BU4825FVE-TR - Rohm Semiconductor

TSZ02201-0R7R0G300060-1-2

TSZ22111･14･001 1/10

20.DEC.2011 Rev.002

Datasheet

Voltage Detector IC Series

Low Voltage Standard

CMOS Voltage Detector ICs

BU48xx Series BU49xx Series

●General Description

ROHM standard CMOS reset IC series is a high-accuracy

low current consumption reset IC series. The lineup was

established with two output types (Nch open drain and

CMOS output) and detection voltage range from 0.9V to

4.8V in increments of 0.1V, so that the series may be

selected according to the application at hand.

●Features

 Ultra-low voltage detection

 Ultra-low current consumption

 High accuracy detection

 Two output types (Nch open drain and CMOS output)

 Wide operating temperature range

 Very small and low height package

●Key Specifications

 Detection voltage: 0.9V to 4.8V

0.1V steps

 High accuracy detection voltage: ±1.0%

 Ultra-low current consumption: 0.55µA (Typ.)

 Operating temperature range: -40°C to +125°C

●Package

SSOP5 2.90mm x 2.80mm x 1.15mm

SOP4 2.00mm x 2.10mm x 0.95mm

VSOF5 1.60mm x 1.60mm x 0.60mm

●Applications

All electronic devices that use micro controllers and logic

circuits

●Typical A pplication Circuit

●Connection Diagram & Pin Descriptions

SSOP5 SOP4 VSOF5

TOP VIEW TOP VIEW TOP VIEW

No. Symbol Function PIN

No. Symbol Function

1 VOUT Reset output 1 VOUT Reset output 1 VOUT Reset output

2 VDD Power supply voltage 2 VDD Power supply voltage 2 SUB Substrate*

3 GND GND 3 N.C. Unconnected terminal 3 N.C. Unconnected terminal

4 N.C. Unconnected terminal

4 GND GND 4 VDD Power supply voltage

5 N.C. Unconnected terminal

5 GND GND

*Connect the substrate to VDD

（Open Drain Output type）

BU48xx series

（CMOS Output type）

BU49xx series

VDD1

BU48xx

VDD2

GND

(Capacitor for

noise filtering)

CIN

RST Micro

controller

VDD1

BU49xx

CIN

GND

(Capacitor for

noise filtering)

RST Micro

controller

VOUT VDD

N.C.GND

1 2

3 4

Marking Lot. No

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

VOUT VDD GND

N.C. N.C.

Lot. No

Marking

VDD

VOUT SUB N.C

GND

Marking Lot. No

Datasheet

TSZ02201-0R7R0G300060-1-2

TSZ22111･15･001 2/10

20.DEC.2011 Rev.002

BU48xx Series BU49xx Series

●Ordering Information

B U 4 8 0 9 F － T R

BU48: Standard CMOS reset IC

Open drain type

BU49: Standard CMOS reset IC

CMOS Output type

Detection voltage

09 : 0.9V (0.1V step)

