Data Sheet
June 2005
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
Applications
■Distributed power architectures
■Wireless Networks
■Access and Optical Network Equipment
■Enterprise Networks
■Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications.
Options
■Positive Remote On/Off logic
■Basic Insulation (-B)
■
SeqFET - external sequencing FET drive supply (–F)
Features
■Flex load – Power trading between V01 and V02
■Wide output voltage adjustment range – V02
adjustment range +5%/-55%
■High efficiency – 89% typical for AF
■Low Output Voltage – supports migration to future
IC supply voltages
■Cost efficient open frame design
■Surface mount or through hole
■Low Profile – 8.5mm maximum
■Two tightly regulated outputs
■Remote On/Off
■Output overcurrent protection
■Output overvoltage protection
■Overtemperature protection
■Meets the voltage isolation requirements for ETSI
300-132-2 and complies with, and is approved per
EN60950 Basic Insulation (-B option)
■Wide operating temperature range
■UL* 60950 Recognised, CSA† C22.2 No. 60950-00
Certified, and E N60950 (VDE‡ 0805):2001-12
Licensed
■CE§ Mark meets 73/23/EEC and 93/68/EEC
directives
■Available in 4 Output voltage variants:
VO1 VO2
AF 5.0V 3.3V
FG 3.3V 2.5V
FY 3.3V 1.8V
GY 2.5V 1.8V
Description
The JHW050 Dual Series comprises a family of low profile, open frame modules with an industry standard,
half-brick footprint. The modules have a maximum power rating of 50W, with a typical efficiency up to 89%, and
cover the 36Vdc to 75Vdc voltage range. The circuit architecture provides for power to be traded between the
two independently regulated outputs, whilst still maintaining a high efficiency.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment. All the required procedures for CE marking of end-user equipment should be followed. (The CE mark is placed on selected products.)
22 Tyco Electronics Corp.
Data Sheet
June 2005Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of
those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended peri-
ods can adversely affect the device reliability.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not
included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety
agencies require a normal-blow fuse with a maximum rating of 5A (see Safety Considerations section). Based on
the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse
with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
Parameter Symbol Min Max Unit
Input Voltage
Continuous
Transient (100ms)
VI
VI, trans
–0.5
–0.5
80
100
Vdc
Vdc
Operating Ambient Temperature
(see Thermal Considerations section)
TA–40 85 °C
Storage Temperature Tstg –55 125 °C
I/O Isolation Voltage — — 1500 Vdc
Parameter Symbol Min Typ Max Unit
Operating Input Voltage VI,min
VI,nom
VI,max
36 54 75 Vdc
Maximum Input Current
(VI = 0V to 75V, IO = IO,max)
II,max — — 2.0 Adc
Inrush Transient — — — 1.0 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12µH source impedance;
see Figure 12)
———20mApk-pk
Input Ripple Rejection (100—120Hz) — 60 — — dB
EMC, EN55022 See EMC Considerations section
Tyco Electronics Corp. 3
Data Sheet
June 2005 Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Electrical Specifications (continued)
#The value of additional external output capacitance is not limited to this value. However, it is recommended, in order to avoid possible issues,
to consult your Tyco Electronics Power Systems technical representative if higher values wish to be used.
Parameter Output Symbol Min Typ Max Unit
Output Voltage Set-point
(VI = VI,nom, IO = IO,max, Tref = 25 °C)
All
All
VO1,set
VO2,set
–1.6
–1.6
—
—
+1.6
+1.6
%VO1,nom
%VO2,nom
Output Voltage
(Over all operating input voltage, resistive load,
and temperature conditions until end of life)
All
All
VO1
VO2
–4.0
–4.0
—
—
+4.0
+4.0
%VO1,nom
%VO2,nom
Adjustment Range
Independent for each output. Selected by
external resistor
All
AF
FG
FY
GY
VO1
VO2
VO2
VO2
VO2
–5.0
1.50
1.50
1.00
1.00
—
3.30
2.50
1.80
1.80
+5.0
3.47
2.63
1.89
1.89
%VO1,nom
Vdc
Vdc
Vdc
Vdc
Output Regulation
Line (VI = VI,min to VI,max)
Load (IO = IO,min to IO,max)
Temperature (Tref = TA,min to TA,max)
All
All
All
—
—
—
—
—
—
0.05
0.05
0.30
0.20
0.20
1.00
%
%
%
Output Ripple and Noise on nominal output
(VI = VI,nom and IO = IO,min to IO,max)
RMS (5Hz to 20MHz bandwidth)
Peak-to-Peak (5Hz to 20MHz bandwidth)
VO≥3.3V
VO<3.3V
VO≥3.3V
VO<3.3V
—
—
—
—
—
—
—
—
—
—
—
—
35
25
100
75
mVrms
mVrms
mVpk-pk
mVpk-pk
External Capacitance
(Electrolytic, Tantalum and Ceramic)
E.S.R.
