Product structureSilicon monolithic integrated circuitThis product is not designed for protection against radioactive rays
. 1/13
Datashee
t
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
TSZ2211114001
www.rohm.com
Voltage Detector IC Series
Counter Timer Built-in
CMOS Voltage Detector IC
BD45xxx series BD46xxx series
General Description
ROHM’s BD45xxx and BD46xxx series are highly
accurate, low current consumption Voltage Detector ICs.
Because the counter timer delay circuit is built into
these series, an external capacitor for the delay time
setting is unnecessar y. The lineup was established with
low output types (Nch open drain and CMOS output)
and detection voltages range from 2.3V to 4.8V in
increments of 0.1V, so that the series may be selected
according the application at hand.
Features
Counter Timer Built-in
No delay time setting external capacitor required
Ultra-low current consumption
Two output types (Nch open drain a nd CMOS output)
Package SSOP5 is similar to SOT-23-5 (JEDEC)
Key Specifications
Detection voltage: 2.3V to 4.8V (Typ.)
0.1V steps
High accuracy detection voltage: ±1.0%
Ultra-low current consumption: 0.85µA (Typ.)
Operating temperature range: -40°C to +105°C
Three internal, fixed de lay time: 50ms
100ms
200ms
Package
SSOP5 2.90mm x 2.80mm x 1.25mm
Applications
Circuits using microcontrollers or logic circuits that
require a reset.
Typical A pplication Circuit
Connection Diagram
Pin Descriptions
PIN No. Symbol Function
1 ER Manual Reset
2 SUB Substrate *
3 GND GND
4 VOUT Reset Output
5 VDD Power Supply Voltage
*Connect the substrate to GND.
VDD1 VDD2
GND
BD45xxx
CL
Noise-filtering
Capacitor
RL
RST Micro
controller
Open Drain Output Type
BD45xxx series CMOS Output Type
BD46xxx series
CL
Noise-filtering
Capacitor
VDD1
GND
BD46xxx
RST Micro
controller
SSOP5
TOP VIEW
ER SUB GND
VOUT VDD
Lot. No
Marking
Datasheet
Datasheet
2/13
BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
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TSZ2211115001
Ordering Information
Lineup
Table 1. Open Drain Output Type
Counter Timer Delay Time Settings
50ms 100ms 200ms
Detection
Voltage Marking Part
Number Marking Part
Number Marking Part
Number
4.8V T0 BD45485 TS BD45481 UJ BD45482
4.7V T1 BD45475 TT BD45471 UK BD45472
4.6V T2 BD45465 TU BD45461 UL BD45462
4.5V T3 BD45455 TV BD45451 UM BD45452
4.4V T4 BD45445 TW BD45441 UN BD45442
4.3V T5 BD45435 TX BD45431 UP BD45432
4.2V T6 BD45425 TY BD45421 UQ BD45422
4.1V T7 BD45415 TZ BD45411 UR BD45412
4.0V T8 BD45405 U0 BD45401 US BD45402
3.9V T9 BD45395 U1 BD45391 UT BD45392
3.8V TA BD45385 U2 BD45381 UU BD45382
3.7V TB BD45375 U3 BD45371 UV BD45372
3.6V TC BD45365 U4 BD45361 UW BD45362
3.5V TD BD45355 U5 BD45351 UX BD45352
3.4V TE BD45345 U6 BD45341 UY BD45342
3.3V TF BD45335 U7 BD45331 UZ BD45332
3.2V TG BD45325 U8 BD45321 V0 BD45322
3.1V TH BD45315 U9 BD45311 V1 BD45312
3.0V TJ BD45305 UA BD45301 V2 BD45302
2.9V TK BD45295 UB BD45291 V3 BD45292
2.8V TL BD45285 UC BD45281 V4 BD45282
2.7V TM BD45275 UD BD45271 V5 BD45272
2.6V TN BD45265 UE BD45261 V6 BD45262
2.5V TP BD45255 UF BD45251 V7 BD45252
2.4V TQ BD45245 UG BD45241 V8 BD45242
2.3V TR BD45235 UH BD45231 V9 BD45232
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
(Unit : mm)
SSOP5
2.9±0.2
0.13
4°+6°
4°
1.6
2.8±0.2
1.1±0.05
0.05±0.05
+0.2
0.1
+0.05
0.03
0.42+0.05
0.04
0.95
54
123
1.25Max.
0.2Min.