48 : 4.8V

Package

G: SSOP5

F: SOP4

FVE: VSOF5

Packaging and forming specification

TR: Embossed tape and reel

●Lineup

Making Detection

voltage

Part

Number Making Detection

voltage

Part

Number Making Detection

voltage

Part

Number Making Detection

voltage

Part

Number

JR 4.8V BU4848 HV 2.8V BU4828 LH 4.8V BU4948 KM 2.8V BU4928

JQ 4.7V BU4847 HU 2.7V BU4827 LG 4.7V BU4947 KL 2.7V BU4927

JP 4.6V BU4846 HT 2.6V BU4826 LF 4.6V BU4946 KK 2.6V BU4926

JN 4.5V BU4845 HS 2.5V BU4825 LE 4.5V BU4945 KJ 2.5V BU4925

JM 4.4V BU4844 HR 2.4V BU4824 LD 4.4V BU4944 KH 2.4V BU4924

JL 4.3V BU4843 HQ 2.3V BU4823 LC 4.3V BU4943 KG 2.3V BU4923

JK 4.2V BU4842 HP 2.2V BU4822 LB 4.2V BU4942 KF 2.2V BU4922

JJ 4.1V BU4841 HN 2.1V BU4821 LA 4.1V BU4941 KE 2.1V BU4921

JH 4.0V BU4840 HM 2.0V BU4820 KZ 4.0V BU4940 KD 2.0V BU4920

JG 3.9V BU4839 HL 1.9V BU4819 KY 3.9V BU4939 KC 1.9V BU4919

JF 3.8V BU4838 HK 1.8V BU4818 KX 3.8V BU4938 KB 1.8V BU4918

JE 3.7V BU4837 HJ 1.7V BU4817 KW 3.7V BU4937 KA 1.7V BU4917

JD 3.6V BU4836 HH 1.6V BU4816 KV 3.6V BU4936 JZ 1.6V BU4916

JO 3.5V BU4835 HG 1.5V BU4815 KU 3.5V BU4935 JY 1.5V BU4915

JB 3.4V BU4834 HF 1.4V BU4814 KT 3.4V BU4934 JX 1.4V BU4914

JA 3.3V BU4833 HE 1.3V BU4813 KS 3.3V BU4933 JW 1.3V BU4913

HZ 3.2V BU4832 HD 1.2V BU4812 KR 3.2V BU4932 JV 1.2V BU4912

HY 3.1V BU4831 HC 1.1V BU4811 KQ 3.1V BU4931 JU 1.1V BU4911

HX 3.0V BU4830 HB 1.0V BU4810 KP 3.0V BU4930 JT 1.0V BU4910

HW 2.9V BU4829 HA 0.9V BU4809 KN 2.9V BU4929 JS 0.9V BU4909

(Unit : mm)

SSOP5

2.9±0.2

0.13

4°+6°

−4°

1.6

2.8±0.2

1.1±0.05

0.05±0.05

+0.2

−0.1

+0.05

−0.03

0.42+0.05

−0.04

0.95

123

1.25Max.

0.2Min.

0.1

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

()

1pin

(Unit : mm)

SOP4

2.1±0.2

0.05

1.3

2.0±0.2

1.25 +0.2

–0.1

4°+6°

0.27±0.15

–4°

0.13 +0.05

–0.03

0.9±0.050.05±0.05

1.05Max.

0.32 +0.05

–0.04

0.42 +0.05

–0.04

0.1 S

(Unit : mm)

VSOF5

1.2±0.05

1.0±0.05

0.6MAX

0.22±0.05

0.5

1.6±0.05

0.13±0.05

0.2MAX

1.6±0.05

(MAX 1.28 include BURR)

Datasheet

TSZ02201-0R7R0G300060-1-2

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20.DEC.2011 Rev.002

BU48xx Series BU49xx Series

●Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Limits Unit

Power Supply Voltage VDD -0.3 to +7 V

Nch Open Drain Output GND-0.3 to +7

Output Voltage CMOS Output VOUT GND-0.3 to VDD+0.3 V

SSOP5 *1*4 540

SOP4 *2*4 400

Power

Dissipation VSOF5 *3*4

210

Operation Temperature Range Topt -40 to +125 °C

Ambient Storage Temperature Tstg -55 to +125 ℃

*1 When used at temperatures higher than Ta=25℃, the power is reduced by 5.4mW per 1℃ above 25℃.

*2 When used at temperatures higher than Ta=25℃, the power is reduced by 4.0mW per 1℃ above 25℃.

*3 When used at temperatures higher than Ta=25℃, the power is reduced by 2.1mW per 1℃ above 25℃.

*4 When a ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board)is mounted.

●Electrical Characteristics

Limits

Parameter Symbol Condition

Min. Typ. Max.