All
All
CO
—
0
10
—
—
470#
—
µF
mΩ
Output Current
NOTE: The maximum combined output current
must not exceed 12A for the AF and 16A for FG,
FY, GY
AF IO1
IO2
0.0
0.0
—
—
8.0
8.0
Adc
Adc
FG,FY,
GY
IO1
IO2
0.0
0.0
—
—
12.0
12.0
Adc
Adc
Output Current Limit Inception
(VO≤90% VO,nom, with 4A on the other output) AF
FG,FY,
GY
IO, cli
IO, cli
—
—
11
15
14
18
Adc
Adc
Average Output Short-Circuit Current
(VO≤250mV) All IO, s/c —15—% IO,max
Efficiency
VI = VI,nom, TA = 25 °C
IO1 = IO2 = 6A for AF
IO1 = IO2 = 8A for FG, FY and GY
VO1 and VO2 set to nominal
AF
FG
FY
GY
η
η
η
η
—
—
—
—
89.0
88.0
87.0
84.0
—
—
—
—
%
%
%
%
Switching Frequency All fsw —200— kHz
44 Tyco Electronics Corp.
Data Sheet
June 2005Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Electrical Specifications (continued)
Isolation Specifications
General Specifications
Parameter Output Symbol Min Typ Max Unit
Dynamic Response VO1
(ΔIO/Δt = 1A/µs, VI = 54V, IO2 = 2A, Tref = 25 °C)
IO1 = 4A - 6A - 4A or 4A - 2A - 4A for AF
IO1 = 6A - 9A - 6A or 6A - 3A - 6A for FG,FY
and GY
AF
FG, FY,
GY
Vpk
ts
Vpk
ts
—
—
—
—
120
100
180
100
—
—
—
—
mV
µs
mV
µs
Dynamic Response VO2
(ΔIO/Δt = 1A/µs, VI = 54V, IO1 = 2A, Tref = 25 °C)
IO2 = 4A - 6A - 4A or 4A - 2A - 4A for AF
IO2 = 6A - 9A - 6A or 6A - 3A - 6A for FG,FY
and GY
AF
FG, FY,
GY
Vpk
ts
Vpk
ts
—
—
—
—
120
100
180
100
—
—
—
—
mV
µs
mV
µs
Parameter Symbol Min Typ Max Unit
Isolation Capacitance Ciso —330— pF
Isolation Resistance Riso 10 — — MΩ
Parameter Min Typ Max Unit
Calculated MTBF (IO = 80% of IO,max, TA = 20 °C) 3,000,000 Hours
Weight — 38 (1.34) — g (oz.)
Tyco Electronics Corp. 5
Data Sheet
June 2005 Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter Output Symbol Min Typ Max Unit
Remote On/Off interface
Logic Low
At Ion/off = 1.0mA
At Von/off = 0.0V
Logic High
At Ion/off = 0.0µA
At Von/off = 15V
Turn-on Time
From application of Input Supply VI = 54V
From application of Remote On/Off Switch
Rise Time
(IO1 = IO2 = 8A for FG, FY & GY,
IO1 = IO2 = 6A for AF)
(VO1 and VO2>90% of steady state;
see Figure 1)
All
All
All
All
All
All
All
Von/off
Ion/off
Von/off
Ion/off
—
—
—
0.0
—
—
—
—
—
—
—
—
—
—
140
30
25
0.8
1.0
15
50
—
—
—
V
mA
V
µA
ms
ms
ms
Output Overvoltage Protection
(See Feature Description)
AF
FG & FY
GY
VO1
VO1
VO1
—
—
—
6.0
4.2
3.5
6.5
4.6
3.8
V
V
V
Overtemperature Protection Tref —120— °C
SeqFET
Output Voltage (Open Circuit)
Output Impedance
AF
FG & FY
GY
All
—
—
—
—
10.0
10.0
8.0
—
11.4
11.4
9.4
1.0
12.8
12.8
10.7
—
V
V
V
kΩ
66 Tyco Electronics Corp.
Data Sheet
June 2005Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Characteristic Curves – AF
The following figures provide typical characteristics for the JHW050AF. The figures are identical for either positive
or negative Remote On/Off logic.
1-0853
Figure 1. Typical Start-Up Using Remote On/Off.
1-0854
Figure 2. Typical Output Ripple and Noise.
