CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Fast switching for high efficiency
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - Green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
VRRM 50 100 200 300 400 600 800 1000 V
VRMS 35 70 140 210 280 420 560 700 V
VDC 50 100 200 300 400 600 800 1000 V
IF(AV) A
trr ns
Cj pF
RθJA OC/W
TJOC
TSTG OC
Version: I1901
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
HS
2AA
HS
2BA
HS
2DA
HS
2FA
HS
2GA
HS
2JA
HS
2KA
HS
2MA
1.0
Operating junction temperature range
- 55 to +150
Storage temperature range
- 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Typical junction capacitance (Note 3)
Typical thermal resistance
80
30
Maximum reverse current @ rated VR TJ=25 ℃
TJ=125 ℃
IR
5
μA
100
Maximum reverse recovery time (Note 2)
75
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
50
A
Maximum instantaneous forward voltage (Note 1)
@ 1.5 A
UNIT
VF
V
1.3
1.7
Maximum DC blocking voltage
Maximum average forward rectified current
1.5
MECHANICAL DATA
Case: DO-214AC (SMA)
DO-214AC(SMA)
Polarity: Indicated by cathode band
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Weight: 0.06 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
SYMBOL
HS2AA thru HS2MA
Taiwan Semiconductor
High Efficient Surface Mount Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
PART NO.
PART NO.
HS2MA
HS2MA
HS2MA
(TA=25℃ unless otherwise noted)
trr
Version: I1901
RATINGS AND CHARACTERISTICS CURVES
Note 1: "x" defines voltage from 50V (HS2AA) to 1000V (HS2MA)
EXAMPLE
HS2AA thru HS2MA
ORDERING INFORMATION
AEC-Q101
QUALIFIED
Taiwan Semiconductor
PACKING
HS2xA
(Note 1)
HS2MA R3
HS2MA R3G
PREFERRED P/N
F3
N/A
E3
PACKING CODE
GREEN COMPOUND
CODE
PACKAGE
Prefix "H"
R3
Suffix "G"
SMA
1,800 / 7" Plastic reel
R2
SMA
7,500 / 13" Paper reel
M2
SMA
7,500 / 13" Plastic reel
DESCRIPTION
Folded SMA
1,800 / 7" Plastic reel
F2
Folded SMA
7,500 / 13" Paper reel
F4
Folded SMA
7,500 / 13" Plastic reel
G
Green compound
Clip SMA
1,800 / 7" Plastic reel
E2
Clip SMA
7,500 / 13" Plastic reel
AEC-Q101
QUALIFIED
PACKING CODE
GREEN COMPOUND
CODE
H
R3
AEC-Q101 qualified
HS2MAHR3
R3
R3
0
0.5
1
1.5
2
020 40 60 80 100 120 140 160
AVERAGE FORWARD
CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
0
10
20
30
40
50
60
70
110 100
PEAK FORWARD SURGE URRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
0.1
1
10
100
1000
020 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
0.1
1
10
0.4 0.6 0.8 1 1.2 1.4 1.6
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
HS2AA-HS2FA
HS2GA
HS2JA-HS2MA
Min Max Min Max
A1.27 1.58 0.050 0.062
B4.06 4.60 0.160 0.181
C2.29 2.83 0.090 0.111
D1.99 2.50 0.078 0.098
E0.90 1.41 0.035 0.056
F4.95 5.33 0.195 0.210
G0.10 0.20 0.004 0.008
H0.15 0.31 0.006 0.012
trr
P/N = Specific Device Code
G = Green Compound
YW = Date Code
F = Factory Code
Version: I1901
MARKING DIAGRAM
C
3.93
D
2.41
E
5.45
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
A
1.68
B
1.52
Unit (inch)
0.066
0.060
0.155
0.095
0.215
HS2AA thru HS2MA
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM.
Unit (mm)
Unit (inch)
0
25
50
75
100
125
150
175
0.1 1 10 100 1000
CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
HS2AA-HS2GA
HS2JA-HS2MA
f=1.0MHz
Vslg=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Version: I1901
HS2AA thru HS2MA
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,