SLUS349B - DECEMBER 1994 - REVISED APRIL 2005 FEATURES D Complies with SCSI, SCSI-2 and SPI-2 Single D D D D D D D D D D Ended Standards 2.7-V to 5.25-V Operation 1.8-pF Channel Capacitance during Disconnect 0.5-A Supply Current in Disconnect Mode 110-/2.5-k Programmable Termination Completely Meets SCSI Hot Plugging -400-mA Sourcing Current for Termination +400-mA Sinking Current for Active Negation Drivers Trimmed Termination Current to 4% Trimmed Impedance to 7% Current Limit and Thermal Shutdown Protection DESCRIPTION The UCC5614 provides 9 lines of active termination for a small computer system's interface (SCSI) parallel bus. The SCSI standard recommends active termination at both ends of the cable segment. The UCC5614 is ideal for high performance 3.3-V SCSI systems. The key features contributing to such low operating voltage are the 0.1-V drop-out regulator and the 2.7-V reference. During disconnect the supply current is typically only 0.5 A, which makes the device attractive for battery powered systems. The UCC5614 is designed with an ultra low channel capacitance of 1.8 pF, which eliminates effects on signal i cted terminators at interim points on the bus. BLOCK DIAGRAM ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) Copyright 2005, Texas Instruments Incorporated www.ti.com 1 SLUS349B - DECEMBER 1994 - REVISED APRIL 2005 DESCRIPTION (CONTINUED) The UCC5614 can be programmed for either a 110- or 2.5-k termination. The 110- termination is used for standard SCSI bus lengths and the 2.5-k termination is typically used in short bus applications. When driving the TTL compatible DISCNCT pin directly, the 110- termination is connected when the DISCNCT pin is driven low, and disconnected when driven high. When the DISCNCT pin is driven through an impedance between 80 k and 150 k, the terminator is in short bus mode. The 2.5-k termination is connected when the DISCNCT pin is driven low and disconnected when driven high. The power amplifier output stage allows the UCC5614 to source full termination current and sink active negation current when all termination lines are actively negated. The UCC5614 is pin for pin compatible with Unitrode's other 9-line SCSI terminators, allowing lower capacitance and lower voltage upgrades to existing systems. The UCC5614, as with all Unitrode terminators, is completely hot pluggable and appears as high impedance at the terminating channels with VTRMPWR = 0 V or open. Internal circuit trimming is utilized, first to trim the 110- termination impedance to a 7% tolerance, and then most importantly, to trim the output current to a 4% tolerance, as close to the max SCSI specification as possible, which maximizes noise margin in fast SCSI operation. Other features include thermal shutdown and current limit. This device is offered in low thermal resistance versions of the industry standard 16-pin narrow body SOIC, 16-pin N and 24-pin TSSOP. ORDERING INFORMATION PACKAGED DEVICE TA SOIC-16 (DP){ DIL-16 (N) TSSOP-24 (PW)} 0C to 70C UCC5614DP UCC5614N UCC5614PW The DP package is available taped and reeled in quanities of 2,500. Add TR suffix to device type (e.g. UCC5614DPTR) to order quantities of 2,500 devices per reel. The PW package is available taped and reeled in quanities of 2,000. Add TR suffix to device type (e.g. UCC5614PWTR) to order quantities of 2,000 devices per reel. 2 www.ti.com SLUS349B - DECEMBER 1994 - REVISED APRIL 2005 CONNECTION DIAGRAMS DIL-16 (Top View) N Package (1) SOIC-16 (Top View) DP Package (1) (2) LINE7 LINE8 LINE9 GND SGND DISCNCT LINE1 LINE2 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 LINE6 LINE5 REG GND GND TRMPWR LINE4 LINE3 TSSOP-24 (Top View) PW Package (1) (3) 1 2 3 4 5 6 7 8 9 10 11 12 LINE7 LINE8 LINE9 N/C SGND GND GND GND GND DISCNCT LINE1 LINE2 24 23 22 21 20 19 18 17 16 15 14 13 LINE7 1 16 LINE6 LINE8 2 15 LINE5 LINE9 3 14 REG N/C 4 13 N/C SGND 5 12 N/C DISCNCT 6 11 TRMPWR LINE1 7 10 LINE4 LINE2 8 9 LINE3 LINE6 LINE5 REG REG GND GND GND GND TRMPWR TRMPWR LINE4 LINE3 NOTES: (1). Drawings are not to scale. (2). DP package pin 5 serves as ground and pins 4,12 and 13 serve as heatsink ground. (3). PW package pin 5 serves as ground and pins 6,7,8,9,17,18,19 and 20 serve as heatsink ground. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted{} UCC5629 TRMPWR voltage UNIT 6 Input voltage V 0 to 7 Regulator output current 2 W Storage temperature, Tstg -65 to 150 Operating junction temperature, TJ -55 to 150 C C Lead temperature (soldering, 10 sec.) 300 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive into and negative out of, the specified terminal. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. All voltages are referenced to GND. RECOMMENDED OPERATING CONDITIONS MAX UNIT 2.7 MIN 5.25 V Temperature ranges 0 70 C Signal line voltage 0 5 DISCNCT input voltage 0 TRMPWR voltage www.ti.com NOM TRMPWR V 3 SLUS349B - DECEMBER 1994 - REVISED APRIL 2005 ELECTRICAL CHARACTERISTICS TA = 0C to 70C, TRMPWR = 3.3 V, DISCNCT = 0 V, RDISCNCT = 0 , TA = TJ, (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Supply Current Section Termpwr supply current Power down mode All termination lines = Open 1 2 All termination lines = 0.2 V 210 218 DISCNCT = Trmpwr 0.5 5 110 117.7 mA A Output Section (110 - Terminator Lines) Terminator impedance Output high voltage 102.3 (Note 1) VLINE = 0.2 V TJ = 25C VLINE = 0.2 V Max output current VLINE = 0.2 , TRMPWR = 3 V, TJ = 25C (Note 1) VLINE = 0.2 V, TRMPWR = 3 V (Note 1) 2.5 2.7 3.0 -22.1 -23 -24 -21 -23 -24 -20.2 -23 -24 -19 -23 -24 VLINE = 0.5 V Ohms V mA -22.4 Output leakage DISCNCT = 2.4 V, TRMPWR = 0 V to 5.25 V 10 400 nA Output capacitance DISCNCT = 2.4 V (Note 2) (DP Package) 1.8 2.5 pF 2 2.5 3 k Output Section (2.5 k - Terminator Lines) (RDISCNCT = 80 k) Terminator impedance Output high voltage TRMPWR = 3 V (Note 1) 2.5 2.7 3.0 Max output current VLINE = 0.2 V -0.7 -1 -1.4 VLINE = 0.2 V, TRMPWR = 3 V (Note 1) -0.6 -1 -1.5 V mA Output leakage DISCNCT = 2.4 V, TRMPWR = 0 to 5.25 V 10 400 nA Output capacitance DISCNCT = 2.4 V (Note 2) (DP Package) 1.8 2.5 pF 2.7 3.0 0.1 0.2 Regulator Section Regulator output voltage 5.25 V > TRMPWR > 3 V Drop out voltage All Termination Lines = 0.2 V 2.5 Short circuit current VREG = 0 V -200 -400 -800 Sinking current capability VREG = 3 V 200 400 800 Thermal shutdown (Note 2) 170 Thermal shutdown hysteresis (Note 2) 10 V mA C Disconnect Section Disconnect threshold RDISCNCT = 0 & 80 k Input current DISCNCT = 0 V NOTES: 1. Measuring each termination line while other eight are low (0.2 V). 2. Ensured by design. Not production tested. 4 www.ti.com 0.8 1.5 2.0 V 30 50 mA SLUS349B - DECEMBER 1994 - REVISED APRIL 2005 Terminal Functions TERMINAL I/O DESCRIPTION NAME NO. DISCNCT 7 GND 9 LINE1 TO LINE9 4 I 110- termination channels REG 9 o Output of the internal 2.7-V regulator TRMPWR 4 I Power for the device I Taking this pin high causes the 9 channels to become high impedance and the chip to go into low power mode. In short laptop buses an 80-k to 150-k resister to ground terminates the bus at 2.5 k. Less than 110 to ground enables the terminator. Ground reference for the device APPLICATION INFORMATION Figure 1. Typical SCSI Bus Configuration Utilizing two UCC5614 Devices Figure 2. Typical Wide SCSI Bus Configuration Utilizing three UCC5614 Devices www.ti.com 5 PACKAGE OPTION ADDENDUM www.ti.com 30-Jul-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) (Requires Login) UCC5614DP ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5614DPG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5614PWP ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5614PWPG4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5614Z OBSOLETE UTR 16 TBD Call TI Samples Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps RF/IF and ZigBee(R) Solutions www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated