MBRS1100T3 - Motorola / Freescale Semiconductor

1Rectifier Device Data

Schottky Power Rectifier

Surface Mount Power Package

Schottky Power Rectifiers employ the use of the Schottky Barrier principle in

a large area metal-to-silicon power diode. State-of-the-art geometry features

epitaxial construction with oxide passivation and metal overlay contact. Ideally

suited for low voltage, high frequency rectification, or as free wheeling and

polarity protection diodes, in surface mount applications where compact size

and weight are critical to the system. These state-of-the-art devices have the

following features:

•Small Compact Surface Mountable Package with J-Bend Leads

•Rectangular Package for Automated Handling

•Highly Stable Oxide Passivated Junction

•High Blocking Voltage — 100 Volts

•150°C Operating Junction Temperature

•Guardring for Stress Protection

Mechanical Characteristics

•Case: Epoxy, Molded

•Weight: 95 mg (approximately)

•Finish: All External Surfaces Corrosion Resistant and Terminal Leads are

Readily Solderable

•Lead and Mounting Surface Temperature for Soldering Purposes: 260°C

Max. for 10 Seconds

•Shipped in 12 mm Tape and Reel, 2500 units per reel

•Polarity: Notch in Plastic Body Indicates Cathode Lead

•Markings; MBRS190T3: B19

Markings; MBRS1100T3: B1C

MAXIMUM RATINGS

Rating Symbol MBRS190T3 MBRS1100T3 Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

VR90 100 Volts

Average Rectified Forward Current TL = 120°C

TL = 100°CIF(AV) 1.0

2.0 Amps

Nonrepetitive Peak Surge Current

(Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 50 Amps

Operating Junction Temperature TJ– 65 to +150 °C

Voltage Rate of Change dv/dt 10 V/ns

THERMAL CHARACTERISTICS

Thermal Resistance — Junction to Lead (TL = 25°C) RθJL 22 °C/W

ELECTRICAL CHARACTERISTICS

Maximum Instantaneous Forward Voltage (1)

(iF = 1.0 A, TJ = 25°C) VF0.75 Volts

Maximum Instantaneous Reverse Current (1)

(Rated dc Voltage, TJ = 25°C)

(Rated dc Voltage, TJ = 100°C)

iR0.5

5.0

(1) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤2.0%.

Preferred devices are Motorola recommended choices for future use and best overall value.

 Motorola, Inc. 1999

Order this document

by MBRS1100T3/D

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

MBRS1100T3

MBRS190T3

SCHOTTKY BARRIER

RECTIFIER

1.0 AMPERE

90, 100 VOLTS

CASE 403A–03

SMB

Motorola Preferred Device

Rev 4

This Material Copyrighted By Its Respective Manufacturer

MBRS1100T3 MBRS190T3

2Rectifier Device Data

TYPICAL ELECTRICAL CHARACTERISTICS

Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current*

Figure 3. Power Dissipation Figure 4. Current Derating, Lead

Figure 5. Typical Capacitance

0.5

0.2

0.1

0.05

0.020 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4

vF, INSTANTANEOUS VOLTAGE (VOLTS)

100°C

25°C

i , INSTANTANEOUS FORWARD CURRENT (AMPS)

1 K

400

200

100

0.4

0.2

0.1

0.04

0.01

0.02

0 102030405060708090100

TJ = 150°C

125°C

100°C

VR, REVERSE VOLTAGE (VOLTS)

3.2

2.8

2.4

2.0

1.6

1.2

0.8

0.4

00 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

TJ = 100°C

SQUARE

WAVE

IF(AV), A VERAGE FOR W ARD CURRENT (AMPS)

P , AVERAGE POWER DISSIPATION (WATTS)

F(AV)

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

00 20 40 60 80 100 120 140 160

RATED VR APPLIED

RθJL = 22°C/W

TJ = 100°C

SQUARE

WAVE

TL, LEAD TEMPERATURE (°C)

I , AVERAGE FORWARD CURRENT (AMPS)

F(AV)

280

260

240

220

200

180

160

140

120

100

00.1 0.2 0.5 1 2 5 10 20 50 100

VR, REVERSE VOLTAGE (VOLTS)

C, CAPACITANCE (pF)

NOTE: TYPICAL CAPACITANCE

NOTE: AT 0 V = 270 pF

TJ = 150°C

IR, REVERSE CURRENT ( A)µ

*The curves shown are typical for the highest voltage device in the voltage

grouping. Typical reverse current for lower voltage selections can be estimated

from these curves if VR is sufficient below rated VR.

25°C

This Material Copyrighted By Its Respective Manufacturer

MBRS1100T3 MBRS190T3

3Rectifier Device Data

INFORMATION FOR USING THE SMB SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must be

the correct size to insure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self align when subjected to a

solder reflow process.

inches

0.085

2.159

0.108

2.743

0.089

2.261

MOUNTING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and soldering

should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference shall be a maximum of 10°C.

•The soldering temperature and time shall not exceed

260°C for more than 5 seconds.

•When shifting from preheating to soldering, the maximum

temperature gradient shall be 5°C or less.

•After soldering has been completed, the device should be

allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied during

cooling

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

This Material Copyrighted By Its Respective Manufacturer

MBRS1100T3 MBRS190T3

4Rectifier Device Data

PACKAGE DIMENSIONS

CASE 403A–03

ISSUE D

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN

DIMENSION P.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.160 0.180 4.06 4.57

B0.130 0.150 3.30 3.81

C0.075 0.095 1.90 2.41

D0.077 0.083 1.96 2.11

H0.0020 0.0060 0.051 0.152

J0.006 0.012 0.15 0.30

K0.030 0.050 0.76 1.27

P0.020 REF 0.51 REF

S0.205 0.220 5.21 5.59

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola

data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”

must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of

others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal

Opportunity/Af firmative Action Employer .

Mfax is a trademark of Motorola, Inc.

How to reach us:

USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Motorola Japan Ltd.; SPD, Strategic Planning Office, 141,

P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan. 81–3–5487–8488

Customer Focus Center: 1–800–521–6274

Mfax: RMFAX0@email.sps.mot.com – TOUCHTONE 1–602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre,

Motorola Fax Back System – US & Canada ONLY 1–800–774–1848 2, Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong.

– http://sps.motorola.com/mfax/ 852–26668334

HOME PAGE: http://motorola.com/sps/

MBRS1100T3/D

◊