© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 4 1Publication Order Number:
MSC2295−BT1/D
MSC2295−BT1,
MSC2295−CT1
Preferred Device
NPN RF Amplifier
Transistors Surface Mount
Features
•Pb−Free Packages are Available
MAXIMUM RATINGS (TA = 25°C)
Rating Symbol Value Unit
Collector−Base Voltage V(BR)CBO 30 Vdc
Collector−Emitter Voltage V(BR)CEO 20 Vdc
Emitter−Base Voltage V(BR)EBO 5.0 Vdc
Collector Current − Continuous IC30 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Power Dissipation PD200 mW
Junction Temperature TJ150 °C
Storage Temperature Tstg −55 to +150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic Symbol Min Max Unit
Collector−Base Cutoff Current
(VCB = 10 Vdc, IE = 0) ICBO − 0.1 mAdc
DC Current Gain (Note 1)
(VCB = 10 Vdc, IC = −1.0 mAdc)
MSC2295−BT1
MSC2295−CT1
hFE
70
110 140
220
−
Collector−Gain — Bandwidth Product
(VCB = 10 Vdc, IE = −1.0 mAdc) fT150 − MHz
Reverse Transistor Capacitance
(VCE = 10 Vdc,
IC = 1.0 mAdc, f = 10.7 MHz)
Cre − 1.5 pF
1. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%.
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Preferred devices are recommended choices for future use
and best overall value.
SC−59
CASE 318D
MARKING DIAGRAM
21
3
Vx M G
G
Vx = Device Code
x= B or C
M = Date Code*
G= Pb−Free Package
COLLECTOR
3
2
BASE
1
EMITTER
Device Package Shipping†
ORDERING INFORMATION
MSC2295−BT1 SC−59 3000/Tape & Ree
l
MSC2295−CT1 3000/Tape & Ree
l
3000/Tape & Ree
l
3000/Tape & Ree
l
† For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
SC−59
(Pb−Free)
SC−59
SC−59
(Pb−Free)
MSC2295−BT1G
MSC2295−CT1G
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
MSC2295−BT1, MSC2295−CT1
http://onsemi.com
2
PACKAGE DIMENSIONS
SC−59
CASE 318D−04
ISSUE G
e
A1
b
A
E
D
1
3
2
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
2.4
0.094
0.95
0.037
0.95
0.037
1.0
0.039
0.8
0.031 ǒmm
inchesǓ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HEDIM
AMIN NOM MAX MIN
MILLIMETERS
1.00 1.15 1.30 0.039
INCHES
A1 0.01 0.06 0.10 0.001
b0.35 0.43 0.50 0.014
c0.09 0.14 0.18 0.003
D2.70 2.90 3.10 0.106
E1.30 1.50 1.70 0.051
e1.70 1.90 2.10 0.067
L0.20 0.40 0.60 0.008
2.50 2.80 3.00 0.099
0.045 0.051
0.002 0.004
0.017 0.020
0.005 0.007
0.114 0.122
0.059 0.067
0.075 0.083
0.016 0.024
0.110 0.118
NOM MAX
HE
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MSC2295−BT1/D
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