Unit

BU4848 4.752 4.800 4.848

BU4847 4.653 4.700 4.747

BU4846 4.554 4.600 4.646

BU4845 4.455 4.500 4.545

BU4844 4.356 4.400 4.444

BU4843 4.257 4.300 4.343

BU4842 4.158 4.200 4.242

BU4841 4.059 4.100 4.141

BU4840 3.960 4.000 4.040

BU4839 3.861 3.900 3.939

BU4838 3.762 3.800 3.838

BU4837 3.663 3.700 3.737

BU4836 3.564 3.600 3.636

BU4835 3.465 3.500 3.535

BU4834 3.366 3.400 3.434

BU4833 3.267 3.300 3.333

BU4832 3.168 3.200 3.232

BU4831 3.069 3.100 3.131

BU4830 2.970 3.000 3.030

BU4829 2.871 2.900 2.929

BU4828 2.772 2.800 2.828

BU4827 2.673 2.700 2.727

BU4826 2.574 2.600 2.626

BU4825 2.475 2.500 2.525

BU4824 2.376 2.400 2.424

BU4823 2.277 2.300 2.323

BU4822 2.178 2.200 2.222

BU4821 2.079 2.100 2.121

BU4820 1.980 2.000 2.020

BU4819 1.881 1.900 1.919

BU4818 1.782 1.800 1.818

BU4817 1.683 1.700 1.717

BU4816 1.584 1.600 1.616

BU4815 1.485 1.500 1.515

BU4814 1.386 1.400 1.414

BU4813 1.287 1.300 1.313

BU4812 1.188 1.200 1.212

BU4811 1.089 1.100 1.111

BU4810 0.990 1.000 1.010

Detection Voltage VDET

VDD=HÆL , Ta=25℃

RL=470kΩ

BU4809 0.891 0.900 0.909

Detection Voltage

Temperature Coefficient VDET/∆T Ta=-40℃~125℃ *1 - ±30 - ppm/℃

VDET≤1.0V VDET

×0.03

VDET

×0.05

VDET

×0.08

Hysteresis Voltage ∆VDET

VDD=LÆHÆL

Ta=-4 0℃~125℃

RL=470kΩ VDET≥1.1V VDET

×0.03

VDET

×0.05

VDET

×0.07

*1 Designed Guarantee.(Outgoing inspection is not done on all products.)

Datasheet

TSZ02201-0R7R0G300060-1-2

TSZ22111･15･001 4/10

20.DEC.2011 Rev.002

BU48xx Series BU49xx Series

Unless Otherwise Specified Ta=-25 to 125℃

Limit

Parameter Symbol Condition Min. Typ. Max.

Unit

VDET =0.9-1.3V - 0.15 0.88

VDET =1.4-2.1V - 0.20 1.05

VDET =2.2-2.7V - 0.25 1.23

VDET =2.8-3.3V - 0.30 1.40

VDET =3.4-4.2V - 0.35 1.58

Circuit Current when ON IDD1 VDD=VDET-0.2V

VDET =4.3-4.8V - 0.40 1.75

µA

VDET =0.9-1.3V - 0.30 1.40

VDET =1.4-2.1V - 0.35 1.58

VDET =2.2-2.7V - 0.40 1.75

VDET =2.8-3.3V - 0.45 1.93

VDET =3.4-4.2V - 0.50 2.10

Circuit Current when OFF IDD2 VDD=VDET+2.0V

VDET =4.3-4.8V - 0.55 2.28

µA

VOL≤0.4V, Ta=25~125℃, RL=470kΩ 0.70 - -

Operating Voltage Range VOPL VOL≤0.4V, Ta=-40~25℃, RL=470kΩ 0.90 - - V

VDS=0.05V VDD=0.85V 20 100 - µA

VDS=0.5V VDD=1.5V VDET=1.7-4.8V 1.0 3.3 -

‘Low’ Output Current (Nch) IOL

VDS=0.5V VDD=2.4V VDET=2.7-4.8V 4.0 7.2 - mA

VDS=0.5V VDD=4.8V VDET=0.9-3.9V 1.7 3.4 -

‘High’ Output Current (Pch)

(only BU49xx) IOH VDS=0.5V VDD=6.0V VDET=4.0-4.8V 2.0 4.0 - mA

VDD=VDS=7V

Ta=-4 0℃~85℃ - 0 0.1

Output Leak Current when

OFF

(only BU48xx)

Ileak VDD=VDS=7V

Ta=85 ℃~125℃ - 0 1

µA

* This product is not designed for protection against radioactive rays.

●Block Diagrams

Vref

VOUT

VDD

GND

Fig.1 BU48xx Series

Vref

VOUT

VDD

GND

Fig.2 BU49xx Series

Datasheet

TSZ02201-0R7R0G300060-1-2

TSZ22111･15･001 5/10

20.DEC.2011 Rev.002

BU48xx Series BU49xx Series

●Typical Performance Curves

Fig.3 Circuit Current

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

01 23 45 67

VDD SUPPLY VOLTAGE ：VDD[V]

CIRCUIT CURRENT ： IDD[μA]

【BU4816F】

0.0 0.5 1.0 1.5 2.0 2.5

DRAIN-SOURCE VOLTAGE ： VDS

[V]

"LOW" OUTPUT CURRENT ： IOL[mA]

VDD=1.2

【BU4816F】

Fig.4 “LOW” Output Current

0123456

DRAIN-SOURCE VOLTAGE ： VDS

[V]

"HIGH" OUTPUT CURRENT ：

IOH[mA]

【BU4916F】

VDD=6.0V

VDD=4.8V

Fig.5 “High” Output Current Fig.6 I/O Characteristics

01 23 45 67

VDD SUPPLY VOLTAGE ：VDD[V]

OUTPUT VOLTAGE

： VOUT [V]

【BU4816F】

【BU4816】

【BU4916】

【BU4916】【BU4816】

【BU4916】

【BU4816】

【BU4916】

Datasheet

TSZ02201-0R7R0G300060-1-2

TSZ22111･15･001 6/10

20.DEC.2011 Rev.002

BU48xx Series BU49xx Series

0.0

0.1

0.2

0.3

0.4

0.5

-40 0 40 80 120

TEMPERATURE ： Ta[℃]

CIRCUIT CURRENT WHEN ON ： IDD1 [μA]

【BU4816F】

Fig.9 Circuit Current when ON

Fig.10 Circuit Current when OFF

0.0

0.2

0.4

0.6

0.8

1.0

-40 0 40 80 120

TEMPERATURE ： Ta[℃]

CIRCUIT CURRENT WHEN OFF ： IDD2 [μA]

【BU4816F】

Fig.8 Detecting Voltage

Release Voltage

1.0

1.5

2.0

-40 0 40 80 120

TEMPERATURE ： Ta[℃]

DETECTION VOLTAGE

： VDET[V]

Low to hig h(VDET+ΔVDET)

High to low(VDET)

【BU4816F】

0.0

0.2

0.4

0.6

0.8

1.0

0.0 0.5 1.0 1.5 2.0 2.5

VDD SUPPLY VOLTAGE ： VDD[V]

OUTPUT VOLTAGE

： VOUT[V]

【BU4816F】

Fig.7 Operating Limit Voltage

【BU4816】

【BU4916】

【BU4816】

【BU4916】

【BU4816】

【BU4916】

【BU4816】

【BU4916】

Datasheet

TSZ02201-0R7R0G300060-1-2

TSZ22111･15･001 7/10

20.DEC.2011 Rev.002

BU48xx Series BU49xx Series

0.0

0.2

0.4

0.6

0.8

1.0

-40 0 40 80 120

TEMPERATURE ： Ta[℃]

MINIMUM OPERATING VOLTAGE ： VOPL [V]

【BU4816F】

Fig.11 Operating Limit Voltage

【BU4816】

【BU4916】

Datasheet

TSZ02201-0R7R0G300060-1-2

TSZ22111･15･001 8/10

20.DEC.2011 Rev.002

BU48xx Series BU49xx Series

●Applic at ion Informa tion

Explanation of Operation

For both the open drain type(Fig.12)and the CMOS output type(Fig.13), the detection and release voltages are used as

threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the Vout terminal

voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU48xx series uses an open drain output

type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this

case becomes VDD or the voltage of the other power supply].

