NCP4587DMX28TCG - ON SEMICONDUCTOR

February, 2012 − Rev. 3

1Publication Order Number:

NCP4587/D

NCP4587

150 mA, Tri-Mode, LDO

Linear Voltage Regulator

The NCP4587 is a CMOS 150 mA LDO which switches to a low

power mode under light current loads. The device automatically

switches back to a fast response mode as the output load increases

above 3 mA (typ.) or it can be placed in permanent fast mode through

a mode select pin. The family is available in a variety of packages:

SC−70, SOT23 and an ultra thin (0.4 mm) small 1.2 x 1.2 mm XDFN.

Features

•Operating Input Voltage Range: 1.4 V to 5.25 V

•Output Voltage Range: 0.8 to 4.0 V (Available in 0.1 V steps)

•Supply current: Low Power Mode – 1.0 mA

Fast Mode – 55 mA

Standby Mode – 0.1 mA

•Very Low Dropout: 120 mV Typ. at 150 mA (Vout > 2.6 V)

•±1% Output Voltage Accuracy (VOUT > 2 V, TJ = 25°C)

•High PSRR: 70 dB at 1 kHz (Fast response mode)

•Line Regulation 0.02%/V Typ.

•Current Fold Back Protection

•Stable with Ceramic Capacitors

•Available in 1.2 x 1.2 XDFN, SC−70 and SOT23 Package

•These are Pb−Free Devices

Typical Applications

•Battery Powered Equipments

•Portable Communication Equipments

•Cameras, Image Sensors and Camcorders

VIN VOUT

GND

C1 C2

VIN VOUT

NCP4587x

Figure 1. Typical Application Schematic

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See detailed ordering and shipping information in the package

dimensions section on page 16 of this data sheet.

ORDERING INFORMATION

SC−70

CASE 419A

XX, XXX= Specific Device Code

MM = Date Code

MARKING

DIAGRAMS

XDFN6

CASE 711AA

SOT−23−5

CASE 1212

XXX

XMM

XXXMM

NCP4587

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Current Limit

VIN

GND

Vref

VOUT

NCP4587Hxxxx

Current Limit

VIN

GND

Vref

VOUT

NCP4587Dxxxx

Figure 2. Simplified Schematic Block Diagram

PIN FUNCTION DESCRIPTION

Pin No.

XDFN

Pin No.

SC−70

Pin No.

SOT23 Pin Name Description

4 4 1 VIN Input pin

2 2 2 GND Ground

3 5 3 CE Chip enable pin (active “H”)

6 3 5 VOUT Output pin

1 1 4 AE Auto Eco Pin

5− − NC No connection

ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit

Input Voltage (Note 1) VIN 6.0 V

Output Voltage VOUT −0.3 to VIN + 0.3 V

Chip Enable Input VCE −0.3 to 6.0 V

Auto Eco Input VAE −0.3 to 6.0 V

Output Current IOUT 400 mA

Power Dissipation XDFN PD400 mW

Power Dissipation SC−70 380

Power Dissipation SOT23 420

Maximum Junction Temperature TJ(MAX) 150 °C

Storage Temperature TSTG −55 to 125 °C

Operation Temperature TA−40 to 85 °C

ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V

ESD Capability, Machine Model (Note 2) ESDMM 200 V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

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THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal Characteristics, XDFN

Thermal Resistance, Junction−to−Air

RqJA 250

°C/W

Thermal Characteristics, SOT23

Thermal Resistance, Junction−to−Air

RqJA 238

°C/W

Thermal Characteristics, SC−70

Thermal Resistance, Junction−to−Air

RqJA 263

°C/W

ELECTRICAL CHARACTERISTICS

−40°C ≤ TA ≤ 85°C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 0.47 mF, unless otherwise noted.

Typical values are at TA = +25°C.

Parameter Test Conditions Symbol Min Typ Max Unit

Operating Input Voltage VIN 1.4 5.25 V

Output Voltage TA = +25 °C,

IOUT = 5 mA

VOUT > 2 V VOUT x0.99 x1.01 V

VOUT ≤ 2 V −20 20 mV

−40°C ≤ TA ≤ 85°C,

IOUT = 5 mA

VOUT > 2 V x0.975 x1.015 V

VOUT ≤ 2 V −50 30 mV

Output Voltage Temp.

