1. Product profile
1.1 General description
500 mA PNP general-purpose transistors in a leadless ultra small
DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible
and solderable side pads.
1.2 Features and benefits
General-purpose transistor
Two current ga in sele ct ion s
Low package height of 0.37 mm
AEC-Q101 qualified
1.3 Applications
General-purpose switching and amplification
Mobile applications
1.4 Quick reference data
[1] Pulse test: tp 300 s; 0.02.
BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
Rev. 1 — 30 August 2013 Product data sheet
')1'
Table 1. Product overview
Type number Package NPN complement
NXP JEITA
BC807-25QA DFN1010D-3
(SOT1215) - BC817-25QA
BC807-40QA BC817-40QA
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 45 V
ICcollector current - - 500 mA
hFE DC current gain VCE =1V; I
C=100 mA [1]
BC807-25QA 160 - 400
BC807-40QA 250 - 600
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 2 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
2. Pinning information
3. Ordering information
4. Marking
Table 3. Pinning
Pin Symbol Description Simplified outline Graphic symbol
1 B base
2Eemitter
3 C collector
4 C collector
7UDQVSDUHQWWRSYLHZ
sym132
E
C
B
Tabl e 4. Ordering information
Type
number Package
Name Description Version
BC807-25QA DFN1010D-3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals;
body: 1.1 1.0 0.37 mm
SOT1215
BC807-40QA
Table 5. Marking codes
Type number Marking code
BC807-25QA 01 01 00
BC807-40QA 00 11 00
Fig 1. DFN1010D-3 (SOT1215) binary marking code descrip tion
0$5.,1*&2'(
(;$03/(
3,1
,1',&$7,210$5.
9(1'25&2'(
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DDD
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BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 3 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 1 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated mounting pad for collector 1 cm2.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 45 V
VEBO emitter-base voltage open collector - 5V
ICcollector current - 500 mA
ICM peak collector current single pulse; tp1ms - 1A
IBM peak base current single pulse; tp1ms - 200 mA
Ptot total power dissipation Tamb 25 C[1] -300mW
[2] -500mW
[3] -560mW
[4] 900 mW
Tjjunction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 4 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 1 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated mounting pad for collector 1 cm2.
(1) FR4 PCB, 4-layer copper, 1 cm2
(2) FR4 PCB, single-sided copper, 1 cm2
(3) FR4 PCB, 4-layer copper, standard footprint
(4) FR4 PCB, single-sided copper, standard footprint
Fig 2. Power derating curves
7
DPE
&
DDD
3WRW
:
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] --417K/W
[2] --250K/W
[3] --223K/W
[4] --139K/W
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 5 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
FR4 PCB, single-sided copper, standard footprint
Fig 3. Transient thermal impedance from junctio n to ambi ent as a function of pulse duration; typical values
FR4 PCB, 4-layer copper, standard footprint
Fig 4. Transient thermal impedance from junctio n to ambi ent as a function of pulse duration; typical values
DDD
W
S
V
=WKMD
.:
GXW\F\FOH
DDD
W
S
V
=WKMD
.:
GXW\F\FOH
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 6 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
FR4 PCB, single-sided copper, 1 cm2
Fig 5. Transient thermal impedance from junctio n to ambi ent as a function of pulse duration; typical values
FR4 PCB, 4-layer copper, 1 cm2
Fig 6. Transient thermal impedance from junctio n to ambi ent as a function of pulse duration; typical values
DDD
W
S
V
=WKMD
.:
GXW\F\FOH
DDD
W
S
V
=WKMD
.:
GXW\F\FOH
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 7 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
7. Characteristics
[1] Pulse test: tp 300 s; 0.02.
