BAS40/ -04/ -05/ -06 SURFACE MOUNT SCHOTTKY BARRIER DIODE Product Summary @TA = +25C Features and Benefits VRRM (V) IO (mA) VFmax (V) IRmax (A) Low Forward Voltage Drop 40 200 1.0 0.2 Fast Switching PN Junction Guard Ring for Transient and ESD Protection Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Description Mechanical Data 200mA surface mount Schottky Barrier Diode in SOT23 package, offers low forward voltage drop and fast switching capability, designed with PN Junction Guard Ring for Transient and ESD Protection, totally lead-free finish and RoHS compliant, "Green" device. Case: SOT23 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Solderable per MIL-STD-202, Method 208 e3 Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). Top View BAS40 Polarity: See Diagrams Below Weight: 0.008 grams (approximate) BAS40-04 BAS40-05 BAS40-06 Ordering Information (Note 4 & 5) Part Number BAS40-7-F / BAS40Q-7-F BAS40-04-7-F / BAS40-04Q-7-F BAS40-05-7-F / BAS40-05Q-7-F BAS40-06-7-F / BAS40-06Q-7-F BAS40-13-F / BAS40Q-13-F BAS40-04-13-F / BAS40-04Q-13-F BAS40-05-13-F / BAS40-05Q-13-F BAS40-06-13-F / BAS40-06Q-13-F Notes: Case SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 Packaging 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 10000/Tape & Reel 10000/Tape & Reel 10000/Tape & Reel 10000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 5. Products manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Products manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. BAS40/ -04/ -05/ -06 Document number: DS11006 Rev. 25 - 2 1 of 5 www.diodes.com December 2013 (c) Diodes Incorporated BAS40/ -04/ -05/ -06 Marking Information Shanghai A/T Site Date Code Key Year 1999 Code K Month Code 2000 L Jan 1 2001 M xxx = Product Type Marking Code K43 = BAS40 K44 = BAS40-04 K45 = BAS40-05 K46 = BAS40-06 YM = Date Code Marking for SAT (Shanghai Assembly/ Test site) Y M = Date Code Marking for CAT (Chengdu Assembly/ Test site) Y or Y = Year (ex: A = 2013) M = Month (ex: 9 = September) Chengdu A/T Site 2002 N Feb 2 Mar 3 2003 P 2004 R Apr 4 2005 S 2006 T May 5 2007 U 2008 V Jun 6 Jul 7 2009 W 2010 X Aug 8 2011 Y Sep 9 2012 Z Oct O 2013 A 2014 B Nov N 2015 C Dec D Maximum Ratings (@TA = +25C, unless otherwise specified.) Characteristic Symbol Value Unit VRRM VRWM VR 40 V Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Forward Continuous Current (Note 6) Forward Surge Current (Note 6) IFM 200 mA IFSM 600 mA Symbol Value Unit PD 350 mW RJA 357 C/W TJ -55 to +125 C TSTG -65 to +150 C @ t < 1.0s Thermal Characteristics Characteristic Power Dissipation (Note 6) Thermal Resistance, Junction to Ambient Air (Note 6) Operating Temperature Range Storage Temperature Range Electrical Characteristics (@TA = +25C, unless otherwise specified.) Characteristic Reverse Breakdown Voltage (Note 7) Forward Voltage Symbol Min Typ Max Unit V(BR)R 40 V 380 1000 mV tp < 300s, IF = 1.0mA tp < 300s, IF = 40mA VF Test Condition IR = 10A Reverse Leakage Current (Note 7) IR 20 200 nA tp < 300s, VR = 30V Total Capacitance CT 4.0 5.0 pF VR = 0V, f =1.0MHz Reverse Recovery Time trr 5.0 ns IF = IR = 10mA to IR = 1.0mA, RL = 100 Notes: 6. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 7. Short duration pulse test used to minimize self-heating effect. BAS40/ -04/ -05/ -06 Document number: DS11006 Rev. 25 - 2 2 of 5 www.diodes.com December 2013 (c) Diodes Incorporated BAS40/ -04/ -05/ -06 IF, INSTANTANEOUS FORWARD CURRENT (A) PD, POWER DISSIPATION (mW) 400 300 200 100 0 0 1 0.1 0.01 0.001 0.0001 160 200 40 80 120 TA, AMBIENT TEMPERATURE (C) Figure 1 Power Derating Curve, Total Package 0.2 0.4 0.6 0 0.8 1.0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 2 Typical Forward Characteristics 3 1,000 CT, TOTAL CAPACITANCE (pF) IR , INSTANTANEOUS REVERSE CURRENT (nA) 10,000 100 10 1 0.1 0 10 20 30 40 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Figure 3 Typical Reverse Characteristics BAS40/ -04/ -05/ -06 Document number: DS11006 Rev. 25 - 2 3 of 5 www.diodes.com 2 1 0 0 10 30 40 20 VR, DC REVERSE VOLTAGE (V) Figure 4 Total Capacitance vs. Reverse Voltage December 2013 (c) Diodes Incorporated BAS40/ -04/ -05/ -06 Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. 7 l l A H J K 1 K a M A 1 L L B C D SOT23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.890 1.00 0.975 K1 0.903 1.10 1.025 L 0.45 0.61 0.55 L1 0.25 0.55 0.40 M 0.085 0.150 0.110 a 8 All Dimensions in mm Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. Y Z C X BAS40/ -04/ -05/ -06 Document number: DS11006 Dimensions Value (in mm) Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35 Rev. 25 - 2 E 4 of 5 www.diodes.com December 2013 (c) Diodes Incorporated BAS40/ -04/ -05/ -06 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2013, Diodes Incorporated www.diodes.com BAS40/ -04/ -05/ -06 Document number: DS11006 Rev. 25 - 2 5 of 5 www.diodes.com December 2013 (c) Diodes Incorporated