferred Device SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE 90, 100 VOLTS Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction High Blocking Voltage -- 100 Volts 150C Operating Junction Temperature Guardring for Stress Protection Mechanical Characteristics * Case: Epoxy, Molded * Weight: 95 mg (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable * Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds * Shipped in 12 mm Tape and Reel, 2500 units per reel * Polarity: Notch in Plastic Body Indicates Cathode Lead * Markings; MBRS190T3: B19 Markings; MBRS1100T3: B1C CASE 403A-03 SMB MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current VRRM VRWM VR TL = 120C TL = 100C MBRS190T3 MBRS1100T3 Unit Volts 90 100 IF(AV) 1.0 2.0 Amps IFSM 50 Amps TJ - 65 to +150 C dv/dt 10 V/ns RJL 22 C/W Maximum Instantaneous Forward Voltage (1) (iF = 1.0 A, TJ = 25C) VF 0.75 Volts Maximum Instantaneous Reverse Current (1) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 100C) iR Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction Temperature Voltage Rate of Change THERMAL CHARACTERISTICS Thermal Resistance -- Junction to Lead (TL = 25C) ELECTRICAL CHARACTERISTICS mA 0.5 5.0 (1) Pulse Test: Pulse Width = 300 s, Duty Cycle 2.0%. Preferred devices are Motorola recommended choices for future use and best overall value. Rev 4 Rectifier Device Data Motorola, Inc. 1999 This Material Copyrighted By Its Respective Manufacturer 1 MBRS1100T3 MBRS190T3 1K 400 200 100 40 20 10 4 2 1 0.4 0.2 0.1 0.04 0.02 0.01 20 10 TJ = 150C 5 2 100C 1 0.5 25C 0.2 0.1 0.05 0.02 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 TJ = 150C I R , REVERSE CURRENT ( A) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) TYPICAL ELECTRICAL CHARACTERISTICS 1 1.1 1.2 1.3 1.4 125C 100C 25C 0 10 20 30 40 50 60 70 80 90 100 VR, REVERSE VOLTAGE (VOLTS) vF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current* I F(AV) , AVERAGE FORWARD CURRENT (AMPS) 3.2 2.8 TJ = 100C 2.4 2.0 SQUARE WAVE 1.6 DC 1.2 0.8 0.4 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.0 RATED VR APPLIED RJL = 22C/W TJ = 100C 3.5 3.0 DC 2.5 SQUARE WAVE 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 IF(AV), AVERAGE FORWARD CURRENT (AMPS) TL, LEAD TEMPERATURE (C) Figure 3. Power Dissipation Figure 4. Current Derating, Lead C, CAPACITANCE (pF) PF(AV), AVERAGE POWER DISSIPATION (WATTS) *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficient below rated VR. 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 140 160 NOTE: TYPICAL CAPACITANCE NOTE: AT 0 V = 270 pF 0.1 0.2 0.5 1 2 5 10 20 50 100 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance 2 This Material Copyrighted By Its Respective Manufacturer Rectifier Device Data MBRS1100T3 MBRS190T3 INFORMATION FOR USING THE SMB SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.089 2.261 0.108 2.743 0.085 2.159 inches mm MOUNTING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. Rectifier Device Data This Material Copyrighted By Its Respective Manufacturer * The soldering temperature and time shall not exceed 260C for more than 5 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. 3 MBRS1100T3 MBRS190T3 PACKAGE DIMENSIONS S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. D B C K P INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220 MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59 H J CASE 403A-03 ISSUE D Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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