Military Program Overview Corporate Philosophy MIL-STD-883 Compliance Lattice Semiconductor Corporation (LSC) is committed to leadership in device performance and quality. Our family of military ispLSI(R) and GAL(R) devices is a reflection of this philosophy. LSC manufactures all devices under strict Quality Assurance guidelines. All grades, Commercial through Military 883, are monitored under a quality program conformant to MIL-I-38535 Appendix C with inspections conformant to MIL-I-45208. MIL-STD-883 defines a uniform and precise method for environmental, mechanical and electrical testing which ensures the suitability of microelectronic devices for use in military and aerospace systems. Table I summarizes the MIL-STD-883, Method 5004 Class B flow. Table II summarizes the conformance testing required by MILSTD-883, Method 5005, for quality conformance testing of LSC military microcircuits. Quality and Testability MIL-I-38535 Lattice Semiconductor processes its devices to strict conformance with MIL-STD-883 Class B. In conjunction with the military flow, the inherent testability of E2CMOS(R) technology allows LSC to achieve a quality level superior to other PLD technologies. MIL-I-38535 Appendix A and C, when used in conjunction with MIL-STD-883, define design, packaging, material, marking, sampling, qualification and quality system requirements for LSC military devices. Group Data All devices are patterned and tested dozens of times throughout the manufacturing flow. Every device is tested under worst case configurations to assure customers achieve 100% yields. Tests are performed using the same E2 cell array that will be used for the final patterning of the devices. This 100% "actual test" philosophy does away with the correlated and simulated testing that is necessary with bipolar and UV (EPROM) based PLD devices. Group A and B data is taken on every inspection lot per MIL-STD-883, Class B requirements. This data, along with Generic Group C and D data can be supplied, upon written request, with your device shipment. Your LSC sales representative can advise you of charges and leadtime necessary for providing this data. Standard Military Drawings LSC actively supports the DESC Standard Military Drawing (SMD) Program. The SMD Program offers a cost effective alternative to source control drawings and provides standardized MIL-STD-883 product specifications to simplify military procurement. Reliability Lattice Semiconductor performs extensive reliability testing prior to product release. This testing continues in the form of Reliability Monitors that are run on an ongoing basis to assure continued process integrity. A list of currently available SMD qualified devices is provided (see Military Ordering Information). The reliability testing performed includes extensive analysis of fundamental design and process integrity. The reprogrammable nature of LSC devices allows an inherently more thorough reliability evaluation than with other programmable alternatives. miloview_02 1 September 1998 Military Program Overview Military Quality Conformance Inspections (Table II) Military Screening Flow (Table I) Screen Method Requirement Internal Visual Temp. Cycling Constant Acceleration Hermeticity Fine Gross Endurance Test Retention Test 2010 Cond. B 1010 Cond. C 2001 Cond. E 1014 Cond. A or B Cond. C 1033 Unbiased Bake 24 HRS. TA = 180C Applicable Device Specification Tc = 25C 1015 Cond. D Applicable Device Specification Tc = 25C PDA = 5% Applicable Device Specification Tc = 125C Applicable Device Specification Tc = - 55C Applicable Device Specification Tc = 25C 2009 MIL-M-38535, Appendix A Sec. 4.5 and MIL-STD-883 Sec. 1.2 100% 100% 100% 100% Pre Burn-In Electrical Dynamic Burn-In Post Burn-In Electrical Final Electrical Test Final Electrical Test Final Electrical Test External Visual QCI Sample Selection 100% 100% Subgroup Method GROUP A: Electrical Tests Sample Subgroups 1, 7, 9 Electrical Test Subgroups 2, 8A, 10 Electrical Test Subgroups 3, 8B, 11 Electrical Test LTPD = 2 Applicable Device Spec. 25C Applicable Device Spec. Max. Operating Temp. Applicable Device Spec. Min. Operating Temp. LTPD = 2 LTPD = 2 GROUP B: Mechanical Tests Subgroup 2 Solvent Resistance Subgroup 3 Solderability Subgroup 5 Bond Strength 100% 100% 100% 4(0) 2015 LTPD = 10 2003 LTPD = 15 2011 GROUP C: Chip Integrity Tests Subgroup 1 Dynamic Life Test End Point Electrical Subgroup 2 Unbiased Retention End Point Electrical 100% 100% LTPD = 5 1005, 1,000 HRS. 125C Applicable Device Spec. LTPD = 5 Applicable Device Spec. Applicable Device Spec. GROUP D: Environmental Integrity Subgroup 1 Physical Dimensions Subgroup 2 Lead Integrity Hermeticity Subgroup 3 Thermal Shock Temp. Cycle Moisture Resistance Endpoint Electrical Hermeticity Visual Examination Subgroup 4 Mechanical Shock Vibration Constant Acceleration Hermeticity Visual Examination Endpoint Electrical Subgroup 5 Salt Atmosphere Hermeticity Visual Examination Subgroup 6 Internal Water Vapor Subgroup 7 Lead Finish Adhesion Subgroup 8 Lid Torque 100% 100% Sample 2 LTPD = 15 2016 LTPD = 5 2004, Cond. B 1014 LTPD = 15 1011, Cond. B, 15 Cycles 1010, Cond. C, 100 Cycles 1004 Applicable Device Spec. 1014 1004, 1010 LTPD = 15 2002, Cond. B 2007, Cond. A 2001, Cond. E 1014 1010, 1011 Applicable Device Spec. LTPD = 15 1009, Cond. A 1014 1009 3(0) 1018 < 5,000 PPM, 100C LTPD = 15 2025 5(0) 2024