Table 8. Characteristics
Tamb = 25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base
cut-off current VCB = 20 V; IE = 0 A - - 100 nA
VCB = 20 V; IE = 0 A;
Tj= 150 C--5A
IEBO emitter-base
cut-off current VEB = 5 V; IC = 0 A - - 100 nA
hFE DC current gain VCE = 1 V; IC = 100 mA [1]
BC807-25QA 160 - 400
BC807-40QA 250 - 600
hFE DC current gain VCE = 1 V; IC = 500 mA [1] 40 - -
VCEsat collector-emitter
saturation voltage IC = 500 mA; IB = 50 mA [1] --700 mV
VBE base-emitter vo ltage IC = 500 mA; VCE = 1 V [1] --1.2 V
Cccollector capacitance VCB = 10 V; IE = ie = 0 A;
f=1MHz -6-pF
fTtransition frequency VCE = 5 V; IC = 10 mA;
f=100MHz 80--MHz
VCE = 1 V
(1) Tamb = 100 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Tamb = 25 C
Fig 7. BC807-25QA: DC current gain as a function of
collector current; typical valu es Fig 8. BC807-25QA: Collector current as a function
of collector-emitter voltage; typical values
006aaa120
400
200
600
hFE
0
IC (mA)
−10−1−103
−102
−1−10
(1)
(2)
(3)
9
&(
9
DDD
,&
$
,%P$
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 8 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
VCE = 1 V
(1) Tamb = 55C
(2) Tamb = 25 C
(3) Tamb = 100 C
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(3) Tamb = 100 C
Fig 9. BC807-25QA: Base-emitter voltage as a
function of collector current; typical values Fig 10. BC807-25QA: Base-emitter saturation voltage
as a function of collector current; typical
values
IC/IB = 10
(1) Tamb = 55C
(2) Tamb = 25 C
(3) Tamb = 100 C
VCE = 1 V
(1) Tamb = 100 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 11. BC807-25QA: Collector-emitter saturation
voltage as a function of collector current;
typical valu e s
Fig 12. BC807-40QA: DC current ga in as a function of
collector current; typical values
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9%(
9
,
&
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006aaa123
IC (mA)
−10−1−103
−102
−1−10
−1
−10
VBEsat
(V)
−10−1
(1)
(2)
(3)
006aaa126
−10−1
−10−2
−1
VCEsat
(V)
−10−3
IC (mA)
−10−1−103
−102
−1−10
(1)
(2)
(3)
006aaa121
400
200
600
800
hFE
0
IC (mA)
−10−1−103
−102
−1−10
(1)
(2)
(3)
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 9 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
Tamb = 25 CV
CE = 1 V
(1) Tamb = 55C
(2) Tamb = 25 C
(3) Tamb = 100 C
Fig 13. BC807-40QA: Collector current as a function
of collector-emitter voltage; typical values Fig 14. BC807-40QA: Base-emitter vo ltage as a
function of collector current; typical values
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(3) Tamb = 100 C
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(3) Tamb = 100 C
Fig 15. BC807-40QA: Base-emitter saturation voltage
as a function of collector current; typical
values
Fig 16. BC807-40QA: Collector-emitter saturation
voltage as a function of collector current;
typical values
9
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9
DDD
,&
$
,%P$
DDD
9%(
9
,
&
P$
006aaa124
IC (mA)
−10−1−103
−102
−1−10
−1
−10
VBEsat
(V)
−10−1
(1)
(2)
(3)
006aaa127
−10−1
−10−2
−1
VCEsat
(V)
−10−3
IC (mA)
−10−1−103
−102
−1−10
(1)
(2)
(3)
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 10 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
Fig 17. Package outline DFN1010D-3 (SOT1215)
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PD[
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 11 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
10. Soldering
Fig 18. Reflow soldering footprint for DFN1010D-3 (SOT1215)
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BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 12 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
11. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BC807-25QA_40QA v.1 20130830 Product data sheet - -
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 13 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificatio n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
12.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
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contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless ot herwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
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agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
BC807-25QA_40QA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 30 August 2013 14 of 15
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
No offer to sell or license — Nothing in this document may be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BC807-25QA; BC807-40QA
45 V, 500 mA PNP general-purpose transistors
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 August 2013
Document identifier: BC807-25QA_40QA
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . 10
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 10
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
13 Contact information. . . . . . . . . . . . . . . . . . . . . 14
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