0.1 S
S
BDxxxx x x-TR
Part Output Type Reset Voltage Value Counter Timer Package Packaging and
Number 45 : Open Drain 23 : 2.3V Delay Time Settings G : SSOP5 forming specification
46 : CMOS 0.1V step 5 : 50ms TR : Embossed tape
48 : 4.8V 1 : 100ms and reel
2 : 200ms
Datasheet
Datasheet
3/13
BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
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TSZ2211115001
Lineup - continued
Table 2. CMOS Output Type
Counter Timer Delay Time Settings
50ms 100ms 200ms
Detection
Voltage Marking Part
Number Marking Part
Number Marking Part
Number
4.8V VA BD46485 W2 BD46481 WU BD46482
4.7V VB BD46475 W3 BD46471 WV BD46472
4.6V VC BD46465 W4 BD46461 WW BD46462
4.5V VD BD46455 W5 BD46451 WX BD46452
4.4V VE BD46445 W6 BD46441 WY BD46442
4.3V VF BD46435 W7 BD46431 WZ BD46432
4.2V VG BD46425 W8 BD46421 X0 BD46422
4.1V VH BD46415 W9 BD46411 X1 BD46412
4.0V VJ BD46405 WA BD46401 X2 BD46402
3.9V VK BD46395 WB BD46391 X3 BD46392
3.8V VL BD46385 WC BD46381 X4 BD46382
3.7V VM BD46375 WD BD46371 X5 BD46372
3.6V VN BD46365 WE BD46361 X6 BD46362
3.5V VP BD46355 WF BD46351 X7 BD46352
3.4V VQ BD46345 WG BD46341 X8 BD46342
3.3V VR BD46335 WH BD46331 X9 BD46332
3.2V VS BD46325 WJ BD46321 XA BD46322
3.1V VT BD46315 WK BD46311 XB BD46312
3.0V VU BD46305 WL BD46301 XC BD46302
2.9V VV BD46295 WM BD46291 XD BD46292
2.8V VW BD46285 WN BD46281 XE BD46282
2.7V VX BD46275 WP BD46271 XF BD46272
2.6V VY BD46265 WQ BD46261 XG BD46262
2.5V VZ BD46255 WR BD46251 XH BD46252
2.4V W0 BD46245 WS BD46241 XJ BD46242
2.3V W1 BD46235 WT BD46231 XK BD46232
Datasheet
Datasheet
4/13
BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
www.rohm.com
TSZ2211115001
z Absolute maximum ratings
Parameter Symbol Limits Unit
Power Supply Voltage VDD-GND -0.3 to +10 V
Output Voltage Nch Open Drain Output VOUT GND-0.3 to +10 V
CMOS Output GND-0.3 to VDD+0.3
Output Current IO 60 mA
ER pin Voltage VCT GND-0.3 to VDD+0.3 V
Power Dissipation *1 *2 Pd 540 mW
Operating Temperature Topr -40 to +105 °C
Ambient Storage Temperature Tstg -55 to +125 °C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
Electrical characteristics (Un l ess Otherwise Specified Ta=-40 to 105°C)
Parameter Symbol Condition Limit Unit
Min. Typ. Max.
Detection Voltage VDET
VDD=HÆL, RL=470k *1 VDET(T)
×0.99 VDET(T) VDET(T)
×1.01
V
VDET=2.5V Ta=+25°C 2.475 2.5 2.525
Ta=-40°C to 85°C 2.418 - 2.584
Ta=85°C to 105°C 2.404 - 2.597
VDET=3.0V Ta=+25°C 2.970 3.0 3.030
Ta=-40°C to 85°C 2.901 - 3.100
Ta=85°C to 105°C 2.885 - 3.117
VDET=3.3V Ta=+25°C 3.267 3.3 3.333
Ta=-40°C to 85°C 3.191 - 3.410
Ta=85°C to 105°C 3.173 - 3.428
VDET=4.2V Ta=+25°C 4.158 4.2 4.242
Ta=-40°C to 85°C 4.061 - 4.341
Ta=85°C to 105°C 4.039 - 4.364
VDET=4.8V Ta=+25°C 4.752 4.8 4.848
Ta=-40°C to 85°C 4.641 - 4.961
Ta=85°C to 105°C 4.616 - 4.987
Detection Voltage
Temperature coefficient VDET/
T -40°C to +105°C - ±100 ±360 ppm/°C
Hysteresis Voltage VDET VDDLÆHÆL, RL=470k VDET(T)
×0.03 VDET(T)
×0.05 VDET(T)
×0.08 V
‘High’ Output
Delay time tPLH CL=100pF,
RL=100k *1, *2, *3
BD45XX5, BD46XX5 45 50 55
ms
BD45XX1, BD46XX1 90 100 110
BD45XX2, BD46XX2 180 200 220
Circuit Current
when ON IDD1
VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V *1 - 0.70 2.10
µA
VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V - 0.70 2.85
VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V *1 - 0.75 2.25
VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V - 0.75 3.00
VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V *1 - 0.80 2.40
VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V - 0.80 3.15
Circuit Current
when OFF IDD2
VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V *1 - 0.75 2.25
µA
VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V - 0.75 4.28
VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V *1 - 0.80 2.40
VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V - 0.80 4.50
VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V *1 - 0.85 2.55
VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V - 0.85 4.73
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)
RL :Pull-up resistor to be connected be tween VOUT and power supply.