Coefficient

TA = −40 to 85°C±50 ppm/°C

Line Regulation VIN = VOUT + 0.5 V to

5 V, VIN ≥ 1.4 V

IOUT = 1 mA,

(Low Power Mode)

LineReg 0.50 %/V

IOUT = 10 mA,

(Fast Mode)

0.02 0.20

Load Regulation IOUT = 1 mA to 10 mA VOUT > 2.0 V LineReg −1.0 1.0 %

VOUT ≤ 2.0 V −20 20 mV

IOUT = 10 mA to 150 mA 18 40 mV

Dropout Voltage IOUT = 150 mA 0.8 V ≤ VOUT < 0.9 V VDO (Note 3) V

0.9 V ≤ VOUT < 1.0 V (Note 3)

1.0 V ≤ VOUT < 1.5 V 0.24 0.4

1.5 V ≤ VOUT < 2.6 V 0.19 0.25

2.6 V ≤ VOUT < 4.0 V 0.12 0.18

Output Current IOUT 150 mA

Short Current Limit VOUT = 0 V ISC 50 mA

Quiescent Current IOUT = 0 mA,

Low Power Mode

(Note 4)

VOUT ≤ 1.85 V IQ1.0 4.0 mA

VOUT > 1.85 V 1.5 4.0

Supply Current IOUT = 10 mA, Fast Mode IGND 55 mA

Standby Current VCE = 0 V, TJ = 25°C ISTB 0.1 1 mA

Fast Mode Switch−Over Current IOUT = light to heavy load IOUTH 8.0 mA

Low Power Switch−Over

Current

IOUT = heavy to light load IOUTL 1.0 2.0 mA

CE Pin Threshold Voltage CE Input Voltage “H” VCEH 1.0 V

CE Input Voltage “L” VCEL 0.4

CE Pull Down Current ICEPD 0.1 mA

3. VIN > 1.4 V condition is dominant against this specification

4. The value of quiescent current is excluding the pull−down current of CE and AE pin

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ELECTRICAL CHARACTERISTICS

−40°C ≤ TA ≤ 85°C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 0.47 mF, unless otherwise noted.

Typical values are at TA = +25°C.

Parameter UnitMaxTypMinSymbolTest Conditions

AE Pin Threshold Voltage AE Input Voltage “H” VAEH 1.0 V

AE Input Voltage “L” VAEL 0.4

AE Pull Down Current IAEPD 0.1 mA

Power Supply Rejection Ratio VIN = VOUT + 1 V or 2.2 V whichever is higher,

DVIN = 0.2 Vpk−pk, IOUT = 30 mA, f = 1 kHz, Fast

Mode

PSRR 70 dB

Output Noise Voltage VOUT = 1.2 V, IOUT = 30 mA, f = 10 Hz to

100 kHz

VN115 mVrms

Low Output Nch Tr. On

Resistance

VIN = 4 V, VCE = 0 V RLOW 50 W

3. VIN > 1.4 V condition is dominant against this specification

4. The value of quiescent current is excluding the pull−down current of CE and AE pin

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TYPICAL CHARACTERISTICS

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 50 100 150 200 250 300 350 400

Figure 3. Output Voltage vs. Output Current

1.2 V Version (TA = 255C)

IOUT (mA)

VOUT (V)

VIN = 5.5 V

1.8 V

2.8 V

3.8 V

5.25 V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 50 100 150 200 250 300

3.8 V

5.25 V

VIN = 5.5 V

Figure 4. Output Voltage vs. Output Current

2.8 V Version (TA = 255C)

IOUT (mA)

VOUT (V)

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0 30 60 90 120 150

IOUT (mA)

VDO (V)

85°C

25°C

−40°C

Figure 5. Dropout Voltage vs. Output Current

1.2 V Version

0.00

0.03

0.06

0.09

0.12

0.15

0.18

0 30 60 90 120 150

IOUT (mA)

VDO (V)

Figure 6. Dropout Voltage vs. Output Current

2.8 V Version

85°C

25°C

−40°C

0.2

0.4

0.6

0.8

1.0

1.2

1.4

012345

VIN (V)

VOUT (V)