1-0855
Figure 3. Typical VO1 Transient Response at 54VIN,
Nominal Output Voltages, IO1 = 6A to 4A
to 6A, and IO2 = 4A.
1-0856
Figure 4. Typical VO2 Transient Response at 54 VIN,
Nominal Output Voltages, IO2 = 6A to 4A
to 6A, and IO1 = 4A
1-0857
Figure 5. Converter Efficiency vs. Total Output
Current IO1 = IO2
1-0858
Figure 6. Converter Efficiency vs. Ambient
Temperature 54 VIN, IO1 = IO2 = 6A
TIME, t
(
5 ms/div
)
OUTPUT VOLTAGE,
VO (V) (1 V/div)
REMOTE ON/OFF
V
ON/OFF
(V)
TIME, t
(
2
µ
s/div
)
OUTPUT VOLTAGE,
VO (V) (20 mV/div)
V
O1
= 5 V
V
O2
= 3.3 V
TIME, t
(
50
µ
s/div
)
OUTPUT VOLTAGE,
V
O
(V) (200 mV/div)
OUTPUT VOLTAGE,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div)
TIME, t
(
50
µ
s/div
)
OUTPUT VOLTAGE,
V
O
(V) (200 mV/div)
OUTPUT VOLTAGE,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div)
76
78
80
82
84
86
88
90
24681012
OUTPUT CURRENT, I
O
(
A
)
EFFICIENCY, η (%)
V
I
= 36 V
V
I
= 54 V
V
I
= 75 V
87
87.5
88
88.5
89
89.5
90
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE (˚C)
EFFICIENCY η (%)
Tyco Electronics Corp. 7
Data Sheet
June 2005 Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Characteristic Curves – FG & FY
The following figures provide typical characteristics for the JHW050FG & FY. The figures are identical for either
positive or negative Remote On/Off logic.
1-0859
Figure 7. Typical Start-up Using Remote On/Off
JHW050FG
1-0860
Figure 8. Typical Output Ripple and Noise
JHW050FG
1-0861
Figure 9. Typical VO1 Transient Response at 54VIN,
Nominal Output Voltages, IO1 = 6A to 3A,
to 6 A and IO2 = 3A JHW050FG.
1-0862
Figure 10.Typical VO2 Transient Response at 54VIN,
Nominal Output Voltages, IO2 = 6A to 3A,
to 6A and IO1 = 3A JHW050FG.
1-0863
Figure 11.Converter Efficiency vs. Total Output
Current IO1 = IO2 JHW050FG
TIME, t
(
5 ms/div
)
OUTPUT VOLTAGE,
VO (V) (1 V/div)
REMOTE ON/OFF
V
ON/OFF
(V)
TIME
,
t
(
2
µ
s/div
)
OUTPUT VOLTAGE,
VO (V) (20 mV/div)
V
O1
= 3.3 V
V
O2
= 2.5 V
TIME, t
(
50
µ
s/div
)
OUTPUT VOLTAGE,
V
O
(V) (200 mV/div)
OUTPUT VOLTAGE,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div)
TIME, t
(
50
µ
s/div
)
OUTPUT VOLTAGE,
V
O
(V) (200 mV/div)
OUTPUT VOLTAGE,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div)
76
78
80
82
84
86
88
90
2 4 6 8 10 12 14 1
6
OUTPUT CURRENT
,
IO
(
A
)
EFFICIENCY, η (%)
VI = 36 V
VI = 54 V
VI = 75 V
88 Tyco Electronics Corp.
Data Sheet
June 2005Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Test Configurations
Note: Measure input reflected ripple current with a simulated source inductance (LTEST) of
12 µH. Capacitor CS offsets possible battery impedance. measure current as shown
above.
Figure 12.Input Reflected Ripple Current Test
Setup
Note: Use a 1µF ceramic capacitor and a 10µF aluminium or tantalum capacitor. The
scope measurement should be made using a BNC socket. Position the load 50mm
to 75mm (2” to 3”) from the moudle.
Figure 13.Output Ripple and Noise Test Setup
Note: All voltage measurements to be taken at the module terminals, as shown above. If
sockets are used then Kelvin connections are required at the module terminals to
avoid measurement errors due to socket contact resistance.
Figure 14.Output Voltage and Efficiency Test Setup
Design Considerations
Input Source Impedance
The power module should be connected to a low ac-
impedance source. A highly inductive sourceimped-
ance can affect the stability of the power module. For
the test configuration in Figure 12, a 33µF electrolytic
capacitor (ESR<0.7Ω at 100kHz), mounted close to the
power module helps ensure the stability of the unit.
