PCA82C251T/N3.112 - NXP SEMICONDUCTORS

1. General description

The PCA82C251 is the interfac e between a CAN pro tocol contro ller and the p hysical bus.

The device provides differential transmit capability to the bus and differential receive

capability to the CAN controller.

2. Features and benefits

Fully compatible with the “ISO 11898-24 V” standard

Slope control to reduce Radio Frequency Interference (RFI)

Thermally protected

Short-circuit proof to battery and ground in 24 V powered systems

Low-current Standby mode

An unpowered node does not disturb the bus lines

At least 110 nodes can be connected

High speed (up to 1 MBd)

High immunity against electromagnetic interference.

3. Applications

High-speed applications (up to 1 MBd) in trucks and busses.

4. Quick reference data

PCA82C251

CAN transceiver for 24 V systems

Rev. 04 — 25 August 2011 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Max Unit

VCC supply voltage 4.5 5.5 V

ICC supply current Standby mode - 275 A

1/tbit maximum transmission speed non-return-to-zero 1 - MBd

VCAN CANH, CANL input/output voltage 36 +36 V

Vdiff differential bus voltage 1.5 3.0 V

tPD propagation delay High-speed mode - 50 ns

Tamb ambient temperature 40 +125 C

Product data sheet Rev. 04 — 25 August 2011 2 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

5. Ordering information

6. Block diagram

7. Pinning information

7.1 Pinning

Table 2. Ordering information

Type number Package

Name Description Version

PCA82C251T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

Fig 1. Block diagram

mbg613

SLOPE/

STANDBY

RECEIVER

REFERENCE

VOLTAGE

DRIVER

PROTECTION

VCC

CANH

CANL

GND

Vref

RXD

TXD

PCA82C251

Fig 2. Pi n co nfi gura tion

PCA82C251

TXD Rs

GND CANH

VCC CANL

RXD Vref

mbg612

Product data sheet Rev. 04 — 25 August 2011 3 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

7.2 Pin description

8. Functional description

The PCA82C251 is the interfac e between a CAN pro tocol contro ller and the p hysical bus.

It is primarily intended for applications up to 1 MBd in trucks and buses. The device

provides differential transmit capability to the bus and differential receive capability to the

CAN controller. It is fully compatible with the “ISO 11898-24 V” standard.

A current-limiting circuit protects the transmitter output stage against short-circuits to

positive and negative battery voltage. Although power dissipation will increase as a result

of a short circuit fault condition, this feature will prevent destruction of the transmitter

output stage.

If the junction temperature exceeds approximately 160 C, the limiting current of both

transmitter outputs is decreased. Because the transmitter is responsible for most of the

power dissipated, this will result in reduced power dissipation and hence a lower chip

temperature. All other parts of the IC will remain operational. The thermal protection is

needed, in particular, when a bus line is short-circuited.

The CANH and CANL lines are also protected against electrical transients which may

occur in an automotive environment.

Pin 8 (Rs) allows three different modes of operation to be selected: High-speed, Slope

control and Standby.

For high-speed operation , the transmitter output transistors are simply switched on and off

as fast as possible. In this mode, no measures are taken to limit the rise and fall slopes. A

shielded cable is recommended to avoid RFI problems. High-speed mode is selected by

connecting pin 8 to ground.

Slope control mode allows the use of an unshielded twisted pair or a parallel pair of wires

as bus lines. To reduce RFI, the rise and fall slopes should be limited. The rise and fall

slopes can be programmed with a resistor connected from pin 8 to ground. The slope is

proportional to the current output at pin 8.

If a HIGH level is applied to pin 8, the circuit enters a low-current Standby mode. In this

mode, the transmitter is switched off and the receiver is switched to a low current. If

dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a

Table 3. Pin descripti on

Symbol Pin Description

TXD 1 transmit data input

GND 2 ground

VCC 3 supply voltage

RXD 4 receive data output

Vref 5 reference voltage output

CANL 6 LOW-level CAN voltage input/output

CANH 7 HIGH-level CAN voltage input/output

Rs 8 slope resistor input

Product data sheet Rev. 04 — 25 August 2011 4 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

LOW level. The microcontroller should react to this condition by switching the transceive r

back to normal op eration (via pin 8). Because the receiver is slower in Standb y mode, the

first message will be lost at higher bit rates.

