EMK12H2H-66.000MTR - Ecliptek Corporation

RoHS

EMK12H2H-66.000M TR

EMK12 H 2 H -66.000M TR

Series

RoHS Compliant (Pb-free) 4 Pad 5mm x 7mm SMD

2.5Vdc LVCMOS MEMS Oscillator

Frequency Tolerance/Stability

±50ppm Maximum over -40°C to +85°C

Duty Cycle

50 ±5(%)

Packaging Options

Tape & Reel

Nominal Frequency

66.000MHz

Output Control Function

Tri-State (Disabled Output: High Impedance)

ELECTRICAL SPECIFICATIONS

Nominal Frequency 66.000MHz

Frequency Tolerance/Stability ±50ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C,

Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,

First Year Aging at 25°C, 260°C Reflow, Shock, and Vibration)

Aging at 25°C ±1ppm Maximum First Year

Operating Temperature Range -40°C to +85°C

Supply Voltage 2.5Vdc ±5%

Input Current 20mA Maximum

Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA)

Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA)

Rise/Fall Time 2nSec Maximum (Measured from 20% to 80% of waveform)

Duty Cycle 50 ±5(%) (Measured at 50% of waveform)

Load Drive Capability 15pF Maximum

Output Logic Type CMOS

Output Control Function Tri-State (Disabled Output: High Impedance)

Output Control Input Voltage +0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output

Peak to Peak Jitter (tPK) 250pSec Maximum, 100pSec Typical

Start Up Time 50mSec Maximum

Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM 2000V

Flammability UL94-V0

Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G

Moisture Resistance MIL-STD-883, Method 1004

Moisture Sensitivity Level J-STD-020, MSL 1

Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only)

Temperature Cycling MIL-STD-883, Method 1010, Condition B

Thermal Shock MIL-STD-883, Method 1011, Condition B

Vibration MIL-STD-883, Method 2007, Condition A, 20G

www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 1 of 6

EMK12H2H-66.000M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

5.00

±0.15

7.00

±0.15

0.85

±0.15 0.08

MAX

2.60 ±0.15 1.40

±0.10 (x4)

1.20 ±0.10 (x4)

2.1

1.70

R0.70 ±0.10

5.08

±0.10 A

Note A: Center paddle is connected

internally to oscillator ground (Pad 2).

C0.25 ±0.10

PIN CONNECTION

1 Tri-State (High

Impedance)

2 Ground

3 Output

4 Supply Voltage

LINE MARKING

1XXXX or XXXXX

XXXX or XXXXX=Ecliptek

Manufacturing Lot Code

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X4)

All Dimensions in Millimeters

2.88

1.81

2.0 (X4)

2.2 (X4)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 2 of 6

EMK12H2H-66.000M TR

OUTPUT DISABLE

(HIGH IMPEDANCE

STATE)

OUTPUT WAVEFORM & TIMING DIAGRAM

VOH

VOL

80% of Waveform

50% of Waveform

20% of Waveform

Fall

Time

Rise

Time TW

Duty Cycle (%) = TW/T x 100

VIH

VIL

tPLZ tPZL

CLOCK OUTPUT TRI-STATE INPUT

Supply

Voltage

(VDD)

Test Circuit for CMOS Output

Output

Tri-State or

Power Down

Ground

+ +

Power

Supply 0.01µF

(Note 1) 0.1µF

(Note 1) CL

(Note 3)

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and VDD pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.

Voltage

Meter

Current

Meter

Oscilloscope Frequency

Counter

Probe

(Note 2)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 3 of 6

DIA 50 MIN

DIA 20.2 MIN

DIA 13.0 ±0.2

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 40 MIN

Access Hole at

Slot Location

1.5 MIN

Tape & Reel Dimensions

*Compliant to EIA 481A

EMK12H2H-66.000M TR

16.0 ±0.3

7.5 ±0.2

6.75 ±0.20

4.0 ±0.2

2.0 ±0.2

8.0 ±0.2 B0*

DIA 1.5 ±0.1

A0*

0.30 ±0.05

K0*

22.4 MAX

180 MAX

Quantity Per Reel: 1,000 units

16.4 +2.0/-0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 4 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EMK12H2H-66.000M TR

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 5 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EMK12H2H-66.000M TR

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 8/13/2010 | Page 6 of 6