Figure 7. Input Voltage vs. Output Voltage

1.2 V Version

IOUT = 50 mA

30 mA

1 mA

0.0

0.5

1.0

1.5

2.0

2.5

3.0

012345

VIN (V)

Figure 8. Input Voltage vs. Output Voltage

2.8 V Version

VOUT (V)

30 mA

IOUT = 50 mA

1 mA

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TYPICAL CHARACTERISTICS

1.14

1.16

1.18

1.20

1.22

1.24

−40 −200 20406080

TJ, JUNCTION TEMPERATURE (°C)

VOUT (V)

VIN = 2.2 V

Figure 9. Output Voltage vs. Temperature,

1.2 V Version

2.74

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

−40 −200 20406080

TJ, JUNCTION TEMPERATURE (°C)

VOUT (V)

Figure 10. Output Voltage vs. Temperature,

2.8 V Version

VIN = 3.8 V

012345

IGND (mA)

VIN (V)

Figure 11. Supply Current vs. Input Voltage,

1.2 V Version

IOUT = 0 mA

IOUT = 10 mA

012345

IGND (mA)

VIN (V)

Figure 12. Supply Current vs. Input Voltage,

2.8 V Version

IOUT = 0 mA

IOUT = 10 mA

100

120

140

160

0.1 1 10 100 1000

IGND (mA)

IOUT (mA)

Figure 13. Supply Current vs. Output Current,

1.2 V Version, VIN = 2.2 V, VAE = 0 V

Light to

Heavy Load

Heavy to

Light Load

100

120

140

160

0.1 1 10 100 1000

IGND (mA)

IOUT (mA)

Figure 14. Supply Current vs. Output Current,

2.8 V Version, VIN = 3.8 V, VAE = 0 V

Light to

Heavy Load

Heavy to

Light Load

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TYPICAL CHARACTERISTICS

−40 −200 20406080

0.0

0.5

1.0

1.5

2.0

2.5

3.0

IIN (mA)

TJ, JUNCTION TEMPERATURE (°C)

Figure 15. Supply Current vs. Temperature,

1.2 Version, VIN = 2.2 V, VAE = 0 V

IIN (mA)

TJ, JUNCTION TEMPERATURE (°C)

Figure 16. Supply Current vs. Temperature,

2.8 Version, VIN = 3.8 V, VAE = 0 V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

IIN (mA)

TJ, JUNCTION TEMPERATURE (°C)

Figure 17. Supply Current vs. Temperature,

1.2 Version, VIN = 2.2 V, VAE = 2.2 V

−40 −200 20406080

IIN (mA)

TJ, JUNCTION TEMPERATURE (°C)

Figure 18. Supply Current vs. Temperature,

2.8 Version, VIN = 3.8 V, VAE = 3.8 V

−40 −200 20406080

100

0.1 1 10 100 1000

PSRR (dB)

FREQUENCY (kHz)

Figure 19. PSRR, 1.2 V Version, VIN = 2.2 V

IOUT = 1 mA Low

IOUT = 1 mA High

IOUT = 30 mA

IOUT = 50 mA

IOUT = 100 mA

100

0.1 1 10 100 1000

PSRR (dB)

FREQUENCY (kHz)

Figure 20. PSRR, 2.8 V Version, VIN = 3.8 V

IOUT = 1 mA High

IOUT = 30 mA

IOUT = 50 mA

IOUT = 100 mA

IOUT = 1 mA Low

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TYPICAL CHARACTERISTICS

Figure 21. Output Voltage Noise, 1.2 V Version,

IOUT = 30 mA, , VIN = 2.2 V

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

0.01 0.1 1 10 100 1000

VN (mVrms/

√

Hz)

FREQUENCY (kHz)

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

0.01 0.1 1 10 100 100

VN (mVrms/√Hz)

FREQUENCY (kHz)

Figure 22. Output Voltage Noise, 2.8 V Version,

IOUT = 30 mA, VIN = 3.8 V

Figure 23. Line Transients, 1.2 V Version,

tR = tF = 5 ms, IOUT = 1 mA, AE = 0 V

1.14

1.16

1.18

1.20

1.22

1.24

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

2.2

2.7

3.2

3.7

VOUT (V)

t (ms)

VIN (V)