Consult the factory for further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e., UL60950, CSA C22.2 No. 60950-00, and EN
60950 (VDE 0805): 2001-12.
If the input source in non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75 Vdc), for the modules’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
■the input source is to be provided with reinforced
insulation from any hazardous voltages, including the
ac mains.
■One VI pin and one VO pin are to be grounded, or
both the input and output pins are to be kept floating.
■The input pins of the module are not operator acces-
sible.
■Another SELV reliability test is conducted on the
whole system, as reauired by the safety agencies, on
the combination of supply source and subject mod-
ule to verify that under a single fault, hazardous volt-
ages do not appear at the module’s output.
Note: Do not ground either of the input pins of the module without grounding one of the
output pins. This may allow a non-SELV voltage to appear between the output pins
and ground.
The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been evalu-
ated to the applicable requirements of BASIC INSULA-
TION between secondary DC MAINS DISTRIBUTION
input (classified as TNV-2 in Europe) and unearthed
SELV outputs. (–B option only)
The input to these units is to be provided with a maxi-
mum 5A normal-blow fuse in the ungrounded lead.
TO OSCILLOSCOPE CURRENT PROBE
LTES T
12μH
BATTERY
CS 220μF
E.S.R.<0.1Ω
@ 20°C 100kHz
33μF
VI(+)
VI(-)
COPPER STRIPS
VO1(+)
VO1(–)
VO2(+)
VO2(–)
1µF
SCOPE RLOAD1
RLOAD2
SCOPE
10µF
10µF
1µF
VI(+)
CONTACT AND
DISTRIBUTION LOSSES
RLOAD1
VI(–)
CONTACT AND
DISTRIBUTION LOSSES
VI
RLOAD2
VO1(+)
VO1(–)
VO2(+)
VO2(–)
VO1
VO2
Efficiency ηVO1IO1 VO2IO2
+
VIII
-------------------------------------------
=
Tyco Electronics Corp. 9
Data Sheet
June 2005 Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Feature Descriptions
Flexible Power Trading
The full rated output current can be drawn from either
output within the limits shown in Figure 15.
1-0864
Figure 15.Current Sharing Between Outputs
Overcurrent Protection
To provide protection in a fault (output overload) condi-
tion, the unit is equipped with internal current-limiting
circuitry and can endure current limiting continuously.
At the point of current-limit inception, the unit enters
hiccup mode. The unit operates normally once the out-
put current is brought back into its specified range. The
average output current during hiccup is 15% IO,max.
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
turns the module off during a logic high and on during a
logic low. Negative logic, device code suffix “1”, is the
factory-preferred configuration.
Figure 16.Remote On/Off Implementation
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to control
the voltage (Von/off) between the ON/OFF terminal and
the VI(-) terminal (see Figure 16). Logic low is 0V ≤
Von/off ≤ 0.8V. The maximum Ion/off during a logic low is
1mA, the switch should be maintain a logic low level
whilst sinking this current.
During a logic high, the maximum Von/off generated by
the module is 15V, and the maximum allowable leak-
age current at Von/off = 15V is 50µA.
If not using the remote on/off feature:
For negative logic, short the ON/OFF pin to VI(-).
For positive logic, leave the ON/OFF pin open.
Output Overvoltage Protection
The main output voltage is limited by an internal clamp.
This provides protection from excessive overvoltage. If
an accurate overvoltage limit is required this should be
implemented externally via the remote On/Off function.
Figure 17 shows a basic circuit for a 5V output unit with
positive remote On/Off logic. In an overvoltage condi-
tion the unit will shut down and then restart.
Figure 17.Overvoltage Circuit
Overtemperature Protection
To provide protection in a fault condition, the unit is
equipped with a thermal shutdown circuit. the unit will
shutdown if the overtemperature threshold is
exceeded, it will then wait for the unit to cool before
attempting to restart.
The unit will typically enter thermal shutdown when the
temperatures measured at the thermal reference points
(see Figures 20 and 21) reach 120 °C.
SeqFET Drive Supply – Optional (–F)
The SeqFET function provides a DC voltage above the
main output suitable for driving an external FET in
series with VO1 and/or VO2. This allows for flexibility in
sequencing turn-on and turn-off of the module outputs.
Figure 18.SeqFET Application
Note: SeqFET pin 8 is an optional pin. Standard modules will not have this pin fitted.
