1/12
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
14
・
001
ZCT:Zero current transformer
Trip
Coil
TEST SW&R
C
OD
SCR
R
VS
C
VS
VZ
C
OS
C1
C
VR
C
IN
R
IN
INVR ODGND
VS OS NR SC
8765
1234
Latch block
Reference voltage
output block
Recommended Value Range
0.01µF ≤COD≤0.1µF
0.01µF ≤CIN≤0.1µF
0.01µF ≤CVR≤1µF
0.01µF ≤COS≤1µF
0.1µF ≤CVS≤10µF
100Ω ≤RIN≤5kΩ
100Ω ≤RCT≤5kΩ
39kΩ ≤RVS≤150kΩ
100µs ≤tr(Note 1)≤20ms
100µs ≤tf(Note 2)≤20ms
RCT
EARTH LE AKAGE CURRENT DETECTOR
Earth Leakage
Current Detector IC
BD95820F-LB BD95820N-LB
General Description
This is the product guarantees long time support in
Industrial market.
BD95820F-LB/BD95820N-LB integrates leakage detector
and amplifier. Especially, it is suitable for high sensitivity
and a high-speed operation use, and since the operating
temperature range is wide, it ca n be used for various uses .
Features
■ Long Time Support a Product for Industrial
Applications
■ Small Temperature Fluctuation and High Input
Sensitivity
■ Wide Operating Temperature Range
Applications
■ Earth leakage circuit breaker
■ Earth leakage circuit relay
■ Industrial Equipment
Key Specifications
■ Operating Supply Voltage Range： 12V to 22V
■ Operating Temperature Range： -20°C to +95°C
■ Supply Current： 330µA (typ)
■ Trip Voltage： 6.1mV t o 8.9mV
■ Output Current(TA=-20℃)： -200µA (min)
Packages W( Typ) x D(Typ) x H(Max)
SOP8 5.00mm x 6.20mm x 1.71mm
SIP8 19.30mm x 10.50mm x 3.00mm
Typic al Application Circuit
(Note 1) Time to change into 90% from 10% in the process when the power supply voltage rises to 12V from 0V.
(Note 2) Time to change into 90% from 10% in the process when the power supply voltage falls from 12V to 0V.
○
Product structure
：
Silicon monolithic integrated circuit
○
This product has no designed protection against radioactive rays .
ZCT:Zero-phase Current Transformer
C
OD
Datashee
t
2/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
SOP8
(TOP VIEW)
1 2 3 4
8 7 6 5
1 2 3 4 5 6 7 8
SIP8
(TOP VIEW)
IN
VR ODGND
VS OS NR SC
8765
12 3 4
Latch block
Reference voltage
output block
Pin Configurations
Block Diagrams
Pin Descriptions
Pin No. Symbol Function
1 VR Reference voltage
2 IN Input
3 GND Ground
4 OD Output of input com p ar a tor
5 SC Input of latch circuit
6 NR Noise absorption
7 OS Output
8 VS Power supply
Absolute Maximum Ratings (TA=25℃)
Parameter Symbol Rating Unit
Supply current (Note 3) IS 8 mA
IN-VR current IIN-VR ±250 mA
VR pin current IVR 30 mA
IN terminal current IIN 30 mA
SC terminal curr ent ISC 5 mA
Power Supply voltage VS 36 V
Input terminal voltage VVR/IN 17 V
OD/SC/NR/OS terminal voltage VOD/SC/NR/OS 8 V
Power dissipation PD 0.68(SOP8) (Note 4) W
1.12(SIP8) (Note 5)
Storage temperature Tstg -55 to ＋150 °C
(Note 3) The power-supply voltage is limited by the internal clamping circuit.
(Note 4) Mounted on 70mm x 70m m x 1.6mm glass ep o xy bo ard . Redu c e 5 .5mW per 1°C above 25°C.