Figure 24. Line Transients, 2.8 V Version,

tR = tF = 5 ms, IOUT = 1 mA, AE = 0 V

2.74

2.76

2.78

2.80

2.82

2.84

2.86

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

3.8

4.3

4.8

5.3

VOUT (V)

t (ms)

VIN (V)

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TYPICAL CHARACTERISTICS

Figure 25. Line Transients, 1.2 V Version,

tR = tF = 5 ms, IOUT = 30 mA, AE = VIN V

1.194

1.196

1.198

1.200

1.202

1.204

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

2.2

2.7

3.2

3.7

VOUT (V)

t (ms)

VIN (V)

Figure 26. Line Transients, 2.8 V Version,

tR = tF = 5 ms, IOUT = 30 mA, AE = VIN V

2.794

2.796

2.798

2.800

2.802

2.804

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

3.8

4.3

4.8

5.3

VOUT (V)

t (ms)

VIN (V)

Figure 27. Load Transients, 1.2 V Version,

IOUT = 1 – 150 mA, tR = tF = 0.5 ms, VIN = 2.2 V,

AE = 0 V

1.00

1.05

1.10

1.15

1.20

1.25

1.30

0 20 40 60 80 100 120 140 160 180 200

150

225

VOUT (V)

t (ms)

IOUT (mA)

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TYPICAL CHARACTERISTICS

Figure 28. Load Transients, 2.8 V Version,

IOUT = 1 – 150 mA, tR = tF = 0.5 ms, VIN = 2.2 V,

AE = 0 V

2.60

2.65

2.70

2.75

2.80

2.85

2.90

0 20 40 60 80 100 120 140 160 180 200

150

225

VOUT (V)

t (ms)

IOUT (mA)

Figure 29. Load Transients, 1.2 V Version,

IOUT = 1 – 150 mA, tR = tF = 0.5 ms, VIN = 2.2 V,

AE = VIN V

VOUT (V)

t (ms)

IOUT (mA)

150

225

1.00

1.05

1.10

1.15

1.20

1.25

1.30

0 20 40 60 80 100 120 140 160 180 200

Figure 30. Load Transients, 2.8 V Version,

IOUT = 1 – 150 mA, tR = tF = 0.5 ms, VIN = 2.8 V,

AE = VIN V

2.60

2.65

2.70

2.75

2.80

2.85

2.90

0 20 40 60 80 100 120 140 160 180 200

150

225

VOUT (V)

t (ms)

IOUT (mA)

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TYPICAL CHARACTERISTICS

Figure 31. Load Transients, 1.2 V Version,

IOUT = 1 – 50 mA, tR = tF = 0.5 ms, VIN = 2.2 V,

AE = 0 V

1.12

1.14

1.16

1.18

1.20

1.22

1.24

0 20 40 60 80 100 120 140 160 180 200

VOUT (V)

t (ms)

IOUT (mA)

Figure 32. Load Transients, 2.8 V Version,

IOUT = 1 – 50 mA, tR = tF = 0.5 ms, VIN = 3.8 V,

AE = 0 V

VOUT (V)

t (ms)

IOUT (mA)

Figure 33. Load Transients, 1.2 V Version,

IOUT = 1 – 50 mA, tR = tF = 0.5 ms, VIN = 2.2 V,

AE = VIN V

1.12

1.14

1.16

1.18

1.20

1.22

1.24

0 20 40 60 80 100 120 140 160 180 200

VOUT (V)

t (ms)

IOUT (mA)

2.72

2.74

2.76

2.78

2.80

2.82

2.84

0 20 40 60 80 100 120 140 160 180 200

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TYPICAL CHARACTERISTICS

Figure 34. Load Transients, 2.8 V Version,

IOUT = 1 – 50 mA, tR = tF = 0.5 ms, VIN = 3.8 V, AE

= VIN V

2.72

2.74

2.76

2.78

2.80

2.82

2.84

0 20 40 60 80 100 120 140 160 180 200

VOUT (V)

t (ms)

IOUT (mA)

Figure 35. Load Transients, 1.2 V Version,

IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 2.2 V

1.16

1.17

1.18

1.19

1.20

1.21

1.22

0 20 40 60 80 100 120 140 160 180 200

100

150

VOUT (V)

t (ms)

IOUT (mA)

