HS1A thru HS1M Taiwan Semiconductor CREAT BY ART High Efficient Surface Mount Rectifiers FEATURES - Glass passivated chip junction - Ideal for automated placement - Low forward voltage drop - Fast switching for high efficiency - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: DO-214AC (SMA) Molding compound, UL flammability classification rating 94V-0 DO-214AC (SMA) Base P/N with suffix "G" on packing code - Green compound (halogen-free) Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.06 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25 unless otherwise noted) PARAMETER SYMBOL HS HS HS HS HS HS HS HS 1A 1B 1D 1F 1G 1J 1K 1M UNIT Maximum repetitive peak reverse voltage VRRM 50 100 200 300 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 210 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 300 400 600 800 1000 V Maximum average forward rectified current IF(AV) 1 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30 A Maximum instantaneous forward voltage (Note 1) @1A Maximum reverse current @ rated VR TJ=25 TJ=100 TJ=125 VF 1.0 1.3 1.7 5 IR 50 A 150 Maximum reverse recovery time (Note 2) Trr 50 75 Typical junction capacitance (Note 3) Cj 20 15 Typical thermal resistance Operating junction temperature range Storage temperature range V ns pF O RJA 70 TJ - 55 to +150 O C - 55 to +150 O C TSTG C/W Note 1: Pulse test with PW=300s, 1% duty cycle Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C. Document Number: DS_D1405050 Version: I14 HS1A thru HS1M Taiwan Semiconductor ORDERING INFORMATION PART NO. AEC-Q101 PACKING CODE GREEN COMPOUND PACKAGE PACKING R3 SMA 1,800 / 7" Plastic reel R2 SMA 7,500 / 13" Paper reel M2 SMA 7,500 / 13" Plastic reel Folded SMA 1,800 / 7" Plastic reel Folded SMA 7,500 / 13" Paper reel F4 Folded SMA 7,500 / 13" Plastic reel E3 Clip SMA 1,800 / 7" Plastic reel E2 Clip SMA 7,500 / 13" Plastic reel QUALIFIED CODE Prefix "H" HS1x (Note 1) F3 Suffix "G" F2 N/A Note 1: "x" defines voltage from 50V (HS1A) to 1000V (HS1M) EXAMPLE AEC-Q101 PREFERRED P/N PART NO. PACKING CODE HS1M R3 HS1M R3 HS1M R3G HS1M R3 HS1MHR3 HS1M QUALIFIED H GREEN COMPOUND DESCRIPTION CODE G Green compound R3 AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA=25 unless otherwise noted) FIG. 2- TYPICAL REVERSE CHARACTERISTICS FIG.1- MAXIMUM AVERAGE FORWARD CURRENT DERATING INSTANTANEOUS REVERSE CURRENT (A) 1000 AVERAGE FORWARD CURRENT (A) 1.2 1 0.8 0.6 0.4 0.2 0 80 90 100 110 120 130 140 TJ=125 100 150 35 30 8.3ms Single Half Sine Wave 25 20 15 10 5 1 10 NUMBER OF CYCLES AT 60 Hz 100 INSTANTANEOUS FORWARD CURRENT (A) PEAK FORWARD SURGE URRENT (A) 40 1 0 LEAD TEMPERATURE (oC) FIG. 3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT TJ=25 10 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 4- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 100 HS1A-HS1D 10 HS1G 1 HS1J-HS1M 0.1 0.4 0.6 0.8 1 1.2 1.4 1.6 FORWARD VOLTAGE (V) Document Number: DS_D1405050 Version: I14 HS1A thru HS1M Taiwan Semiconductor FIG. 5- TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE (pF) 70 f=1.0MHz Vsig=50mVp-p 60 50 40 30 HS1A-HS1G 20 10 HS1J-HS1M 0 0.1 1 10 100 1000 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS Unit (mm) DIM. Unit (inch) Min Max Min Max A 1.27 1.58 0.050 0.062 B 4.06 4.60 0.160 0.181 C 2.29 2.83 0.090 0.111 D 1.99 2.50 0.078 0.098 E 0.90 1.41 0.035 0.056 F 4.95 5.33 0.195 0.210 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.68 0.066 B 1.52 0.060 C 3.93 0.155 D 2.41 0.095 E 5.45 0.215 MARKING DIAGRAM P/N = Specific Device Code G= Green Compound YW = Date Code F= Factory Code Document Number: DS_D1405050 Version: I14 HS1A thru HS1M Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1405050 Version: I14