BYS10-25 thru BYS10-45
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Revision: 26-Mar-12 1Document Number: 86013
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Surface Mount Schottky Barrier Rectifier
FEATURES
Low profile package
Ideal for automated placement
Guardring for overvoltage protection
Low power losses, high efficiency
Very low switching losses
High surge capability
Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
AEC-Q101 qualified
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
For use in low voltage high frequency inverters,
freewheeling, DC/DC converters, and polarity protection
applications.
MECHANICAL DATA
Case: DO-214AC (SMA)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-E3 - RoHS-compliant, commercial grade
Base P/NHE3 - RoHS-compliant, AEC-Q101 qualified
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
E3 suffix meets JESD 201 class 1A whisker test, HE3 suffix
meets JESD 201 class 2 whisker test
Polarity: Color band denotes the cathode end
PRIMARY CHARACTERISTICS
IF(AV) 1.5 A
VRRM 25 V to 45 V
IFSM 40 A
VF0.50 V
TJ max. 150 °C
DO-214AC (SMA)
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL BYS10-25 BYS10-35 BYS10-45 UNIT
Device marking code BYS 025 BYS 035 BYS 045
Maximum repetitive peak reverse voltage VRRM 25 35 45 V
Maximum average forward rectified current IF(AV) 1.5 A
Peak forward surge current single half sine-wave
superimposed on rated load
8.3 ms
IFSM
40
A
10 ms 30
Junction and storage temperature range TJ, TSTG - 65 to + 150 °C
BYS10-25 thru BYS10-45
www.vishay.com Vishay General Semiconductor
Revision: 26-Mar-12 2Document Number: 86013
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
Notes
(1) Mounted on epoxy-glass hard tissue
(2) Mounted on epoxy-glass hard tissue, 50 mm2 35 μm Cu
(3) Mounted on Al-oxide-ceramic (Al2O3), 50 mm2 35 μm Cu
Note
(1) AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
(TA = 25 C unless otherwise noted)
Fig. 1 - Max. Reverse Power Dissipation vs.
Junction Temperature
Fig. 2 - Max. Reverse Current vs. Junction Temperature
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER TEST CONDITIONS SYMBOL BYS10-25 BYS10-35 BYS10-45 UNIT
Maximum instantaneous forward voltage (1) 1.0 A VF500 mV
Maximum DC reverse current (1) VRRM
TJ = 25 °C IR
500 μA
TJ = 100 °C 10 mA
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL BYS10-25 BYS10-35 BYS10-45 UNIT
Maximum thermal resistance, junction to lead RJL 25 °C/W
Maximum thermal resistance, junction to ambient
RJA (1) 150
°C/WRJA (2) 125
RJA (3) 100
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
BYS10-45-E3/TR 0.064 TR 1800 7" diameter plastic tape and reel
BYS10-45-E3/TR3 0.064 TR3 7500 13" diameter plastic tape and reel
BYS10-45HE3/TR (1) 0.064 TR 1800 7" diameter plastic tape and reel
BYS10-45HE3/TR3 (1) 0.064 TR3 7500 13" diameter plastic tape and reel
80400 120 160
0
1
2
3
4
7
200
5
6
BYS10-25
BYS10-35
BYS10-45
R
thJA
= 25 K/W
R
thJA
= 100 K/W
Junction Temperature (°C)
P
R
- Max. Reverse Power Dissipation (W)
80400 120 160
0.1
1
10
100
1000
200
VR = VRRM
Junction Temperature (°C)
Reverse Current (mA)
BYS10-25 thru BYS10-45
www.vishay.com Vishay General Semiconductor
Revision: 26-Mar-12 3Document Number: 86013
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 3 - Max. Average Forward Current vs. Ambient Temperature
Fig. 4 - Max. Average Forward Current vs. Ambient Temperature
Fig. 5 - Max. Forward Current vs. Forward Voltage
Fig. 6 - Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
0
0
0.4
0.8
1.2
1.6
2.0
40 80 120 160 200
BYS10-25
BYS10-35
BYS10-45
Ambient Temperature (°C)
Average Forward Current (A)
VR = VRRM, Half Sine-Wave, RthJA = 25 K/W
0
0
0.4
0.8
1.2
1.6
2.0
40 80 120 160 200
100 K/W
125 K/W
150 K/W
Ambient Temperature (°C)
Average Forward Current (A)
V
R
= 0 V, Half Sine-Wave
R
thJA
= 25 K/W
0 0.4 0.81.2 1.6
0.01
0.1
1
10
100
2.0
T
J
= 150 °C
T
J
= 25 °C
Forward Voltage (V)
Forward Current (A)
0.01 0.1 1 10 100
0.1
1
10
100
t - Heating Time (s)
Transient Thermal Impedance (°C/W)
0.008 (0.203)
0.194 (4.93)
0.208 (5.28)
0.157 (3.99)
0.177 (4.50)
0.100 (2.54)
0.110 (2.79)
0.078 (1.98)
0.090 (2.29)
0.006 (0.152)
0.012 (0.305)
0.049 (1.25)
0.065 (1.65)
Cathode Band
0 (0)
DO-214AC (SMA)
Mounting Pad Layout
0.074 (1.88)
MAX.
0.208 (5.28)
REF.
0.066 (1.68)
MIN.
0.060 (1.52)
MIN.
0.030 (0.76)
0.060 (1.52)
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 12-Mar-12 1Document Number: 91000
Disclaimer
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