0
2
4
6
8
10
12
14
16
0 2 4 6 8 10 12 14 16
IO2
(
A
)
IO1 (A)
AF
FG, FY, GY
ON/OFF
VI(+)
VI(-)
Ion/off
Von/off
VO1(+)
VO2(-)
VO1(-)
VO2(+)
VI(+)
ON/OFF
VI(-)
VO(+)
VO(-)
15k
10k
100R
TL431
VO1(+)
SeqFET
VO1(-)
FET
ON/OFF
1010 Tyco Electronics Corp.
Data Sheet
June 2005Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Feature Descriptions (continued)
Output Voltage Set-Point Adjustment
(Trim)
Trimming allows the output voltage set point to be
increased or decreased, this accomplished by connect-
ing an external resistor between the TRIM pin and
either the VO(+) pin or the COM pin (see Figure 19).
To maintain set point accuracy, the trim resistor toler-
ance should be ± 0.1%.
Figure 19.Circuit Configuration to Trim Output
Voltag e
VO1 Set-Point Adjustment (Trim)
The Trim equations shown below can be used for all
module variants VO1.
Δ% is the desired % change in VO1.
VO1 refers to the nominal output voltage for the output
being trimmed.
Vref = 2.5 for JHW050AF, and 1.225 for all others.
Example: For JHW050AF, to trim up to 5.25 V, Δ% = 5,
nominal VO1 = 5.0, use Vref = 2.5.
Hence Rtrim_up = 102.2 KΩ.
VO2 Set-Point Adjustment (Trim)
Due to internal component values within each JHW050
variant, the VO2 trim laws are different for each type.
Care should be taken to ensure that the correct law as
shown below is being used.
JHW050AF VO2 Trim
The following equations apply only to the JHW050AF
VO2.
JHW050FG VO2 Trim
the following equations apply only to the JHW050FG
VO2.
JHW050FY VO2 Trim
The following equations apply only to the JHW050FY
VO2.
If not using the trim feature, leave each TRIM pin
unconnected.
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VI(+)
ON/OFF
VI(-)
Rtrim-up
VO1_Rtrim_down:511
Δ%
----------10.22–
⎝⎠
⎛⎞
KΩ=
VO1_Rtrim_up:5.11 VO1 100 Δ%+()⋅⋅
Vref Δ%⋅
-------------------------------------------------------------511
Δ%
----------
–10.22–KΩ=
Vo2_Rtrim_down:511
Δ%
----------6.11–
⎝⎠
⎛⎞
KΩ=
VO2_Rtrim_up:5.11 VO2 100 Δ%+()⋅⋅
Vref Δ%⋅
-------------------------------------------------------------511
Δ%
----------
–6.11–KΩ=
VO2_Rtrim_down:40.87 VO2 100 Δ%–()2026+⋅⋅
929.5 3.715–VO2 100 Δ%–()⋅⋅
-------------------------------------------------------------------------------------KΩ=
VO2_Rtrim_up:62.85 VO2 100 Δ%+()2955+⋅⋅
3.715 VO2 100 Δ%+()929.5–⋅⋅
------------------------------------------------------------------------------------- 1 KΩ–=
VO2_Rtrim_down:51.91 VO2 100 Δ%–()2904+⋅⋅
849.6 4.719–VO2 100 Δ%–()⋅⋅
-------------------------------------------------------------------------------------KΩ=
VO2_Rtrim_up:52.81 VO2 100 Δ%+()3753–⋅⋅
4.719 VO2 100 Δ%+()849.6–⋅⋅
------------------------------------------------------------------------------------- 1 KΩ–=
The table below shows trim resistance values to adjust VO2 down to a range of popular nominal voltages.
AF - Nom VO2 = 3.3V FG - Nom VO2 = 2.5V FY - Nom VO2 = 1.8V
VO2 Tr i m VO2 Tr im VO2 Tr i m
2.50 14.97kΩ2.00 54.69kΩ1.5 75.42kΩ
2.00 6.86kΩ1.80 35.98kΩ1.40 53.84kΩ
1.80 5.13kΩ1.50 21.91kΩ1.20 32.24kΩ
1.50 3.26kΩ— — 1.00 21.43kΩ
Tyco Electronics Corp. 11
Data Sheet
June 2005 Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Thermal Considerations
The power module can operate in a variety of thermal
environments, however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include Ambient temperature, airflow,
module power dissipation, and need for increased reli-
ability. A reduction in the operating temperature of the
module will result in an increase in reliability.
The thermal data presented here is based on measure-
ments taken in a wind tunnel using the test setup
shown in Figure 22.
Note that the orientation of the module with respect to
the airflow affects thermal performance. Two orienta-
tions are shown below in Figure 20 and 21.
Note: Proper cooling can be verified by measuring the
temperature at the top center of the case of the two Tref
components Q9 and Q2. For reliable operation neither
temperature measured should exceed 110 °C.