(Note 5) PD is a value in the package unit. Reduce 9.0mW per 1°C above 25°C.
Caution: Operatin g the IC over t he ab solut e ma ximum rati ngs ma y dam age t he IC. Th e dam age can eith er be a s hort ci rcuit betw een pin s or an o pen c ircuit
between pins and the internal circuitry. Therefore, it is important t o consider circuit pr otection measures, such as adding a fus e, in case th e IC is operated
over the absolute maximum ratings.
3/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
Recommended Operating Ratings
Parameter Symbol Limits Unit
Supply voltage VS 12 to 22 V
Operating temperature Topr -20 to＋95 °C
Electrical Characteristics
(Unl es s otherwise specifie d, VS=12V, GND=0V, TA =25℃, Full range: -20°C to +95°C)
Parameter Symbol Temperature
range Limits Unit Conditions
Min Typ Max
Supply current IS1
-20°C - - 520
μA ΔVIN=VVR-VIN=30mV
25°C - 330 500
95°C - - 460
Trip voltage VT Full range 6.1 7.5 8.9 mV VT=ΔVIN=VVR-VIN
OD Source current IODSO 25°C -27.2 -20.6 -14.0 μA ΔVIN=VVR-VIN=30mV,
VOD=1.2V
OD Sink current IODSI 25°C 16.7 26.0 35.3 μA VOD=0.8V,
ΔVIN=V
VR
-V
IN
=0mV
OS Source current IOSSO
-20°C -200 - -
μA VSC=2.0V, VOS=0.8V 25°C -100 - -
95°C -75 - -
OS Sink current IOSSI Full range 200 - - μA VSC=0.2V, VOS=0.2V
SC ON voltage VSCON 25°C 1.00 1.24 1.48 V
Input clamp volt ag e VIC Full range 4.2 5.5 6.7 V IIC=20mA
Differential input clamp
voltage VIDC Full range 0.6 1.0 1.4 V IIDC=100mA
Maximum current voltage VSM 25°C 26 29 32 V IS=7mA
Supply current 2 (Note 6) IOS2 Full range -100 - - μA IS=900μA,VSC=2.0V
V
OS
=0.8V
Latch OFF Supply Voltage VSOFF 25°C 2.7 3.7 4.7 V
Operating time (Note 7) tON 25°C 1.8 2.9 4.0 ms
(Note 6) Supply current 2 is OS source current value when the power supply current(Is=900μA) is given.
(Note 7) Operating time is time until output voltage reaches 0.8V after detecting the leakage signal.
Conditions : Capacitor(0.047μF) is connected between OD(OS) and GND.
4/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
12345678
VR IN OD SC NR OS VSGND
12 3 456 7 8
VR IN OD SC NR OS VSGND
12345678
VR IN OD SC NR OS VS
GND
1.IS1
100Ω
IS
A
VS
100Ω
VS
2.V
T3.IODSO
ΔVIN ΔVIN
100Ω
ΔVIN
VS
IOD
A
VOD
12345678
VR IN OD SC NR OS VSGND
12345678
VR IN OD SC NR OS VSGND
12 3 456 7 8
VR IN OD SC NR OS VSGND
4.IODSI 5.IOSSO/IOSSI 6.VSCON
12345678
VR IN OD SC NR OS VSGND
12345678
VR IN OD SC NR OS VSGND
12345678
VR IN OD SC NR OS VSGND
7.VIC 8.VIDC 9.VSM
12 3 45678
VR IN OD SC NR OS VSGND
123456 7 8
VR IN OD SC NR OS VSGND
10.IOS2
0.047
μF
11.VSOFF 12.tON
ΔVIN
VS
IOD
A
VOD
VSC
IOS
A
VOS
VSC
Vos
V
VS
IC
VS
IIDC V
VSM IS
V
V
OS
VS
0.047
μFV0.047
μF
VIC
V
VIDC
V
12 3 456 7 8
VR IN OD SC NR OS VSGND
VSC
IOS
A
VOS
VS
IS
100Ω
100Ω
100Ω
100Ω
100Ω
100Ω
100Ω
VOD
V
+
+
+
+
+
Test circuits
5/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
VT
VSCON
tON
0.8V
Timing Chart
Application Hint
1. Input Resistance RIN
Larger bias current flow through the input terminal "IN” in power-up state. This larger current generates undesirable voltage
between the input terminals via input resistance. The input resistance should be less than 5kΩ so that this terminal voltage
is restrained under the trip voltage and the voltage never cause any malfunction.