Fig.12 (BU48xx type internal block diagram) Fig.13 (BU49xx type internal block diagram)

Reference Data

Examples of Output rising value(tPLH)and Output falling value(tPHL)

Part Number tPLH[µs] tPHL[µs]

BU4845 23.3 275.9

BU4945 3.5 354.3

VDD=4.3VÆ5.1V VDD=5.1VÆ4.3V

* This data is for reference only.

This figure will vary with the application, so please confirm actual operation conditions before use.

Timing Waveforms

Example:The following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output

voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in

Fig.12 and 13).

①When the power supply is turned on, the output is unsettled

from after over the operating limit voltage (VOPL) until tPHL.

Therefore it is possible that the reset signal is not outputted

when the rise time of VDD is faster than tPHL.

②When VDD is greater than VOPL but less than the reset release

voltage (VDET + VDET), output (VOUT) voltages will switch to L.

③If VDD exceeds the reset release voltage (VDET + VDET), then

VOUT switches from L to H (with a delay of tPLH).

④If VDD drops below the detection voltage (VDET) when the

power supply is powered down or when there is a power

supply fluctuation, VOUT switches to L (with a delay of tPHL).

⑤The potential deference between the detection voltage and the

release voltage is known as the hysteresis width (VDET). The

system is designed such that the output does not flip-flop with

power supply fluctuations within this hysteresis width,

preventing malfunctions due to noise.

Vref

VOUT

VDD

GND

VDD

RESET

Vref

VOUT

VDD

GND

RESET

VDD

VDET+ΔVDET

VDET

VOPL

tPHL

① ②

VOUT

tPLH

tPHL

tPLH

③ ④

VOL

VOH

⑤

Fig.14 Timing Waveforms

Datasheet

TSZ02201-0R7R0G300060-1-2

TSZ22111･15･001 9/10

20.DEC.2011 Rev.002

BU48xx Series BU49xx Series

Circuit A pplications

●Examples of a common power supply detection reset circuit

Application examples of BU48xx series

(Open Drain output type) and BU49xx series

(CMOS output type) are shown below.

CASE1:The power supply of the microcontroller (VDD2) differs

from the power supply of the reset detection (VDD1).

Use the Open Drain Output Type (BU48xx series)

attached a load resistance (RL) between the output and

VDD2. (As shown Fig.15)

CASE2:The power supply of the microcontroller (VDD1) is same

as the power supply of the reset detection (VDD1).

Use CMOS output type (BU43xx series) or Open Drain

Output Type (BU48xx series) attached a load

resistance (RL) between the output and VDD1.

(As shown Fig.16)

When a capacitance CL for noise filtering or setting the

output delay time is connected to the Vout pin (the reset

signal input terminal of the microcontroller), please take

into account the waveform of the rise and fall of the

output voltage (Vout).

VDD1

BU48xx

VDD2

GND

(Capacitor for

noise filtering)

CIN

RST Micro

controller

(Capacitor for

noise filtering)

VDD1

BU49xx

CIN

GND

RST Micro

controller

Fig.15 Open Drain Output type

Fig.16 CMOS Output type

Datasheet

TSZ02201-0R7R0G300060-1-2

TSZ22111･15･001 10/10

20.DEC.2011 Rev.002

BU48xx Series BU49xx Series

●Operational Notes

1 . Absolute maximum range

Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be

defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse,

is to be given when a specific mode to be beyond absolute maximum ratings is considered.

2 . GND potential

GND terminal should be a lowest voltage potential every state.

