FT04...D LOGIC LEVEL TRIAC On-State Current 4 Amp TO-252AA (DPAK) Gate Trigger Current < 10 mA Off-State Voltage 400 V / 800 V FEATURES Glass/passivated die junctions Medium current Triac Ideal for automated placement Low thermal resistance 2 High surge current capability 1 Low forward voltage drop 2 Solder dip 260C, 10s Component in accordance to RoHS 2011/65/EU and WEEE 2002/96/EC Meets MSL level 3, per J-STD-020, LF maximum peak of 260 C 3 MT1 (1) G (3) MT2 (2) MECHANICAL DATA Case: TO-252AA (DPAK). Epoxy meets UL 94V-0 flammability rating. Polarity: As marked on the body. Terminals : Matte tin plated leads, solderable per MIL-STD-750 Method 2026, J-STD-002 and JESD22-B102. Consumer grade, meets JESD 201 class 1A whisker test. TYPICAL APPLICATIONS Logic level versions are designed to interface directly with low power drivers such as microcontrollers. Maximun Ratings and Electrical Characteristics at 25C SYMBOL PARAMETER CONDITIONS Value Unit IT(RMS) RMS On-state Current (full sine wave) All Conduction Angle, Tc =95 C 4 A ITSM Non-repetitive On-State Current Full Cycle, 60 Hz (t = 16.7 ms) 33 A ITSM Non-repetitive On-State Current Full Cycle, 50 Hz (t = 20 ms) 30 A It Fusing Current tp = 10 ms, Half Cycle 4.5 A 2s IGM Peak Gate Current 20 s max. 4 A PG(AV) Average Gate Power Dissipation Tj = 125 C 1 W dI/dt Critical rate of rise of on-state current IG = 2x IGT, tr 100ns 50 A/s 2 Tj = 125 C f = 120 Hz, Tj = 125 C Tj Operating Temperature (-40 +125) C Tstg Tsld Storage Temperature (-40 +150) C 260 C Soldering Temperature SYMBOL VDRM/VRRM PARAMETER Repetitive Peak Off State Voltage www.fagorelectronica.com Document Name: ft04dll 10s max VOLTAGE D 400 Revision: 1 M 600 S 700 Unit N 800 V Version: May-13 Page Number: 1/6 FT04...D LOGIC LEVEL TRIAC Electrical Characteristics at Tamb = 25 C SYMBOL IGT (1) PARAMETER VD = 12 VDC, RL = 33 W, Tj = 25 C Gate Trigger Current Q1/Q3 MAX 07 5 MAX 7 Q4 VGT VGD IH IL VD = 12 VDC, RL = 33 W, Tj = 25 C Gate Trigger Voltage Gate Non Trigger Voltage dV/dt (2) 08 10 Unit mA mA Q1/Q3 MAX 1.3 V Q1/Q4 MAX 1.3 V VD = VDRM, RL = 3.3 KW, Tj = 125 C Q1/Q3 MIN 0.2 V Q1/Q4 MIN 0.2 V IT = 100 mA, Gate open, Tj = 25 C IG = 1.2 IGT, Tj = 25 C Holding Current Latching Current (2) SENSITIVITY Quadrant CONDITIONS 15 25 MAX Q1,Q3 MAX 15 Q1,Q3,Q4 MAX 20 Q2 MAX 30 30 mA MIN 20 40 V/s Critical Rate of Voltage Rise VD = 0.67 x VDRM, Gate open mA mA mA Tj = 125 C (dl/dt)c VTM Vto (2) (2) (2) rd IDRM/IRRM (2) Critical Rate of Current Rise (dv/dt)c = 0.1 V/s Tj = 125 C MIN 1.8 2.7 A/ms (dv/dt)c = 10 V/s Tj = 125 C MIN 0.9 2.0 A/ms without snubber Tj = 125 C MIN - - On-state Voltage IT = 5.5 Amp, tp = 380 s, Tj = 25 C MAX 1.6 V Threshold Voltage Tj = 125 C MAX 0.9 V Dynamic resistance Off-State Leakage Current Tj = 125 C VD = VDRM, MAX MAX 140 0.5 mW Tj = 125 C VR = VRRM, Tj = 25 C MAX 5 A mA Rth(j-c) Thermal Resistance Junction-Case for AC 360 conduction angle 2.2 C/W Rth(j-a) Thermal Resistance Junction-Ambient S = 1 cm2 70 C/W (1) Minimum IGT is guaranted at 5% of IGT max. (2) For either polarity of electrode MT2 voltage with reference to electrode MT1. Part Number