1-0865
Figure 20.Worst Orientation (Top View)
1-0866
Figure 21.Best Orientation (Top View)
1-0867
Figure 22.Thermal Test Setup
1-0868
Figure 23.JHW050AF Typical Maximum total
Output Current vs. Local Ambient
Temperature and Air Velocity; Worst case
orientation
1-0869
Figure 24.JHW050FG &FY typical Maximum total
Output Current vs. Local Ambient
Temperature and Air Velocity; Worst case
orientation
0
2
4
6
8
10
12
14
0 102030405060708090100
AMBIENT TEMPERATURE ˚C
TOTAL OUTPUT CURRENT
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
NATURAL CONVECTION
0
2
4
6
8
10
12
14
16
18
0 102030405060708090100
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
NATURAL CONVECTION
AMBIENT TEMPERATURE ˚C
TOTAL OUTPUT CURRENT
1212 Tyco Electronics Corp.
Data Sheet
June 2005Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
EMC Considerations
The Figure 25 shows a suggested configuration to
meet the conducted emission limits of EN55022
Class B.
1-0870
Note: Inductor L1 must not be > 1 uH to ensure stability C1, C2 should be low impedance
type, ESR < 0.7Ω
Figure 25.Suggested Configuration for EN55022
Class B
1-0871
Figure 26.Typical EMC signature using Figure 25
filter.
For further information on designing for EMC compli-
ance, please refer to the FLTR100V10 data sheet
(FDS01-043EPS).
Layout Considerations
Though the external filter components are important in
achieving a good EMC result, equally important is the
PCB layout and system grounding configuration.
The JHW050 power module is low profile in order to be
used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited.
1-0872
Figure 27. Suggested Primary to Secondary Power
Planes
The following recommendations should ensure reliable
operation of the power module:
■Due to the limited component clearance avoid plac-
ing copper areas on the outer layer directly under-
neath the power module. Also avoid placing via
interconnects underneath the power module. If this is
not possible, any vias should be situated away from
the three main magnetic components, as shown
above. These components are the highest on the
power module bottom side and hence provide the
least clearance to the system card.
■Two planes should be provided beneath the power
module to minimize radiated emissions. The ‘Input
Plane’ should be sized to cover the primary-side cir-
cuits of the power module, and it should be con-
nected to either of the input power pins e.g. VI(+).
The ‘Output Plane’ should be sized to cover the sec-
ondary-side circuits and it should be connected to
either of the output power pins e.g. 0V. Proper sepa-
ration, in accordance with safety agency standards
should be provided between these two planes. the
spacing distance of 2mm shown above preserves the
maximum Basic Insulation classification of these
power modules.
■Under no circumstances should unconnected or
‘Floating ‘copper areas be placed underneath the
power module as these can transmit noise signals,
which could reduce module stability.
■Avoid routing sensitive data signals beneath the
power module. If this is not possible, these signal
traces should be shielded by use of ground planes.
For additional layout guidelines, please refer to the
FLTR100V10 data sheet (FDS01-043EPS).
Tyco Electronics Corp. 13
Data Sheet
June 2005 Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Mechanical Details
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.)
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
Top View
1-0873
Side View
1-0874
Bottom View
1-0875
C
L
1
2
3
4
11
10
9
8
7
6
5
57.4
(2.26)
48.26
(1.90)
4.57
(0.18)
35.56
(1.40)
15.24
(0.60)
60.5
(2.38)
40.64
(1.60)
25.4
(1.00)
10.16
(0.40)
5.08
(0.20)
0).4%2-).!4)/.
3/,$%20,!4%$
"2!33
%,%#42)#!,4%2-).!4)/.
MM3/,$%20,!4%$
#/00%230(%2%
&/236%23)/./.,9
-!8
-!8
CONDUCTIVE SPACER
IN 4 POSITIONS
NOT FITTED ON
-S VERSION.
54.61
(2.15)
2.92
(0.11)
3.18
(0.13)
50.93
(2.01)
3.18
(0.13)
54.36
(2.14)
2.34
(0.09)
2.79
(0.11)
51.05
(2.01)
1414 Tyco Electronics Corp.
Data Sheet
June 2005Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Recommended Footprint Details
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.)
