Datasheet Voltage Detector IC Series Low Voltage Standard CMOS Voltage Detector ICs BU48xx Series BU49xx Series General Description ROHM standard CMOS reset IC series is a high-accuracy low current consumption reset IC series. The lineup was established with two output types (Nch open drain and CMOS output) and detection voltage range from 0.9V to 4.8V in increments of 0.1V, so that the series may be selected according to the application at hand. Features Ultra-low voltage detection Ultra-low current consumption High accuracy detection Two output types (Nch open drain and CMOS output) Wide operating temperature range Very small and low height package Key Specifications Detection voltage: 0.9V to 4.8V 0.1V steps 1.0% 0.55A (Typ.) -40C to +125C High accuracy detection voltage: Ultra-low current consumption: Operating temperature range: Package SSOP5 2.90mm x 2.80mm x 1.15mm SOP4 2.00mm x 2.10mm x 0.95mm VSOF5 1.60mm x 1.60mm x 0.60mm Applications All electronic devices that use micro controllers and logic circuits Typical Application Circuit VDD1 VDD2 VDD1 RL RST BU48xx CIN CIN (Capacitor for noise filtering) (Capacitor for noise filtering) GND Open Drain Output type BU48xx series VOUT PIN No. 1 2 3 4 5 Function VOUT VDD GND N.C. N.C. Reset output Power supply voltage GND Unconnected terminal Unconnected terminal GND 4 VSOF5 TOP VIEW N.C. 3 Lot. No Marking 1 VOUT VDD GND Symbol GND CMOS Output type BU49xx series Connection Diagram & Pin Descriptions SSOP5 SOP4 N.C. N.C. TOP VIEW TOP VIEW Lot. No Micro controller CL CL Marking RST BU49xx Micro controller Marking 1 2 3 VOUT SUB N.C 2 VDD PIN Symbol Function No. 1 VOUT Reset output 2 VDD Power supply voltage 3 N.C. Unconnected terminal 4 GND GND GND VDD 4 5 PIN No. 1 2 3 4 5 Symbol VOUT SUB N.C. VDD GND Lot. No Function Reset output Substrate* Unconnected terminal Power supply voltage GND *Connect the substrate to VDD Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211114001 1/10 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 BU48xx Series Datasheet BU49xx Series Ordering Information B U 4 8 0 9 F Detection voltage 09 : 0.9V (0.1V step) 48 : 4.8V BU48: Standard CMOS reset IC Open drain type BU49: Standard CMOS reset IC CMOS Output type TR Packaging and forming specification TR: Embossed tape and reel Package G: SSOP5 F: SOP4 FVE: VSOF5 SSOP5 5 4 1 2 3 Tape Embossed carrier tape Quantity 3000pcs TR Direction of feed 0.2Min. +0.2 1.6 -0.1 2.80.2 <Tape and Reel information> +6 4 -4 2.90.2 The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.42 -0.04 0.050.05 1.10.05 1.25Max. +0.05 0.13 -0.03 0.95 0.1 Direction of feed Reel (Unit : mm) SOP4 Order quantity needs to be multiple of the minimum quantity. +6 4 -4 3 0.90.05 1.6 0.05 1 2 0.05 1.2 0.05 4 5 +0.05 0.13 -0.03 4 (MAX 1.28 include BURR) 1.3 0.2MAX 1.60.05 1.00.05 2.00.2 0.270.15 +0.2 1.25 -0.1 VSOF5 2.10.2 1 2 3 S 0.130.05 +0.05 0.42 -0.04 0.1 0.6MAX 0.050.05 1.05Max. ) S +0.05 0.32 -0.04 0.5 (Unit : mm) Lineup Detection Making voltage JR 4.8V JQ 4.7V JP 4.6V JN 4.5V JM 4.4V JL 4.3V JK 4.2V JJ 4.1V JH 4.0V JG 3.9V JF 3.8V JE 3.7V JD 3.6V JO 3.5V JB 3.4V JA 3.3V HZ 3.2V HY 3.1V HX 3.0V HW 2.9V Part Number BU4848 BU4847 BU4846 BU4845 BU4844 BU4843 BU4842 BU4841 BU4840 BU4839 BU4838 BU4837 BU4836 BU4835 BU4834 BU4833 BU4832 BU4831 BU4830 BU4829 Making HV HU HT HS HR HQ HP HN HM HL HK HJ HH HG HF HE HD HC HB HA Detection voltage 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V 1.1V 1.0V 0.9V (Unit : mm) Part Detection Making Number voltage BU4828 LH 4.8V BU4827 LG 4.7V BU4826 LF 4.6V BU4825 LE 4.5V BU4824 LD 4.4V BU4823 LC 4.3V BU4822 LB 4.2V BU4821 LA 4.1V BU4820 KZ 4.0V BU4819 KY 3.9V BU4818 KX 3.8V BU4817 KW 3.7V BU4816 KV 3.6V BU4815 KU 3.5V BU4814 KT 3.4V BU4813 KS 3.3V BU4812 KR 3.2V BU4811 KQ 3.1V BU4810 KP 3.0V BU4809 KN 2.9V www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0.220.05 2/10 Part Detection Making Number voltage BU4948 KM 2.8V BU4947 KL 2.7V BU4946 KK 2.6V BU4945 KJ 2.5V BU4944 KH 2.4V BU4943 KG 2.3V BU4942 KF 2.2V BU4941 KE 2.1V BU4940 KD 2.0V BU4939 KC 1.9V BU4938 KB 1.8V BU4937 KA 1.7V BU4936 JZ 1.6V BU4935 JY 1.5V BU4934 JX 1.4V BU4933 JW 1.3V BU4932 JV 1.2V BU4931 JU 1.1V BU4930 JT 1.0V BU4929 JS 0.9V Part