Even in normal operation, the offset voltage caused via input resistance and bias current might produce undesirable trip
voltage sh if t . The input resistance should be designed with sufficient margin against this shift.
Input voltage
between IN and VR
ΔVIN(IN-VR)
OD/SC terminal voltage
VOD/VSC
OS terminal voltage
VOS
6/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
0
100
200
300
400
500
600
700
800
0510 15 20 25 30
Power Supply VS [V]
Supply Current IS[uA]
-40
-30
-20
-10
0
10
20
30
40
-60 -40 -20 020 40 60 80 100 120
Ambient Temperature Ta [℃]
Rate of fluctuation Δ[%]
-500
-400
-300
-200
-100
0
0 5 10 15 20 25
Power Supply VS [V]
OS terminal Source Current IOSSO[uA]
Typical Performance Curves(reference data)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
025 50 75 100 125 150
Ambient Temperature Ta [℃]
Power Dissipation [W]
95
Figure 3
Trip voltage fluctuation rate
- Ambient temperature
Figure 4
OS terminal sour ce curre nt - Supply voltage
25℃
105
℃
-60
℃
Figure 1
Derating curve
Figure 2
Circuit current - Supply voltage
RIN=1kΩ
RIN=300
25℃
105℃
-60℃
SOP8
SIP8
7/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
0
1
2
3
4
5
-60 -40 -20 020 40 60 80 100 120
Ambient Temperature Ta [℃]
Operating time tON[ms]
0
2
4
6
8
10
012345 6 78910
Power Supply VS [V]
OS terminal voltage V
OS
[V]
0
2
4
6
8
10
0.6 0.8 1.0 1.2 1.4 1.6 1.8
SC terminal input voltage V SCON [V]
OS terminal voltage VOS[V]
Typical Performance Curves(reference data) - continued
0
2
4
6
8
10
012345678910
Power Supply VS [V]
OS Terminal Voltage VOS [V]
Figure 5
Operating time - Ambient temperature
Figure 6
Latch OFF supply voltage - Ambient temperature
Figure 7
SC ON voltage - Ambient temperature
Figure 8
Latch ON supply voltage - Ambient temperature
25℃
105℃
-60℃
25
℃
105℃
-60℃
25℃
105℃
-60℃
8/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25°C (normal temperature).IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θJA°C/W. The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 9(a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient
temperatur e TA, junction temperature TJmax, and power dissipation PD can be calculated by the equation below.
θJA = (TJmax - TA) / PD °C /W
Derating curve in Figure 9(b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figure 10(a) show a derating curve for an example of BD95820F-LB, BD95820N-LB .
Derating curve slope UNIT
BD95820F-LB(SOP8) 5.5 mW/℃
BD95820N-LB(SIP8) 9.0
When using the unit above TA=25℃, subtract the value above per degree℃
BD95820F-LB : Permissible dissipation is a value when glass epo xy boar d 70mm× 70m m ×1.6m m
(cooper foil area below 3%) is mo unted.