CL :Capacitor to be connected between VOUT and GND.
*1 Guarantee is Ta=25°C.
*2 tPLH:VDD=(VDET(T)-0.5V)Æ(VDET(T)+0.5V)
*3 tPLH:VDD=Please set the rise up time between VDD=0ÆVDET to more than 100µs.
Attention: Please connect the GND when you don’t use ‘ER’
Datasheet
Datasheet
5/13
BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
www.rohm.com
TSZ2211115001
Electrical characteristics (Un l ess Otherwise Specified Ta=-40 to 105°C) - continued
Parameter Symbol Condition Limit Unit
Min. Typ. Max.
Operating Voltage Range VOPL VOL0.4V, RL=470k, Ta=25 to 105°C 0.95 - - V
VOL0.4V, RL=470k, Ta=-40 to 25°C 1.20 - -
‘High’ Output Voltage (Pch) VOH VDD=4.8V, ISOURCE= 1.0 mA, VDET(2.3V to 4.2V) VDD-0.5 - - V
VDD=6.0V, ISOURCE= 1.2 mA, VDET(4.3V to 4.8V) VDD-0.5 - -
‘Low’Output Voltage (Nch) VOL VDD=1.2V, ISINK = 0.45 mA - - 0.3
V
VDD=2.4V, ISINK = 1.3 mA, VDET(2.7V to 4.8V) - - 0.3
Leak Current when OFF Ilea
k
VDD=VDS=10V *1 - - 0.1 µA
ER Pin ‘H’ Voltage VEH *1 2.0 - - V
ER Pin ‘L Voltage VEL *1 - - 0.8 V
ER Pin Input Current IEL - 1 10 µA
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)
RL :Pull-up resistor to be connected be tween VOUT and power supply.
CL :Capacitor to be connected between VOUT and GND.
*1 Guarantee is Ta=25°C.
Attention: Please connect the GND when you don’t use ‘ER’
Datasheet
Datasheet
6/13
BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
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TSZ2211115001
Block Diagrams
Fig.1 BD45xxx Series
Fig.2 BD46xxx Series
Vref
VOUT
VDD
GND
Oscillat ion
Circ uit Counter
Timer
E
R
VOUT
Vref
VDD
GND
Oscillation
Circuit Counter
Timer
E
R
Datasheet
Datasheet
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BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
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TSZ2211115001
Typical Performan ce Cu rves
Fig.3 Circuit Current
0.0
0.5
1.0
1.5
2.0
012345678910
VDD SUPPLY VOLTAGE VDD[V]
CIRCUIT CURRENT IDD[μA]
BD45281G
0
5
10
15
20
0.0 0.5 1.0 1.5 2.0 2.5
DRAIN-SOURCE VOLTAGE VDS[V]
"LOW" OUTPUT CURRENT IOL[mA]
VDD=1.2V
BD45281G
VDD=2.4V
Fig.4 “Low” Output Current
0
5
10
15
20
0123456
DRAIN-SO URCE VOLTAGE VDS[V]
"HIGH" OUTPUT CURRENT IOH[mA]
BD46281G
VDD=6.0V
VDD=4.8V
Fig.5 “High” Output Current Fig.6 I/O Characteristics
0
1
2
3
4
5
6
7
00.511.522.533.544.555.5
VDD SUPPLY VOLTAGE VDD[V]
OUTPUT VOLTAGE
VOUT[V]
BD45421G
Ta=25
Ta=25
BD45281
BD46281
BD45281
BD46281
BD45281
BD46281
BD46281
Datasheet
Datasheet
8/13
BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
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TSZ2211115001
Typical Performance Curves – continued
0
5
10
15
20
012345678910
ER VOLTAGE VER[V]
OUTPUT VOLTAGE
VOUT[V]
BD46281G
Fig.7 ER Terminal Threshold V oltage
Fig.10 Circuit Current when ON
(VDET-0.2V)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
-40-200 20406080100
T EMPERAT URE Ta[]
CIRCUIT CURRENT WHEN ON IDD1 [μA]
BD45421G
Fig.8 ER Terminal Input Current
0
5
10
15
20
012345678910
ER VOLTAGE VER[V]
ER BIAS CURRENT IER[μA]
BD45421G
BD45281
BD46281
BD45421
BD46421
BD45421
BD46421
Fig.9 Detection Voltage
Release Voltage
3.0
3.4
3.8
4.2
4.6
5.0
5.4