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
1-0876
Top View – Component Side Surface Mount Footprint JHW050XX-S
1-0877
Top View – Component Side Through Hole Footprint JHW050XX
1-0888
Surface Mount Assembly X-Section Through Hole Assembly X-Section
STANDARD = NO PIN
OPTIONAL = SeqFet
11
8
10
9
Vo1Trim
Vo1+
Vo1-
4
5
7
6
Pin
1
3
2
Vin-
Vo2Trim
Vo2-
Vo2+
Function
ON/OFF
N/C
Vin+
1
2
3
4
11
10
9
8
7
6
5
L
C
IN 11 POSITIONS
PAD ø 3.2 mm
HOLE ø 1.0 mm
KEEP OUT AREA
FOR PICK AND PLACE
CRADLE (2 POSITIONS)
57.4
(2.26)
48.26
(1.90)
4.57
(0.18)
60.5
(2.38)
40.64
(1.60)
25.4
(1.00)
10.16
(0.40)
5.08
(0.20)
14.0
(0.55)
3.0
(0.12)
3.0
(0.12)
35.56
(1.40)
15.24
(0.60)
10.0
(0.39)
Pin Function
1Vin+
2ON/OFF
3NO PIN
4Vin-
5Vo2+
6Vo2-
7Vo2Trim
8STANDARD = NO PIN
9Vo1+
10 Vo1-
11 Vo1Trim
OPTIONAL = SeqFet
1
2
4
11
10
9
8
7
6
5
L
C
57.4
(2.26)
51.05
(2.01)
48.26
(1.90)
4.57
(0.18)
CONDUCTIVE SPACER
IN 4 POSITIONS
54.61
(2.15)
35.56
(1.40)
7.62
(0.30)
2.92
(0.11) 3.18
(0.13)
IN 10 POSITIONS
PAD ø 4.0 mm
HOLE ø 1.5 mm
50.93
(2.01)
3.2
(0.13) 2.7
(0.11) 3.18
(0.13)
5.08
(0.20)
60.5
(2.38)
54.36
(2.14)
40.64
(1.60)
25.4
(1.00)
10.16
(0.40)
> 0.00
> 0.00
8.5
(0.33)
MAX
8.5
(0.33)
MAX
2.30
(0.09)
2.29
(0.09)
Tyco Electronics Corp. 15
Data Sheet
June 2005 Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Surface Mount Information
Packaging Details
The surface mount version, JHW050XX-S power mod-
ules are supplied as standard in the plastic tray shown
in Figure 28. The tray has external dimensions of
234mm (W) x 334mm (L) x 21.5mm (H). The tray is
designed to allow the use of either vacuum pick up or
mechanical grippers to automatically place the power
module.
Figure 28.Surface Mount Packaging Tray
Tray Specification
Material Antistatic coated PVC
Max temperature 65 °C
Max surface resistivity 1012Ω/sq
Colour Clear
Capacity per tray 12 power modules
Stacking pitch 12.98mm (0.511”)
Min order quantity 48 pcs (1box of 4 full trays)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will con-
tain 4 full trays plus one empty hold down tray giving a
total number of 48 power modules.
Pick and Place
All JHW050-S power modules come assembled with a
clip-on, removable “Cradle” which has a large flat sur-
face in its center to serve as a pick and place point for
automated vacuum equipment.
Figure 29.Removable Pick and Place Cradle
The cradle is molded out of high temperature plastic,
which is able to withstand the reflow process. Once sol-
dered onto the end-board assembly the cradle should
simply be removed by compressing the two edge clips.
The cradle material is electrically insulative. Hence,
standard-handling methods for ESD prevention, such
as specified in JEDEC JESD625-A, should be followed
while removing the cradle.
The module weight has been kept to a minimum be
using open frame construction. Even so, these mod-
ules have a large mass when compared with conven-
tional smt components. Variables such as nozzle size,
tip style, vacuum pressure and placement speed
should be considered to optimize this process.
The power module can also be automatically handled
using odd form placement equipment such as mechan-
ical grippers. the parallel edges of the modules PCB
offer suitable gripping points.
Pick and Place Cradle Specification
Material Questra™ EA 535
Vicat softening point 260 °C
Dielectric const IEC250 3.2
Volume resistivity 1.3x1018
Colour Black
Recycling designation 7, sPS
1616 Tyco Electronics Corp.
Data Sheet
June 2005Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Reflow Soldering Information
The JHW050 Family of power modules is available for
either trough hole or Surface Mount (SMT) soldering.
These power modules are large mass, low thermal
resistance devices and typically heat up slower than
other SMT components. It is recommended that the
customer review data sheets in order to customize the
solder reflow profile for each application board assem-
ble.
The following instructions must be observed when SMT
soldering these units. Failure to observe these instruc-
tions may result in the failure of or cause damage to the
modules, and can adversely affect long-term reliability.