Please make sure all pins that are over ground even if include transient feature.

3 . Electrical Characteristics

Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature,

supply voltage, and external circuit.

4 . Bypass Capacitor for Noise Rejection

Please put into the to reject noise between VDD pin and GND with 1uF over and between VOUT pin and GND with

1000pF. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point.

5 . Short Circuit between Terminal and Soldering

Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering

the IC on circuit board please is unusually cautious about the orientation and the position of the IC. When the

orientation is mistaken the IC may be destroyed.

6 . Electromagnetic Field

Mal-function may happen when the device is used in the strong electromagnetic field.

7 . The Vdd line inpedance might cause oscillation because of the detection current.

8 . A Vdd -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9 . Lower than the mininum input voltage makes the Vout high impedance, and it must be VDD in pull up (Vdd) condition.

10. Recommended value of RL Resistar is over 10kΩ (VDET=1.5V~4.8V),

over 100kΩ (VDET=0.9~1.4V).

11. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might

cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is

assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the Vdd

terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the

pull up resistor should be less than 1/10 of the assumed leak resistance.

12. External parameters

For RL, the recommended range is 10kΩ~1MΩ. There are many factors (board layout, etc) that can affect

characteristics. Please verify and confirm using practical applications.

13. Power on reset operation

Please note that the power on reset output varies with the Vcc rise up time. Please verify the actual operation.

14. Precautions for board inspection

Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be

certain to use proper discharge procedure before each process of the test operation.To prevent electrostatic

accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain

ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations.

Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be

sure the power supply is OFF before removing any component connected to the test setup.

15. When the power supply, is turned on because of incertain cases, momentary Rash-current flow into the IC at the logic

unsettled, the couple capacitance, GND pattern of width and leading line must be considered.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

Datasheet

Notice - Rev.001

Notice

●Precaution for circuit design

1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA

equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be

used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft,

nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose

malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the

ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life,

sufficient fail-safe measures must be taken, including the following:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits in the case of single-circuit failure

2) The products are designed for use in a standard environment and not in any special environments. Application of the

products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of

product performance, prior to use, is recommended if used under the following conditions:

[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents

[b] Use outdoors where the products are exposed to direct sunlight, or in dusty places

[c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2,

and NO2

[d] Use in places where the products are exposed to static electricity or electromagnetic waves

[e] Use in proximity to heat-producing components, plastic cords, or other flammable items

[f] Use involving sealing or coating the products with resin or other coating materials

[g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering

[h] Use of the products in places subject to dew condensation

3) The products are not radiation resistant.

4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.

5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta).

When used in sealed area, confirm the actual ambient temperature.

7) Confirm that operation temperature is within the specified range described in product specification.

8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed.

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect

product performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

Company in advance.

Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics

of the products and external components, including transient characteristics, as well as static characteristics.

2) The application examples, their constants, and other types of information contained herein are applicable only when

the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient

consideration to external conditions must be made.

Datasheet

Notice - Rev.001

●Precaution for Electrostatic

This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper

caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products.

Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from

charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the products are stored in the following places:

[a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] Where the temperature or humidity exceeds those recommended by the Company

[c] Storage in direct sunshine or condensation

[d] Storage in high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is

exceeding recommended storage time period .

3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may

occur due to excessive stress applied when dropping of a carton.

4) Use products within the specified time after opening a dry bag.

●Precaution for product label

QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a

internal part number that is inconsistent with an product part number.

●Precaution for disposition

When disposing products please dispose them properly with a industry waste company.

●Precaution for Foreign exchange and Foreign trade act

Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act,

please consult with ROHM in case of export.

●Prohibitions Regarding Industrial Property

1) Information and data on products, including application examples, contained in these specifications are simply for

reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other

rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:

[a] infringement of the intellectual property rights of a third party

[b] any problems incurred by the use of the products listed herein.

2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial

property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use,

sell, or dispose of the products.