5.8
-40 0 40 80
TEMPERATURE Ta[]
DETECTION VOLTAGE
VDET[V]
Low to high(VDET+ΔVDET)
High to low(VDET)
BD45421G
BD45421BD46421
Datasheet
Datasheet
9/13
BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
www.rohm.com
TSZ2211115001
Typical Performance Curves – continued
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
-40 -20 0 20 40 60 80 100
TEMPERATURE Ta []
CIRCUIT CURRENT WHEN OFF IDD2[μA]
BD45421G
Fig.11 Circuit Current when OFF
0
10
20
30
40
50
-60 -40 -20 0 20 40 60 80 100 120
T EMPERAT URE Ta[]
"LOW" DELAY TIME
tPHL[μsec]
BD45281G tPHL
Fig.14 Output Delay Time
“High”Æ”Low”
“LOW” DELAY TIME : tPLH [µs]
BD45421
BD46421
BD45281
BD46281
Fig.13 Output Delay Time
“Low”Æ”High”
0
50
100
150
200
250
-60 -40 -20 0 20 40 60 80 100 120
T EMPERAT URE Ta[]
"HIGH" DELAY TIME tPLH[msec]
BD4528G
BD45282G
BD45281G
BD45285G
“HIGH” DELAY TIME : tPLH [ms]
BD45282BD46282
BD45285BD46285
BD45281BD46281
Fig.12 Operating Limit Voltage
0.0
0.5
1.0
1.5
-40-200 20406080100
TEM PERATURE Ta[]
MI NI MUM OPERATI NG VO LTAG E: VOPL[V]
BD45421
BD46421
Datasheet
Datasheet
10/13
BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
www.rohm.com
TSZ2211115001
Applic at ion Informa tion
Explanation of Operation
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD45 xxx series uses an open drain output
type, it is necessar y to connect either a pull- up resistor to VDD or a nother po wer supply if needed [T he output “High” voltage
(VOUT) in this case becomes VDD or t he voltage of the other power supply].
Fig.15 (BD45xxx Type Internal Block Diagram) Fig.16 (BD46xxx Type Internal Block Diagram)
Reference Data
Examples of Leadi ng (tPLH) and Falling (tPHL) Output
Part Number tPLH[ms] tPHL[µs]
BD45275G 50 18
BD46275G 50 18
VDD=2.2VÆ3.2V VDD=3.2VÆ2.2V
*This data is for reference only.
The figures will vary with the application, so please confirm a ctual operating conditions before use.
Timing Waveform
Example: The f ollo wing sh o ws the rel at ions hi p between the input vo ltages VDD, t he outp ut voltage VOUT and ER terminal when
the input po wer supply voltage VDD is made to s weep up a nd sweep down (the circuits are those in Fig. 12 and 13).
1 When the power supply is turned on, the output is unstable from
after over the operating limit voltage (VOPL) until tPHL. Therefore it is
possible that the reset signal is not outputted when the rise time of
VDD is faster than tPHL.
2 When VDD is greater than VOPL but less than the reset release
voltage (VDET + VDET), the output voltages will switch to Low.
3 If VDD exceeds the reset release voltage (VDET + VDET), the
counter timer start and VOUT switches from L to H.
4 When more than the high level voltage is supplied to the ER
terminal, VOUT comes to “L” after tPLH delay time. Therefore, a time
when ER terminal is “H” is necessary for 100µsec or mor e.
5 When the ER terminal switches to Low, the counter timer starts
to operate, a dela y of tPLH occurs, and VOUT switches from “L” to “H”.
6 If VDD drops below the detection voltage (VDET) when the power
supply is po wered down or when there is a power suppl y fluctuation,
VOUT switches to L (with a delay of tPHL).
