2N6027, 2N6028 Preferred Device Programmable Unijunction Transistor Programmable Unijunction Transistor Triggers Designed to enable the engineer to "program'' unijunction characteristics such as RBB, , IV, and IP by merely selecting two resistor values. Application includes thyristor-trigger, oscillator, pulse and timing circuits. These devices may also be used in special thyristor applications due to the availability of an anode gate. Supplied in an inexpensive TO-92 plastic package for high-volume requirements, this package is readily adaptable for use in automatic insertion equipment. * Programmable -- RBB, , IV and IP * Low On-State Voltage -- 1.5 Volts Maximum @ IF = 50 mA * Low Gate to Anode Leakage Current -- 10 nA Maximum * High Peak Output Voltage -- 11 Volts Typical * Low Offset Voltage -- 0.35 Volt Typical (RG = 10 k ohms) * Device Marking: Logo, Device Type, e.g., 2N6027, Date Code http://onsemi.com PUTs 40 VOLTS 300 mW G A K MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Symbol Value Unit PF 1/JA 300 4.0 mW mW/C *DC Forward Anode Current Derate Above 25C IT 150 2.67 mA mA/C *DC Gate Current IG *Power Dissipation Derate Above 25C "50 Repetitive Peak Forward Current 100 s Pulse Width, 1% Duty Cycle *20 s Pulse Width, 1% Duty Cycle ITRM Non-Repetitive Peak Forward Current 10 s Pulse Width ITSM 5.0 *Gate to Cathode Forward Voltage VGKF 40 *Gate to Cathode Reverse Voltage VGKR *5.0 *Gate to Anode Reverse Voltage VGAR 40 *Anode to Cathode Voltage(1) Operating Junction Temperature Range *Storage Temperature Range 1 Amps PIN ASSIGNMENT 1 Amps 3 TO-92 (TO-226AA) CASE 029 STYLE 16 mA 1.0 2.0 2 Anode 2 Gate 3 Cathode Volts Volts Volts VAK "40 TJ -50 to +100 C Tstg -55 to +150 C Volts ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. Preferred devices are recommended choices for future use and best overall value. *Indicates JEDEC Registered Data (1) Anode positive, RGA = 1000 ohms Anode negative, RGA = open Semiconductor Components Industries, LLC, 2000 May, 2000 - Rev. 2 1 Publication Order Number: 2N6027/D 2N6027, 2N6028 THERMAL CHARACTERISTICS Symbol Max Unit Thermal Resistance, Junction to Case Characteristic RJC 75 C/W Thermal Resistance, Junction to Ambient RJA 200 C/W TL 260 C Maximum Lead Temperature for Soldering Purposes ( 1/16 from case, 10 secs max) t ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted.) Characteristic *Peak Current (VS = 10 Vdc, RG = 1 M) (VS = 10 Vdc, RG = 10 k ohms) *Offset Voltage (VS = 10 Vdc, RG = 1 M) (VS = 10 Vdc, RG = 10 k ohms) *Valley Current (VS = 10 Vdc, RG = 1 M) (VS = 10 Vdc, RG = 10 k ohms) (VS = 10 Vdc, RG = 200 ohms) Fig. No. Symbol 2,9,11 IP 2N6027 2N6028 2N6027 2N6028 1 Typ Max -- -- -- -- 1.25 0.08 4.0 0.70 2.0 0.15 5.0 1.0 0.2 0.2 0.2 0.70 0.50 0.35 1.6 0.6 0.6 -- -- 70 25 1.5 1.0 18 18 150 150 -- -- 50 25 -- -- -- -- -- -- 1.0 3.0 