[1] If another bus node is transmitting a dominant bit, then RXD is logic 0.

[2] X = don’t care.

9. Limiting values

[1] TXD is LOW. Short-circuit protection provided for slew rates up to 5 V/s for voltages above +30 V.

[2] Short-circuit applied when TXD is HIGH, followed by TXD switched to LOW.

[3] In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is: Tvj =T

amb +P

dRth(vj-a), where Rth(j-a) is a

fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient

temperature (Tamb).

[4] Classification A: human body model; C = 100 pF; R = 1500 ; V = 2000 V.

[5] Classification B: machine model; C = 200 pF; R = 25 ; V = 200 V.

Table 4. Truth table of the CAN transceive r

Supply TXD CANH CANL Bus state RXD

4.5 V to 5.5 V 0 HIGH LOW dominant 0

4.5 V to 5.5 V 1 (or floating) floating floating recessive 1[1]

4.5 V < VCC <5.5V X

[2] floating if

VRs >0.75V

floating if

VRs > 0.75VCC

floating X[1]

0V<V

CC < 4.5 V floating floating floating floating X[2]

Table 5. Pin Rs summary

Condition forced at pin Rs Mode Resulting voltage or current at pin Rs

VRs >0.75V

CC Standby IRs <10A

10 A<IRs <200A Slope control 0.4VCC <V

Rs <0.6V

VRs <0.3V

CC High-speed IRs < 500 A

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin 2; positive input

current.

Symbol Parameter Conditions Min Max Unit

VCC supply voltage 0.3 +7.0 V

VnDC voltage at pins 1, 4, 5 and 8 0.3 VCC +0.3 V

V6DC voltage at pin 6 (CANL) 0 V < VCC < 5.5 V; TXD HIGH or floating 36 +36 V

0V<V

CC < 5.5 V; no time limit [1] 36 +36 V

0V<V

CC < 5.5 V; no time limit [2] 36 +36 V

V7DC voltage at pins 7 (CANH) 0 V < VCC < 5.5 V; no time limit 36 +36 V

Vtrt transient voltage at pins 6 and 7 see Figure 8 200 +200 V

Tstg storage temperature 55 +150 C

Tamb ambient temperature 40 +125 C

Tvj virtual junction temperature [3] 40 +150 C

VESD electrostatic discharge voltage [4] 2500 +2500 V

[5] 250 +250 V

Product data sheet Rev. 04 — 25 August 2011 5 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

10. Thermal characteristics

11. Characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from ju nction to ambient in free air 160 K/W

Table 8. Characteristics

VCC = 4.5 V to 5.5 V; Tamb =





C to +125



C; RL=60



; I8>





A; unless otherwise specified; all voltages referenced to

ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature rang e by design, but only