BD95820N-LB : Permissible dissipation is a value in the package unit.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
025 50 75 100 125 150
Ambient Temperature Ta [℃]
Power Dissipation [W]
95
(a) BD95820F-LB
・
BD95820N-LB
BD95820F-LB(SOP8)
BD95820N-LB(SIP8)
Figure 10. Derating curve
0
50
75
100
125
150
25
P1
P2
Pd (m ax )
LSIの消費電力 [W]
θ' ja2
θ' ja1
Tj ' (m ax )
θja2 < θja1
周囲温度 Ta [℃]
θ ja2
θ ja1
Tj (m ax )
周囲温度
P
D(max)
θ
JA2
< θ
JA1
θ’
JA2
θ
JA2
θ’
JA1
θ
JA1
T
A
[ °C ]
T’
Jmax
T
Jmax
LSI
の消費電力
Figure 9. Thermal resistance and derating
(a) Thermal Resistance
θ
JA
=(T
Jmax
-T
A
)/P °C /W
周囲温度 Ta [℃]
チップ表面温度 Tj [ ℃]
消費電力 P [W]
Ambient temperature TA[°C
]
Chip surface temperature TJ[°C
]
Power dissipation of LSI
(b) Derating Curve
Ambient temperature TA [°C
]
TA [
℃
]
9/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
I/O equivalence circuit
VCC line
(Internal Power Supply Line)
VCC
VCC
Pin 1
[VR]
Pin 5
[SC]
Pin 2
[IN]
Pin 6
[NR]
Pin 3
[GND]
Pin 7
[OS]
Pin 4
[OD]
Pin 8
[VS]
VCC
VCC
VCC
VCC
VCC
Pin 7
VS
VCC
Pin 1
Pin 6
VS
VCC
Pin 2
100kΩ
300Ω
100kΩ
300Ω
ESD
PRO
TECT
10/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
Operation al Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capac itance valu e w hen using electr oly ti c capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground trac es, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rati ng.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of conne ctio ns.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar prec autions during
transport and storage.
10. Inter-pin Short and Mountin g Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
11/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
SIP8
(TOP VIEW)
BD95820
LOT Number
1PIN MARK
Operation al Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction oper at es as a par as iti c diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 11. Example of monolithic IC structure
Orderi n g Information
B D 9 5 8 2 0 F - L B E 2
Part Number
Package
F: SOP8
N:SIP8
Product class
LB for Industrial applications
Packaging and forming specification
E2: Embossed tape and reel (SOP8)
None:Contai ner tube (SIP8)
Marking Diagrams
SOP8
(TOP VIEW)
95820
LOT Number
１PIN MARK
12/12
BD95820F-LB BD95820N-LB
TSZ02201-0RCR0GZ00120-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
08.Jun.2016 Rev.004
www.rohm.com
TSZ22111
・
15
・
001
Physical Dimension Tape and Reel Information
Revision History
Date Revision Changes
13.Jun.2014 001 New Release
29.Sep.2014 002 Page.1 T ypical App lication Circuit RIN≦3kΩ-> RIN≦5kΩ
Page.10 Operational Notes 13.Input Resistance RIN
28.Sep.2015 003
Page.1 Key Specif icat ion s : Trip Voltage 4.92mV to 11.06mV -> 6.9mV to 8.9mV
T y pical Applica tion Circuit: Add the Recommended External Parts Value
Page.2 Absolute Maximum Ratings: Add the sentence of Caution
Page.3 Electrical Char act er ist ics:
Trip Voltage 4.92mV to 11.06mV -> 6.9mV to 8.9mV
Page.5 Application Hint: Add 1. Input Resistance RIN
(Moved from Operational Notes 13)
08.Jun.2016 004
Page.1 Key Specif icat ion s : T rip Voltage 6.9mV to 8.9mV -> 6.1mV to 8.9mV
Page.3 Electrical Charac t er istic s:
Trip Voltage 4.92mV to 11.06mV -> 6.1mV to 8.9mV
Page.12 Revision History (Add to Revis ion Histor y Rev.003)
Page.3 Recommended Operating Ratings
Delet ed symbols CVS ,COS and moved to Page.1 T ypical Application Circuit
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