10 -- Volts A IV 2N6027 2N6028 2N6027 2N6028 2N6027 2N6028 Unit A VT 2N6027 2N6028 (Both Types) 1,4,5 Min *Gate to Anode Leakage Current (VS = 40 Vdc, TA = 25C, Cathode Open) (VS = 40 Vdc, TA = 75C, Cathode Open) -- Gate to Cathode Leakage Current (VS = 40 Vdc, Anode to Cathode Shorted) *Forward Voltage (IF = 50 mA Peak)(1) -- IGKS -- 5.0 50 nAdc 1,6 VF -- 0.8 1.5 Volts *Peak Output Voltage (VG = 20 Vdc, CC = 0.2 F) 3,7 Vo 6.0 11 -- Volt Pulse Voltage Rise Time (VB = 20 Vdc, CC = 0.2 F) 3 tr -- 40 80 ns *Indicates JEDEC Registered Data (1) Pulse Test: Pulse Width 300 sec, Duty Cycle 2%. http://onsemi.com 2 IGAO mA nAdc 2N6027, 2N6028 IA IA +VB A G R2 - VS = VAK + R1 V R1 + R2 B -VP VS VT = VP - VS RG VAK R1 VA RG = R1 R2 R1 + R2 VS K VF VV IGAO 1B - Equivalent Test Circuit for Figure 1A used for electrical characteristics testing (also see Figure 2) 1A - Programmable Unijunction with "Program" Resistors R1 and R2 IP IV IF IA IC - Electrical Characteristics Figure 1. Electrical Characterization Adjust for Turn-on Threshold 100k 1.0% 2N5270 VB 0.01 F Scope 20 +VB - IP (SENSE) 100 V = 1.0 nA + Put Under Test +V 510k 16k Vo 6V R RG = R/2 VS = VB/2 (See Figure 1) CC vo 20 27k 0.6 V tf R Figure 2. Peak Current (IP) Test Circuit Figure 3. Vo and tr Test Circuit http://onsemi.com 3 t 2N6027, 2N6028 TYPICAL VALLEY CURRENT BEHAVIOR 500 IV, VALLEY CURRENT ( A) IV, VALLEY CURRENT ( A) 1000 RG = 10 k 100 100 k 1 M RG = 10 k 100 100 k 1 M 10 10 5 10 15 5 -50 20 -25 VS, SUPPLY VOLTAGE (VOLTS) Figure 4. Effect of Supply Voltage Vo, PEAK OUTPUT VOLTAGE (VOLTS) V F, PEAK FORWARD VOLTAGE (VOLTS) +75 25 TA = 25C 2.0 1.0 0.5 0.2 0.1 0.05 0.02 0.01 0.01 +50 0.02 0.05 0.1 0.2 0.5 +100 Figure 5. Effect of Temperature 10 5.0 +25 0 TA, AMBIENT TEMPERATURE (C) 1.0 2.0 20 15 10 1000 pF 5.0 0 0 5.0 CC = 0.2 F TA = 25C (SEE FIGURE 3) 5.0 10 15 20 25 30 IF, PEAK FORWARD CURRENT (AMP) VS, SUPPLY VOLTAGE (VOLTS) Figure 6. Forward Voltage Figure 7. Peak Output Voltage A E RT R2 P N P N G K + B2 A G RBB = R1 + R2 R1 = R1 + R2 R1 R2 G A R1 CC K K B1 Circuit Symbol Equivalent Circuit with External "Program" Resistors R1 and R2 Figure 8. Programmable Unijunction http://onsemi.com 4 Typical Application 35 40 2N6027, 2N6028 TYPICAL PEAK CURRENT BEHAVIOR 2N6027 100 50 5.0 IP, PEAK CURRENT ( A) IP, PEAK CURRENT ( A) 10 3.0 2.0 1.0 RG = 10 k 0.5 0.3 0.2 100 k 1.0 M TA = 25C (SEE FIGURE 2) 20 VS = 10 VOLTS (SEE FIGURE 2) 10 5.0 2.0 1.0 0.5 RG = 10 k 100 k 1.0 M 0.2 0.1 5.0 10 15 0.1 -50 20 -25 0 +25 +50 +75 VS, SUPPLY VOLTAGE (VOLTS) TA, AMBIENT TEMPERATURE (C) Figure 9. Effect of Supply Voltage and RG Figure 10. Effect of Temperature and RG +100 10 1.0 0.7 0.5 5.0 IP, PEAK CURRENT ( A) IP, PEAK CURRENT ( A) 2N6028 RG = 10 k 0.3 0.2 0.1 0.07 0.05 100 k 1.0 M TA = 25C (SEE FIGURE 2) 0.03 0.02 2.0 VS = 10 VOLTS (SEE FIGURE 2) 1.0 0.5 0.2 RG = 10 k 0.1 0.05 100 k 1.0 M 0.02 0.01 5.0 10 15 0.01 -50 20 VS, SUPPLY VOLTAGE (VOLTS) -25 0 +25 +50 +75 TA, AMBIENT TEMPERATURE (C) Figure 11. Effect of Supply Voltage and RG Figure 12. Effect of Temperature and RG http://onsemi.com 5 +100 2N6027, 2N6028 TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL H2A H2A H2B H2B H W2 H4 H5 T1 L1 H1 W1 W L T T2 F1 F2 P2 D P2 P1 P Figure 13. Device Positioning on Tape Specification Inches Symbol Item Millimeter Min Max Min Max 0.1496 0.1653 3.8 4.2 D Tape Feedhole Diameter D2 Component Lead Thickness Dimension 0.015 0.020 0.38 0.51 Component Lead Pitch 0.0945 0.110 2.4 2.8 F1, F2 H Bottom of Component to Seating Plane H1 Feedhole Location .059 .156 1.5 4.0 0.3346 0.3741 8.5 9.5 1.0 H2A Deflection Left or Right 0 0.039 0 H2B Deflection Front or Rear 0 0.051 0 1.0 0.7086 0.768 18 19.5 H4 Feedhole to Bottom of Component H5 Feedhole to Seating Plane 0.610 0.649 15.5 16.5 L Defective Unit Clipped Dimension 0.3346 0.433 8.5 11 L1 Lead Wire Enclosure 0.09842 -- 2.5 -- P Feedhole Pitch 0.4921 0.5079 12.5 12.9 P1 Feedhole Center to Center Lead 0.2342 0.2658 5.95 6.75 First Lead Spacing Dimension 0.1397 0.1556 3.55 3.95 0.06 0.08 0.15 0.20 -- 0.0567 -- 1.44 P2 T Adhesive Tape Thickness T1 Overall Taped Package Thickness T2 Carrier Strip Thickness 0.014 0.027 0.35 0.65 W Carrier Strip Width 0.6889 0.7481 17.5 19 W1 Adhesive Tape Width 0.2165 0.2841 5.5 6.3 W2 Adhesive Tape Position .0059 0.01968 .15 0.5 NOTES: 1. Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 3. Component lead to tape adhesion must meet the pull test requirements. 4. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than 1 consecutive missing component is permitted. 7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes. http://onsemi.com 6 2N6027, 2N6028 ORDERING & SHIPPING INFORMATION: 2N6027 and 2N6028 packaging options, Device Suffix Europe Equivalent U.S. 2N6027, 2N6028 2N6027, 2N6028RLRA 2N6027RL1 2N6028RLRM 2N6028RLRP Shipping Description of TO92 Tape Orientation Bulk in Box (5K/Box) Radial Tape and Reel (2K/Reel) Radial Tape and Reel (2K/Reel) Radial Tape and Fan Fold Box (2K/Box) Radial Tape and Fan Fold Box (2K/Box) N/A, Bulk Round side of TO92 and adhesive tape visible Flat side of TO92 and adhesive tape visible Flat side of TO92 and adhesive tape visible Round side of TO92 and adhesive tape visible PACKAGE DIMENSIONS TO-92 (TO-226AA) CASE 029-11 ISSUE AJ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R P L SEATING PLANE K DIM A B C D G H J K L N P R V D X X G J H V C SECTION X-X 1 N N INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- STYLE 16: PIN 1. ANODE 2. GATE 3. CATHODE http://onsemi.com 7 MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 --- 2N6027, 2N6028 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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