Figure 36. Load Transients, 2.8 V Version,

IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 3.8 V

2.76

2.77

2.78

2.79

2.80

2.81

2.82

0 20 40 60 80 100 120 140 160 180 200

100

150

VOUT (V)

t (ms)

IOUT (mA)

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TYPICAL CHARACTERISTICS

Figure 37. AE Switch Transients, 1.2 V Version,

VIN = 2.2 V, IOUT = 1 mA

1.16

1.17

1.18

1.19

1.20

1.21

1.22

012345678910

VOUT (V)

t (ms)

VAE (V)

Figure 38. AE Switch Transients, 2.8 V Version,

VIN = 3.8 V, IOUT = 1 mA

2.76

2.77

2.78

2.79

2.80

2.81

2.82

012345678910

VOUT (V)

t (ms)

VAE (V)

Figure 39. Start-up, 1.2 V Version, VIN = 2.0 V

−0.5

0.0

0.5

1.0

1.5

0 102030405060708090100

VOUT (V)

t (ms)

VCE (V)

IOUT = 1 mA

Chip Enable

IOUT = 30 mA

IOUT = 150 mA

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TYPICAL CHARACTERISTICS

Figure 40. Start-up, 2.8 V Version, VIN =3.8 V

−1.0

0.0

1.0

2.0

3.0

0 102030405060708090100

VOUT (V)

t (ms)

VCE (V)

IOUT = 1 mA

Chip Enable

IOUT = 30 mA

IOUT = 150 mA

Figure 41. Shutdown, 1.2 V Version, VIN = 2.2 V

−0.5

0.0

0.5

1.0

1.5

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

VOUT (V)

t (ms)

VCE (V)

Chip Enable

IOUT = 150 mA

IOUT = 30 mA

IOUT = 1 mA

Figure 42. Shutdown, 2.8 V Version, VIN = 3.8 V

−1.0

0.0

1.0

2.0

3.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

VOUT (V)

t (ms)

VCE (V)

Chip Enable

IOUT = 150 mA

IOUT = 30 mA

IOUT = 1 mA

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APPLICATION INFORMATION

A typical application circuit for NCP4587 series is shown

in Figure 43.

VIN VOUT

GND

C1 C2

VIN VOUT

NCP4587x

Figure 43. Typical Application Schematic

Input Decoupling Capacitor (C1)

A 1 mF ceramic input decoupling capacitor should be

connected as close as possible to the input and ground pin of

the NCP4587. Higher values and lower ESR improves line

transient response.

Output Decoupling Capacitor (C2)

A 1 mF ceramic output decoupling capacitor is sufficient

to achieve stable operation of the IC. If tantalum capacitor

is used, and its ESR is high, the loop oscillation may result.

If output capacitor is composed from few ceramic capacitors

in parallel, the operation can be unstable. The capacitor

should be connected as close as possible to the output and

ground pin. Larger values and lower ESR improves dynamic

parameters.

Enable Operation

Enable pin CE may be used for turning the regulator on

and off. The regulator is switched on when CE pin voltage

is above logic high level. Enable pin has internal pull down

current source. If enable function is not needed connect CE

pin to VIN.

Current Limit

This regulator includes fold-back type current limit

circuit. This type of protection doesn’t limit current up to

current capability in normal operation, but when over

current occurs, the output voltage and current decrease until

the over current condition ends. Typical characteristics of

this protection type can be observed in the Output Voltage

versus Output Current graphs shown in the typical

characteristics chapter of this datasheet.

Output Discharger

The D version includes a transistor between VOUT and

GND that is used for faster discharging of the output

capacitor. This function is activated when the IC goes into

disable mode.

Auto ECO and Fast Mode

The NCP4587 has two operation modes that have impact

on supply current and transient response at low output

current. These two modes can be selected by AE pin. If AE

pin is at low level or floating Auto ECO mode is available.

Please, see supply current vs. output current charts. If AE pin

is at high level the device works in permanent Fast Transient

Mode.

Thermal

As power across the IC increases, it might become

necessary to provide some thermal relief. The maximum

power dissipation supported by the device is dependent

upon board design and layout. Mounting pad configuration

on the PCB, the board material, and also the ambient

temperature affect the rate of temperature rise for the part.