100 % tested at +25



Symbol Parameter Conditions Min Typ Max Unit

Supply

I3supply current dominant; V1=1V; V

CC =5.1V - - 78 mA

dominant; V1=1V; V

CC =5.25V - - 80 mA

dominant; V1=1V; V

CC =5.5V - - 85 mA

recessive; V1=4V; R

8=47k--10mA

Standby [1] - - 275 A

DC bus transmitter

VIH HIGH-level input voltage output recessive 0.7VCC -V

CC +0.3 V

VIL LOW-level input voltage output dominant 0.3 - 0.3VCC V

IIH HIGH-level input current V1=4V 200 - +30 A

IIL LOW-level input current V1=1V  -600 A

V6,7 recessive bus voltage V1= 4 V; no load 2.0 - 3.0 V

ILO off-st ate output leakage current 2V<(V

6, V7)<7V 2-+2 mA

5V<(V

6, V7)<36V 10 - +10 mA

V7CANH output voltage V1=1V; V

CC =4.75V to 5.5V 3.0 - 4.5 V

V1=1V; V

CC = 4.5 V to 4.75 V 2.75 4.5

V6CANL output voltage V1= 1 V 0.5 - 2.0 V

V6, 7 difference between output

voltage at pins 6 and 7 V1= 1 V 1.5 - 3.0 V

V1=1V; R

L=451.5 - - V

V1= 4 V; no load 500 - +50 mV

Isc7 short-circuit CANH current V7=5V - - 200 mA

V7=36 V - 100 - mA

Isc6 short-circuit CANL current V6= 36 V - - 200 mA

DC bus recei ver: V1= 4 V; pins 6 and 7 externally driven; 2V<(V

6, V7) < 7 V; unless otherwise specified

Vdiff(r) differential input voltage

(recessive) [2] 1.0 - +0.5 V

7V<(V

6,V

7)<12V [2] 1.0 - +0.4 V

Vdiff(d) differential input voltage

(dominant) 0.9 - 5.0 V

7V<(V

6,V

7) < 12 V; not Standby

mode 1.0 - 5.0 V

Standby mode 0.97 - 5.0 V

Standby mode; VCC = 4.5 V to 5.10 V 0.91 - 5.0 V

Product data sheet Rev. 04 — 25 August 2011 6 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

[1] I1=I

4=I

5=0mA; 0V<V

6<V

CC; 0 V < V7<V

CC; V8=V

CC; Tamb < 90 C.

[2] This is valid for the receiver in all modes: High-speed, Slope control and Standby.

Vdiff(hys) differential input hysteresis see Figure 5 - 150 - mV

VOH HIGH-level output voltage pin 4; I4=100 A0.8V

CC -V

CC V

VOL LOW-level output voltage pin 4; I4= 1 mA 0 - 0.2VCC V

I4=10mA 0 - 1.5 V

Riinput resistance CANH, CANL 5 - 25 k

Rdiff differential input re sistance 20 - 100 k

Reference output

Vref reference output voltage V8=1V;I5<50A0.45V

CC - 0.55VCC V

V8=4V; I5<5A0.4V

CC -0.6V

CC V

Timing (CL= 100 pF; see Figure 3, Figure 4, Figure 6 and Figure 7)

tbit minimum bit time Rext =0--1 s

tonTXD delay TXD to bus active Rext =0- - 50 ns

toffTXD delay TXD to bus inactive Rext =0-4080ns

tonRXD delay TXD to receiver active Rext =0- 55 120 ns

toffRXD delay TXD to receiver inactive Rext =0; Tamb <+85C

VCC = 4.5 V to 5.1 V - 80 150 ns

Rext =0; VCC = 4 .5 V to 5.1 V - 80 170 ns

Rext =0; Tamb <+85C - 90 170 ns

Rext =0k- 90 190 ns

Rext =47k- 290 400 ns

tonRXD delay TXD to receiver active Rext =47k- 440 550 ns

SRCANH, CANL slew rate Rext =47k-7- V/s

tWAKE wake-up time from Standby

(via pin 8) see Figure 6 --20s

tdRXDL bus dominant to RXD LOW V8= 4 V; see Figure 7 --3 s

Standby/Slope control (pin 8)

Vstb input voltage for Standby mode 0.75VCC -- V

Islope Slope control mode current 10 - 200 A

Vslope Slope control mode voltage 0.4VCC -0.6V

CC V

Table 8. Characteristics …continued

VCC = 4.5 V to 5.5 V; Tamb =





C to +125



C; RL=60



; I8>





A; unless otherwise specified; all voltages referenced to

ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature rang e by design, but only

100 % tested at +25



Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 04 — 25 August 2011 7 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

Fig 3. Test circuit for dynamic characteristics.

Fig 4. Timing diagram for dynamic characteristics.

Fig 5. Hyster e sis.