7 The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (VDET). The
system is designed such that the output does not toggle with power
supply fluctuations within this hysteresis width, preventing
malfunctions due t o noise.
These time changes b y the application and use it, please verify and co nfirm using practical applications.
Vref
R1
R2
R3
VDD
GND
Oscillation
Circuit Counter
Timer Q1
VOUT
VDD
Reset
ER
Q2
Q1
Vref
R1
R2
R3
VDD
GND
Oscillation
Circuit Counter
Timer VOUT Reset
ER
Fig.17 Timing Waveform
VDD
VDET+ΔVDET
VDET
VOPL
0V
tPHL
VOUT tPLH
tPHL
tPLH
VOL
VOH
VDD
tPLH
tPHL
VEH
ER
Datasheet
Datasheet
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BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
www.rohm.com
TSZ2211115001
Circuit Applic ations
1) Examples of common power supply detection reset circuits.
Application examples of BD45xxx series (Open Drain
output type) and BD46xxx series (CMOS output type)
are shown below.
CASE1: Power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
Use an open drain output type (BD45xxx) with a load
resistance RL as shown Fig.18.
CASE2: Power supply of the microcontroller (VDD1) is
same as the power supply of the reset detec tion (VDD1).
Use a CMOS output type (BD46xxx) device or an open
drain output type (BD45xxx) device with a pull up
resistor between the output and VDD1.
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall of the output voltage (VOUT).
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
Fig. 20
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD45xxx series) t o the microcontroller s input with pull-up resistor to the supply voltage of the microcontrolle r
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller p ower supply is possible.
Fig.18 Open Drain Output Type
Fig.19 CMOS Output Type
VDD1 VDD2
GND
BD45xxx
CL
Noise-filtering
Capacitor
RL
RST Micro
controller
CL
Noise-filtering
Capacitor
VDD1
GND
BD46xxx RST Micro
controller
V
DD2 VDD1 V
DD3
GND
RST Micro
controlle
r
RL
BD45xxx BD45xxx
Datasheet
Datasheet
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TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
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TSZ2211115001
3) Examples of the power supply with resistor dividers.
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow
into the circuit when t he outp ut level s witches from “High” t o “Low” or vice versa. In-rush current is a s udde n surge of current
that flows from the po wer supply (VDD) to ground (GND) as t he output logic changes its state. This current flow may cause
malfunction in the systems operation such as output oscillations, etc.
Fig. 21
When an in-rush current (I1) f lows into the circuit (Refer to Fig. 21) at the time when out put switches from “Lo w” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD
voltage drops below the detection voltage, the outp ut will switch from “High” to “Low”. While the output voltage is at “L ow”
condition, in-rush current will stop flo wing and the voltage drop will be reduced. As a result , the output voltage will switches
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to
oscillation.
VOUT
R2
VDD
BD45xxx
BD46xxx
GND
R1
I1
V1
CIN
CL
IDD
VDD
VDET
0
In-rush Current
Fig. 22 Current Consumpt ion vs. Power Supply Voltage
Datasheet
Datasheet
13/13
BD45xxx series BD46xxx series
TSZ02201-0R7R0G300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 15.Nov.2013 Rev.007
www.rohm.com
TSZ2211115001
Operational Notes
1) Absol ute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case t he IC is operated ov er the absolute maximum ratings.
2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of t he IC at all operati ng condit ions. Ensure th at no
pins are at a voltage below the ground pin at any time, even during tr ansient condition.
3) Recomme nded operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characterist ics are guaranteed under the conditions of each parameter.
4) B ypass Capacitor for Noise Rejection
To help reject noise, put a 1µ F capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electr omagnetic field may cause the IC to malfunction.
7) The VDD line impedance might cause oscillation because of the detection current .
8) A VDD to GND capacitor (as close connection as possible) shoul d be used in high VDD line impedance conditio n.
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage of
about 1M is assumed between the ER terminal and the GND terminal, 100k connection between the ER terminal
and the VDD terminal would be recommended. If the leakage is assumed between the VOUT terminal and the GND
terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance.
11) External parameters
The recommended parameter range for RL is 50k to 1M. There are many factors (bo ard layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
12) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
13) Testing on application boards
When testing the IC on a n applicat i on b oard, connect ing a c apacitor directl y to a low-impedance out put pin may sub ject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connectin g or removing it from the test setup during the inspect ion process. To
prevent damage from static discharg e, groun d the IC dur ing assembl y and use simi lar pr ecautio ns during transport a nd
storage.
14) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or
concerning such information.
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