That is to say, when the device has good thermal

conductivity through the PCB, the junction temperature will

be relatively low with high power dissipation applications.

PCB layout

Make VIN and GND line sufficient. If their impedance is

high, noise pickup or unstable operation may result. Connect

capacitors C1 and C2 as close as possible to the IC, and make

wiring as short as possible.

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ORDERING INFORMATION

Device

Nominal Output

Voltage Description Marking Package Shipping†

NCP4587DMX12TCG 1.2 V Auto discharge YE XDFN

(Pb−Free)

5000 / Tape & Reel

NCP4587DMX18TCG 1.8 V Auto discharge YL XDFN

(Pb−Free)

5000 / Tape & Reel

NCP4587DMX28TCG 2.8 V Auto discharge YW XDFN

(Pb−Free)

5000 / Tape & Reel

NCP4587DMX30TCG 3.0 V Auto discharge YY XDFN

(Pb−Free)

5000 / Tape & Reel

NCP4587DMX31TCG 3.1 V Auto discharge YZ XDFN

(Pb−Free)

5000 / Tape & Reel

NCP4587DMX33TCG 3.3 V Auto discharge ZB XDFN

(Pb−Free)

5000 / Tape & Reel

NCP4587DSN12T1G 1.2 V Auto discharge DBE SOT−23

(Pb−Free)

3000 / Tape & Reel

NCP4587DSN18T1G 1.8 V Auto discharge DBL SOT−23

(Pb−Free)

3000 / Tape & Reel

NCP4587DSN28T1G 2.8 V Auto discharge DBW SOT−23

(Pb−Free)

3000 / Tape & Reel

NCP4587DSN30T1G 3.0 V Auto discharge DBY SOT−23

(Pb−Free)

3000 / Tape & Reel

NCP4587DSN33T1G 3.3 V Auto discharge EBB SOT−23

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NOTE: To order other package and voltage variants, please contact your ON Semiconductor sales representative.

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PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 419A−01 OBSOLETE. NEW STANDARD

419A−02.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

DIM

MIN MAX MIN MAX

MILLIMETERS

1.80 2.200.071 0.087

INCHES

B1.15 1.350.045 0.053

C0.80 1.100.031 0.043

D0.10 0.300.004 0.012

G0.65 BSC0.026 BSC

H--- 0.10---0.004

J0.10 0.250.004 0.010

K0.10 0.300.004 0.012

N0.20 REF0.008 REF

S2.00 2.200.079 0.087

B0.2 (0.008) MM

12 3

D 5 PL

−B−

SC−88A (SC−70−5/SOT−353)

CASE 419A−02

ISSUE K

NCP4587

http://onsemi.com

PACKAGE DIMENSIONS

ÍÍÍ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.25mm FROM TERMINAL TIPS.

4. COPLANARITY APPLIES TO ALL OF THE

TERMINALS.

SEATING

PLANE

0.05 C

2X 0.05 C

XDFN6 1.2x1.2, 0.4P

CASE 711AA−01

ISSUE O

DIM

MIN MAX

MILLIMETERS

--- 0.40

A1 0.00 0.05

b0.13 0.23

PIN ONE

REFERENCE

0.05 C

NOTE 3

MOUNTING FOOTPRINT*

1.20 BSC

0.40 BSC

0.37 0.48

BOTTOM VIEW

DIMENSIONS: MILLIMETERS

0.66

6X 0.22

1.50

0.40

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

C0.20 0.30

TOP VIEW

SIDE VIEW

NOTE 4

RECOMMENDED

0.05 BC

PACKAGE

OUTLINE

NCP4587

http://onsemi.com

PACKAGE DIMENSIONS

SOT−23

CASE 1212−01

ISSUE A

DIM MIN MAX

MILLIMETERS

A1 0.00 0.10

A2 1.00 1.30

b0.30 0.50

c0.10 0.25

D2.70 3.10

E2.50 3.10

E1 1.50 1.80

e0.95 BSC

L1 0.45 0.75

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSIONS: MILLIMETERS.

3. DATUM C IS THE SEATING PLANE.

0.10 C S

0.05

0.20 ---

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.95

DIMENSIONS: MILLIMETERS

PITCH

3.30

0.56

0.85

A--- 1.45

RECOMMENDED

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