015aaa243

30 pF

100 pF60 Ω

100 nF

+5 V

PCA82C251

RXD

ref

TXD CANH

CANL

GND

Rext

mbg615

tonTXD tonRXD

toffTXD toffRXD

VTXD

Vdiff

VRXD

0.9 V

0.3VCC

0.7VCC

0.5 V

0 V

VCC

mbg616

HIGH

LOW

hysteresis

0.5 0.9 V

diff

(V)

RXD

Product data sheet Rev. 04 — 25 August 2011 8 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

VTXD =1V.

Fig 6. Timing diagram for wake-up from Standby.

VRs =4V; V

TXD =4V.

Fig 7. Timing diagra m for bus domi na nt to RXD LO W.

The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses

1, 2, 3a and 3b.

Fig 8. Test circuit for automotive transients.

mbg617

VCC

0 V

tWAKE

VRs

VRXD

mbg618

0 V

1.5 V

tdRXDL

Vdiff

VRXD

mbg619

VCC

Vref

RXD

PCA82C251 60 Ω

47 kΩ

500 pF

CANH

CANL

GND Rs

TXD 13

100 nF

+5 V

500 pF

SCHAFFNER

GENERATOR

Product data sheet Rev. 04 — 25 August 2011 9 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

12. Application information

(1) The output control register of the P8xC592 should be programmed to 1AH (push-pull operation,

dominant = LOW).

(2) If no slope control is desired: Rext =0.

Fig 9. PCA82C251 CAN transceiver application diagram

mbg620

ref

RXD

CANH CANL

TXD +5 V

CRX1CRX0 PX,YCTX0

P8xC592

CAN-CONTROLLER

Rext

GND

120 Ω120 Ω

CAN BUS

LINE

100 nF

PCA82C251

CAN-TRANSCEIVER

Product data sheet Rev. 04 — 25 August 2011 10 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

13. Package outline

Fig 10. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

99-12-27

03-02-18

Product data sheet Rev. 04 — 25 August 2011 11 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which pa ckages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reflow soldering

W ave soldering is a joinin g technology in which the joint s are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

Product data sheet Rev. 04 — 25 August 2011 12 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

14.4 Reflow soldering

Key characteristics in reflow soldering are:

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 11) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 9 and 10

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 11.

Table 9. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm3)

< 350  350

< 2.5 235 220

 2.5 220 220

Table 10. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 04 — 25 August 2011 13 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

MSL: Moisture Sensitivity Level

Fig 11. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 04 — 25 August 2011 14 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

15. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PCA82C251_4 20110825 Product data sheet - PCA82C251_3

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•DIP8 package discontinued; bare die no longer available.

•Section 4 “Quick reference data” tPD propagation delay added.

•Typing errors corrected in Table 8 and Figure 3.

PCA82C251_3 20000113 Product data sheet - PCA82C251_2

PCA82C251_2 19970314 Product data sheet - PCA82C251_1

PCA82C251_1 - Product data sheet - -

Product data sheet Rev. 04 — 25 August 2011 15 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

16. Legal information

16.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

16.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidenta l ,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. The product is not designed, authorized or warranted to be

suitable for use in medical, military, aircraft, space or life support equipment,

nor in applications where failure or malf unction of an NXP Semiconductors

product can reasonably be expected to result in personal injury, death or

severe property or environmental dama ge. NXP Semiconductors accepts no

liability for inclusion and/or use of NXP Semiconductors products in such

equipment or applications and therefore such inclusion and/or use is at the

customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 04 — 25 August 2011 16 of 17

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization fro m national authorities.

Quick reference data — The Quick reference data is an extract of th e

product data given in the Limiting values and Characteristics sect ions of this

document, and as such is not complete, exhaustive or legally binding.

16.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PCA82C251

CAN transceiver for 24 V systems

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 August 2011

Document identifier: PCA82C251

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

18. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Functional description . . . . . . . . . . . . . . . . . . . 3

9 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . 4

10 Thermal characteristics . . . . . . . . . . . . . . . . . . 5

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

12 Application information. . . . . . . . . . . . . . . . . . . 9

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Soldering of SMD packages . . . . . . . . . . . . . . 11

14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 11

14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 11

14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 11

14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 12

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

17 Contact information. . . . . . . . . . . . . . . . . . . . . 16

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17