Information F T 04 07 M D 00 TR FAGOR PACKAGING FORMING TRIAC CASE VOLTAGE CURRENT SENSITIVITY www.fagorelectronica.com Document Name: ft04dll Revision: 1 Version: May-13 Page Number: 2/6 FT04...D LOGIC LEVEL TRIAC Ordering information PREFERRED P/N PACKAGE CODE FT0407MD 00TR TR DELIVERY MODE BASE QUANTITY UNIT WEIGHT (g) 13" diameter tape and reel 2,500 0.30 Package Outline Dimensions: (mm) TO-252AA (DPAK) 72 E A c2 E1 7 REF MC XXXD WWY Test sort name H L3 o1x0.15 Marking code Format type Year code Week code 1.778 L4 D REF. A1 L 0.08 MAX L2 b e 4.57 Typ Mounting Pad Layout 6.7 6.7 A A1 b c2 D E E1 e H L L2 L3 L4 Min. 2.18 0 0.64 0.46 5.97 6.47 5.20 9.77 1.31 0.46 0.89 0.51 DIMENSIONS Milimeters Nominal 2.3 0.127 0.75 0.51 6.1 6.6 5.34 2.28BSC 10.03 1.44 0.51 1.02 0.76 Max. 2.39 0.127 0.89 0.56 6.22 6.73 5.46 10.28 1.57 0.56 1.14 1.02 3 3 1.6 2.3 1.6 2.3 www.fagorelectronica.com Document Name: ft04dll Revision: 1 Version: May-13 Page Number: 3/6 FT04...D LOGIC LEVEL TRIAC Ratings and Characteristics (Ta 25 C unless otherwise noted) Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle). 5 Fig. 2: RMS on-state current versus case temperature (full cycle). P (W) 5 4 4 3 3 2 2 360 1 IT(RMS)(A) 1 a 0 IT(RMS)(A) 0.5 0 1.5 1 2 2.5 3 3.5 0 50 25 75 K=[Zth / Rth] 20.0 Zth(j-c) 10.0 Zth(j-a) 1E-2 1E-3 Tj max Vt(o) = 0.9 V rd = 140 mW 1.0 tp (s) 1E-2 1E-1 0.1 1E+0 1E+1 1E+2 5E+2 Tj initial 25 C 2 I TSM (A) 2 ITSM(A). I t (A s) 100 Tj initial = 25 C F = 50Hz 30 VTM (V) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Fig. 6: Non repetitive surge peak on-state current for a sinusoidal pulse with width: 2 tp < 10 ms, and corresponding value of I t. Fig. 5: Surge peak on-state current versus number of cycles 35 125 ITM (A) Tj max. 1E-1 100 Fig. 4: On-state characteristics (maximum values) Fig. 3: Relative variation of thermal impedance versus pulse duration. 1E+0 0 Tj initial = 25 C ITSM 25 20 10 2 15 I t 10 5 0 Number of cycles 1 www.fagorelectronica.com Document Name: ft04dll 10 100 1000 Revision: 1 1 tp(ms) 1 10 Version: May-13 Page Number: 4/6 FT04...D LOGIC LEVEL TRIAC Ratings and Characteristics (Ta 25 C unless otherwise noted) Fig. 7: Relative variation of gate trigger current, holding current and latching versus junction temperature (typical values) 2.5 IGT,IH,IL[Tj]/IGT,IH,IL.[Tj=25C] 2.0 (dI/dt)c [Tj]/(dI/dc)c [Tj specified] 6 5 IGT 4 1.5 1.0 Fig. 8: Relative variation of critical rate of decrease of main current versus junction temperature 3 IH&IL 2 0.5 1 Tj(C) 0 -40 -20 0 20 40 60 80 100120140 0 Tj(C) 0 25 50 75 100 125 Fig. 9: Relative variation of critical rate of decrease of main current versus 2.0 (dV/dt)c (typical values). 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.1 (dV/dt)c (V/S) 1.0 www.fagorelectronica.com Document Name: ft04dll 10.0 100.0 Revision: 1 Version: May-13 Page Number: 5/6 FT04....D LOGIC LEVEL TRIAC Revision History Date Revision Description of Changes 14-Sep-2009 0 Original Data Sheet 21-May-2013 1 200V eliminated Disclaimer All product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. 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