It is recommended that the reflow profile be character-
ized for the module on each application board assem-
bly. The power modules Ball connections are plated
with tin/lead (Sn/Pb) solder to prevent corrosion and
ensure good solderability. Typically, the eutectic solder
melts at 183 °C, wets the land, and subsequently wicks
the device connection. Sufficient time must be allowed
to fuse the plating on the connection to ensure a reli-
able solder joint.
There are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliable soldered using natural
forced convection, IR (radiant infrared), or a combina-
tion of convection/IR. For reliable soldering the solder
reflow profile should be established by accurately mea-
suring the modules Ball connector temperatures.
1-0894
Figure 30.Recommended Reflow Profile
1-0894
Figure 31.Time Limit Curve Above 205 °C Reflow
Lead Free Soldering
Standard JHW050-S power modules are designed to
be used in a conventional Tin/Lead (Sn/Pd) solder pro-
cess where peak reflow temperatures are limited to
less than 235 °C. Users who wish to assemble these
modules in a Lead Free solder process which, it is
expected, will require the use of higher peak reflow
temperatures should contact your local Tyco Power
Systems technical representative for more information.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will
meet the solder ball requirements per J-STD-001B.
These requirements state that solder balls must neither
be loose nor violate the power module minimum electri-
cal spacing.
The cleanliness designator of the open frame power
module is C00 (per J specification).
Post Solder Cleaning and Drying Consid-
erations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Tyco Electronics Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AP01-56EPS)
0
50
10 0
15 0
200
250
300
REFLOW TIME (S)
Peak Temp 235˚C
Heat zone
max 4 ˚Cs
Soak zone
30-240s
Preheat zone
max 4 ˚Cs-1
Tlim above
205 ˚C
Cooling
zone
1-4 ˚Cs-1
200
205
210
215
220
225
230
235
240
0 10203040 5060
TIME (S)
Data Sheet
June 2005Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
World Wide Headquarters
Tyco Electronics Power Systems, Inc.
3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819 FAX: +1-888-315-5182
(Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900)
www.power.tycoelectronics.com
e-mail: techsupport1@tycoelectronics.com
Tyco Electronics Corporation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
No rights under any patent accompany the sale of any such product(s) or information.
© 2001 Tyco Electronics Power Systems, Inc. (Mesquite, Texas) All International Rights Reserved.
Printed in U.S.A.
June 2005
FDS02-043EPS (Replaces ADS02-019EPS)
Europe, Middle-East and Africa Headquarters
Tyco Electronics (UK) Ltd
Tel: +44 (0) 1344 469 300, Fax: +44 (0) 1344 469 301
Central America-Latin America Headquarters
Tyco Electronics Power Systems
Tel: +54 11 4316 2866, Fax: +54 11 4312 9508
Asia-Pacific Headquarters
Tyco Electronics Singapore Pte Ltd
Tel: +65 482 0311, Fax: 65 480 9299
Ordering Information
Please contact your Tyco Electronics’ Sales Representative for pricing, availability and optional features.
Optional features can be ordered using the suffixes shown below. The suffixes follow the last letter of the device
code and are placed in descending alphanumerical order.
Product codes#Input Voltage Output
Voltage(s)
Output
Current Mounting Remote
On/Off Logic Comcode
JHW050AF1
48V
(36V-75V)
5.0V & 3.3V 12A (total)
Through Hole
(Pinned)
Negative
108968785
JHW050FG1 3.3V & 2.5V 16A (total) 108968249
JHW050FY1 3.3V & 1.8V 16A (total) 108966367
JHW050GY1 2.5V & 1.8V 16A (total) TBD
JHW050AF1-S 5.0V & 3.3V 12A (total)
Surface Mount
108966375
JHW050FG1-S 3.3V & 2.5V 16A (total) TBD
JHW050FY1-S 3.3V & 1.8V 16A (total) 108968660
JHW050GY1-S 2.5V & 1.8V 16A (total) TBD
JHW050AF
48V
(36V-75V)
5.0V & 3.3V 12A (total)
Through Hole
(Pinned)
Positive
108961566
JHW050FG 3.3V & 2.5V 16A (total) 108959354
JHW050FY 3.3V & 1.8V 16A (total) 108959362
JHW050GY 2.5V & 1.8V 16A (total) 108963968
JHW050AF-S 5.0V & 3.3V 12A (total)
Surface Mount
108965724
JHW050FG-S 3.3V & 2.5V 16A (total) 108969031
JHW050FY-S 3.3V & 1.8V 16A (total) 108965732
JHW050GY-S 2.5V & 1.8V 16A (total) TBD
Option Suffix
Negative Remote On/Off Logic 1
Surface Mountable –S
SeqFET Supply - pin8 fitted –F
Tested for Basic Insulation –B