Number BU4928 BU4927 BU4926 BU4925 BU4924 BU4923 BU4922 BU4921 BU4920 BU4919 BU4918 BU4917 BU4916 BU4915 BU4914 BU4913 BU4912 BU4911 BU4910 BU4909 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 BU48xx Series Datasheet BU49xx Series Absolute Maximum Ratings (Ta=25) Parameter Symbol Limits Unit Power Supply Voltage VDD -0.3 to +7 V Nch Open Drain Output GND-0.3 to +7 Output Voltage VOUT V CMOS Output GND-0.3 to VDD+0.3 *1*4 SSOP5 540 Power *2*4 Pd mW SOP4 400 Dissipation *3*4 VSOF5 210 Operation Temperature Range Topt -40 to +125 C Ambient Storage Temperature Tstg -55 to +125 *1 When used at temperatures higher than Ta=25, the power is reduced by 5.4mW per 1 above 25. *2 When used at temperatures higher than Ta=25, the power is reduced by 4.0mW per 1 above 25. *3 When used at temperatures higher than Ta=25, the power is reduced by 2.1mW per 1 above 25. *4 When a ROHM standard circuit board (70mmx70mmx1.6mm, glass epoxy board)is mounted. Electrical Characteristics Parameter Detection Voltage Detection Voltage Temperature Coefficient Hysteresis Voltage *1 Symbol VDET Condition VDD=HAEL , Ta=25 RL=470k VDET/T Ta=-40~125 VDET BU4848 BU4847 BU4846 BU4845 BU4844 BU4843 BU4842 BU4841 BU4840 BU4839 BU4838 BU4837 BU4836 BU4835 BU4834 BU4833 BU4832 BU4831 BU4830 BU4829 BU4828 BU4827 BU4826 BU4825 BU4824 BU4823 BU4822 BU4821 BU4820 BU4819 BU4818 BU4817 BU4816 BU4815 BU4814 BU4813 BU4812 BU4811 BU4810 BU4809 *1 VDD=LAEHAEL Ta=-40~125 RL=470k VDET1.0V VDET1.1V Min. 4.752 4.653 4.554 4.455 4.356 4.257 4.158 4.059 3.960 3.861 3.762 3.663 3.564 3.465 3.366 3.267 3.168 3.069 2.970 2.871 2.772 2.673 2.574 2.475 2.376 2.277 2.178 2.079 1.980 1.881 1.782 1.683 1.584 1.485 1.386 1.287 1.188 1.089 0.990 0.891 Limits Typ. 4.800 4.700 4.600 4.500 4.400 4.300 4.200 4.100 4.000 3.900 3.800 3.700 3.600 3.500 3.400 3.300 3.200 3.100 3.000 2.900 2.800 2.700 2.600 2.500 2.400 2.300 2.200 2.100 2.000 1.900 1.800 1.700 1.600 1.500 1.400 1.300 1.200 1.100 1.000 0.900 Max. 4.848 4.747 4.646 4.545 4.444 4.343 4.242 4.141 4.040 3.939 3.838 3.737 3.636 3.535 3.434 3.333 3.232 3.131 3.030 2.929 2.828 2.727 2.626 2.525 2.424 2.323 2.222 2.121 2.020 1.919 1.818 1.717 1.616 1.515 1.414 1.313 1.212 1.111 1.010 0.909 - 30 - ppm/ VDET x0.03 VDET x0.03 VDET x0.05 VDET x0.05 VDET x0.08 VDET x0.07 V Unit V Designed Guarantee.(Outgoing inspection is not done on all products.) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/10 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 BU48xx Series Datasheet BU49xx Series Unless Otherwise Specified Ta=-25 to 125 Parameter Symbol Condition VDET =0.9-1.3V VDET =1.4-2.1V VDET =2.2-2.7V Circuit Current when ON IDD1 VDD=VDET-0.2V VDET =2.8-3.3V VDET =3.4-4.2V VDET =4.3-4.8V VDET =0.9-1.3V VDET =1.4-2.1V VDET =2.2-2.7V Circuit Current when OFF IDD2 VDD=VDET+2.0V VDET =2.8-3.3V VDET =3.4-4.2V VDET =4.3-4.8V VOL0.4V, Ta=25~125, RL=470k Operating Voltage Range VOPL VOL0.4V, Ta=-40~25, RL=470k VDS=0.05V VDD=0.85V `Low' Output Current (Nch) VDS=0.5V VDD=1.5V VDET=1.7-4.8V IOL VDS=0.5V VDD=2.4V VDET=2.7-4.8V VDS=0.5V VDD=4.8V VDET=0.9-3.9V `High' Output Current (Pch) IOH (only BU49xx) VDS=0.5V VDD=6.0V VDET=4.0-4.8V VDD=VDS=7V Output Leak Current when Ta=-40~85 OFF Ileak VDD=VDS=7V (only BU48xx) Ta=85~125 * This product is not designed for protection against radioactive rays. Min. 0.70 0.90 20 1.0 4.0 1.7 2.0 Limit Typ. 0.15 0.20 0.25 0.30 0.35 0.40 0.30 0.35 0.40 0.45 0.50 0.55 100 3.3 7.2 3.4 4.0 Max. 0.88 1.05 1.23 1.40 1.58 1.75 1.40 1.58 1.75 1.93 2.10 2.28 - - 0 0.1 - 0 1 Unit A A V A mA mA A Block Diagrams VDD VDD VOUT VOUT Vref Vref GND GND Fig.2 BU49xx Series Fig.1 BU48xx Series www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/10 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 BU48xx Series Datasheet BU49xx Series Typical Performance Curves "LOW" OUTPUT CURRENT IOL [mA] CIRCUIT CURRENT IDD [A] 0.7 BU4816 BU4816F BU4916 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 1 2 3 4 5 6 7 5 BU4816F BU4816 BU4916 4 3 2 VDD =1.2V 1 0 0.0 VDD SUPPLY VOLTAGE VDD [V] 0.5 2.5 7 OUTPUT VOLTAGE VOUT [V] BU4916F BU4916 2.0 Fig.4 "LOW" Output Current 25 "HIGH" OUTPUT CURRENT I OH [mA] 1.5 DRAIN-SOURCE VOLTAGE VDS[V] Fig.3 Circuit Current 20 1.0 VDD =6.0V 15 VDD =4.8V 10 5 BU4816F BU4816 6 BU4916 5 4 3 2 1 0 0 0 1 2 3 4 5 6 0 2 3 4 5 6 DRAIN-SOURCE VOLTAGE VDS[V] VDD SUPPLY VOLTAGE VDD [V] Fig.5 "High" Output Current Fig.6 I/O Characteristics www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1 5/10 7 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 BU48xx Series Datasheet BU49xx Series 0.8 2.0 BU4816 BU4816F BU4916 DETECTION VOLTAGE VDET[V] OUTPUT VOLTAGE VOUT [V] 1.0 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 Low to high(VDET+VDET) 1.5 High to low(VDET) BU4816 BU4816F BU4916 1.0 -40 2.5 BU4816 BU4816F BU4916 CIRCUIT CURRENT WHEN OFF IDD2 [A] CIRCUIT CURRENT WHEN ON IDD1 [A] 0.5 0.3 0.2 0.1 0 40 80 80 120 Fig.8 Detecting Voltage Release Voltage Fig.7 Operating Limit Voltage 0.0 -40 40 TEMPERATURE Ta[] VDD SUPPLY VOLTAGE VDD [V] 0.4 0 120 1.0 BU4816F BU4816 BU4916 0.8 0.6 0.4 0.2 0.0 -40 0 40 80 120 TEMPERATURE Ta[] TEMPERATURE Ta[] Fig.10 Circuit Current when OFF Fig.9 Circuit Current when ON www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/10 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 BU48xx Series Datasheet BU49xx Series MINIMUM OPERATING VOLTAGE V OPL [V] 1.0 BU4816F BU4816 BU4916 0.8 0.6 0.4 0.2 0.0 -40 0 40 80 120 TEMPERATURE Ta[] Fig.11 Operating Limit Voltage www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/10 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 BU48xx Series Datasheet BU49xx Series Application Information Explanation of Operation For both the open drain type(Fig.12)and the CMOS output type(Fig.13), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the Vout terminal voltage switches from either "High" to "Low" or from "Low" to "High". Because the BU48xx series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output "High" voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD R1 R1 RL Vref Q2 Vref RESET R2 R2 R3 VOUT VOUT Q1 R3 RESET Q1 GND GND Fig.12 (BU48xx type internal block diagram) Fig.13 (BU49xx type internal block diagram) Reference Data Examples of Output rising value(tPLH)and Output falling value(tPHL) tPHL[s] Part Number tPLH[s] BU4845 23.3 275.9 BU4945 3.5 354.3 VDD=4.3VAE5.1V VDD=5.1VAE4.3V * This data is for reference only. This figure will vary with the application, so please confirm actual operation conditions before use. Timing Waveforms Example:The following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.12 and 13). When the power supply is turned on, the output is unsettled from after over the operating limit voltage (VOPL) until tPHL. Therefore it is possible that the reset signal is not outputted VDD when the rise time of VDD is faster than tPHL. VDET+VDET When VDD is greater than VOPL but less than the reset release VDET voltage (VDET + VDET), output (VOUT) voltages will switch to L. VOPL If VDD exceeds the reset release voltage (VDET + VDET), then 0V VOUT switches from L to H (with a delay of tPLH). If VDD drops below the detection voltage (VDET) when the VOUT power supply is powered down or when there is a power VOH supply fluctuation, VOUT switches to L (with a delay of tPHL). tPLH tPHL tPLH The potential deference between the detection voltage and the release voltage is known as the hysteresis width (VDET). The tPHL VOL system is designed such that the output does not flip-flop with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise. Fig.14 Timing Waveforms www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/10 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 BU48xx Series Datasheet BU49xx Series Circuit Applications Examples of a common power supply detection reset circuit VDD1 VDD2 Application examples of BU48xx series (Open Drain output type) and BU49xx series (CMOS output type) are shown below. RL RST BU48xx Micro controller CIN CL (Capacitor for noise filtering) GND Fig.15 Open Drain Output type VDD1 CASE1:The power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use the Open Drain Output Type (BU48xx series) attached a load resistance (RL) between the output and VDD2. (As shown Fig.15) CASE2:The power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use CMOS output type (BU43xx series) or Open Drain Output Type (BU48xx series) attached a load resistance (RL) between the output and VDD1. (As shown Fig.16) Micro RST controller BU49xx When a capacitance CL for noise filtering or setting the output delay time is connected to the Vout pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (Vout). CIN CL (Capacitor for noise filtering) GND Fig.16 CMOS Output type www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/10 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 BU48xx Series Datasheet BU49xx Series Operational Notes 1 . Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2. GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins that are over ground even if include transient feature. 3. Electrical Characteristics Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4. Bypass Capacitor for Noise Rejection Please put into the to reject noise between VDD pin and GND with 1uF over and between VOUT pin and GND with 1000pF. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5. Short Circuit between Terminal and Soldering Don't short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board please is unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6. Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7. The Vdd line inpedance might cause oscillation because of the detection current. 8. A Vdd -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9. Lower than the mininum input voltage makes the Vout high impedance, and it must be VDD in pull up (Vdd) condition. 10. Recommended value of RL Resistar is over 10k (VDET=1.5V~4.8V), over 100k (VDET=0.9~1.4V). 11. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10M leakage is assumed between the CT terminal and the GND terminal, 1M connection between the CT terminal and the Vdd terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. 12. External parameters For RL, the recommended range is 10k~1M. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 13. Power on reset operation Please note that the power on reset output varies with the Vcc rise up time. Please verify the actual operation. 14. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation.To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 15. When the power supply, is turned on because of incertain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/10 TSZ02201-0R7R0G300060-1-2 20.DEC.2011 Rev.002 Datasheet Notice Precaution for circuit design 1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 2) The products are designed for use in a standard environment and not in any special environments. Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] Use of the products in places subject to dew condensation 3) The products are not radiation resistant. 4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised. 5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 7) Confirm that operation temperature is within the specified range described in product specification. 8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed. Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the Company in advance. Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) The application examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made. Notice - Rev.001 Datasheet Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the products are stored in the following places: [a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company [c] Storage in direct sunshine or condensation [d] Storage in high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is exceeding recommended storage time period . 3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use products within the specified time after opening a dry bag. Precaution for product label QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a internal part number that is inconsistent with an product part number. Precaution for disposition When disposing products please dispose them properly with a industry waste company. Precaution for Foreign exchange and Foreign trade act Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Prohibitions Regarding Industrial Property 1) Information and data on products, including application examples, contained in these specifications are simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products. Notice - Rev.001