DATASHEET
LOW SKEW PCI/PCI-X BUFFER ICS2304NZ-1
IDT™ / ICS™
LOW SKEW PCI/PCI-X BUFFER 1
ICS2304NZ-1 REV E 081109
Description
The ICS2304NZ-1 is a high-performance, low skew, low
jitter PCI/PCI-X clock driver. It is designed to distribute
high-speed signals in PCI/PCI-X applications operating at
speeds from 0 to 140 MHz.
The ICS2304NZ-1 is characterized for operation from -40°C
to +85°C for automotive and industrial applications.
Features
Packaged in 8-pin TSSOP (4.4 mm body)
Available in Pb (lead) free package
Frequency range of 0 to 140 MHz
Less than 100 ps skew between outputs
Distribute one clock input to one bank of four outputs
Operating voltage of 3.3 V ±10%
Available in commercial and industrial temperature
ranges
NOTE: EOL for non-green parts to occur on
5/13/10 per PDN U-09-01
Block Diagram
Logic
Control
OE
CLK_IN
CLK2
CLK1
CLK0
CLK3
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Pin Assignment Functionality Table
Pin Descriptions
CLK_IN
OE
CLK0
CLK2
GND
VDD
CLK1
CLK31
2
3
4
8
7
6
5
Inputs Outputs
CLK_IN OE CLK(3:0)
0 0 Tristate
01 0
1 0 Tristate
11 1
Pin
Number
Pin
Name
Pin
Type
Pin Description
1 CLK_IN Input Input reference frequency.
2 OE Input Output Enable. When OE is low, it tri-states clock outputs.
3 CLK0 Output Buffered clock output.
4 GND Power Connect to ground.
5 CLK1 Output Buffered clock output.
6 VDD Power Power supply for 3.3 V.
7 CLK2 Output Buffered clock output.
8 CLK3 Output Buffered clock output.
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Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS2304NZ-1. These ratings, which
are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at
these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Notes:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are
observed.
2. This value is limited to 4.6 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51.
Recommended Operation Conditions
Timing Requirements Over Recommended Ranges of Supply Voltage and Operating Free-air
Temperature
Item Rating
Supply Voltage Range, VDD -0.5 V to 4.3 V
Input Voltage Range, VI (see notes 1 and 2) -0.5 V to VDD + 0.5 V
Output Voltage Range, VO (see notes 1 and 2) -0.5 V to VDD + 0.5 V
Input Clamp Current, IIK (VI<0 or VI>VDD50 mA
Output Clamp Current, IIK (VO<0 or VO50 mA
Continuous Total Output Current, IO (VO = 0 to VDD50 mA
Package Thermal Impedance, θJA (see note 3): PW
Package
230.5°C/W
Storage Temperature Range, Tstg -65°C to 150°C
Parameter Min. Typ. Max. Units
Supply Voltage, VDD 33.33.6V
High-level Input Voltage, VIH 0.7 x VDD V
Low-level Input Voltage, VIL 0.3 x VDD V
Input Voltage, VI0V
DD V
High-level Output Current, IOH -24 mA
Low-level Output Current, IOL 24 mA
Operating Free-air Temperature, TA-40 +85 °C
Min. Typ. Max. Units
Clock Frequency, fCLK 0 140 MHz
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Electrical Characteristics at 3.3 V over Recommended Free-air Temperature Range
VDD = 3.3 V ±10%, TA = -40°C to +85°C (unless stated otherwise)
Note 1: Guaranteed by design, not 100% tested in production.
Parameter Symbol Conditions Min. Typ. Max. Units
Input Voltage VIK VDD at 3.3 V, II = -18 mA -1.2 V
High-level Output Voltage VOH
VDD = min to max,
IOH = -1 mA
VDD-0.2 3.3
V
VDD = 3 V, IOH = -24 mA 2 2.3
VDD = 3 V, IOH = -12 mA 2.4 2.7
Low-level Output Voltage VOL
VDD = min to max,
IOH = 1 mA
0.222 0.2
V
VDD = 3 V, IOL = 24 mA 0.61 0.8
VDD = 3 V, IOL = 12 mA 0.31 0.55
High-level Input Current IOH
VDD = 3 V, VO = 1 V -53 -40 mA
VDD = 3.3 V, VO = 1.65 V -54
Low-level Input Current IOL
VDD = 3 V, VO = 2 V 40 53 mA
VDD = 3.3 V, VO = 1.65 V 57
Input Current IIV = VDD or VO0.1 50 µA
Dynamic Supply Current IDD Unloaded outputs at
66.67 MHz
13 37 mA
Input Capacitance
(Note 1)
CIVDD = 3.3 V,
VI = 0V or 3.3 V
35pF
Output Capacitance
(Note 1)
COVDD = 3.3 V,
VI = 0V or 3.3 V
3.2 pF
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Switching Characteristics at 3.3 V over Recommended Ranges of Supply Voltage
and Operating Free-air Temperature
VDD = 3.3 V ±10%, TA = -40°C to 85°C (unless stated otherwise)
Note 1: Guaranteed by design, not 100% tested in production.
Parameter Symbol Conditions Min. Typ. Max. Units
High-to-Low Propagation Delay (Note 1) tPLH VO = VDD/2 1.8 3.1 3.8 ns
Low-to-High Propagation Delay (Note 1) tPHL VO = VDD/2 1.8 2.9 3.8 ns
Output Skew Window (Note 1) TSK(o) VO = VDD/2 50 100 ps
Pulse Skew = | tPLH - tPHL | (Note 1) TSK(p) VO = VDD/2 300 ps
Process Skew (Note 1) TSK(pr) VO = VDD/2 500 ps
CLKIN High Time (Note1) Thigh
66 MHz 6 ns
140 MHz 3 ns
CLKIN Low Time (Note1) Tlow
66 MHz 6 ns
140 MHz 3 ns
Rise Time (Note 1) TrVOL=0.8 V,
VOH=2.0 V
1.2 2.0 ns
Fall Time (Note 1) TfVOH=2.0 V,
VOL=0.8 V
1.2 2.0 ns
Cycle-to-Cycle Jitter Tcyc-cyc Loaded
outputs
200 ps
Jitter, 1-Sigma Tj1s 10,000 cycles 14 40 ps
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Parameter Measurement Information
Figure 2. Voltage Thresholds for Propagation Delay (tpd) Measurements
Figure 3. Output Skew
Figure 4. Clock Waveform
CLK0-CLK3 0.8 V
2.0 V
50% VDD
0.8 V
2.0 V
50% VDD
CLKIN
50% VDD
0V
VOH
VOL
trtf
tPLH tPHL
VDD
50% VDD
Any CLK
tSK(p)
Any CLK
50% VDD
0.2 VDD
0.5 VDD
tCYC
tHIGH
tLOW
VTEST
VIH (MIN)
VIL (MAX)
0.4 VDD
Peak-to-Peak (minimum)
Parameter Value Unit
VIH (MIN)
VIL (MAX)
VTEST
0.5 VDD
0.4 VDD
0.35 VDD
V
V
V
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Figure 5. Supply Current vs. Frequency
Figure 6. High-level Output Voltage vs. High-level Output Current
VOH - High-level Output Voltage (V)
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Figure 7. Low-level Output Voltage vs. Low-level Output Current
VOL - Low-level Output Voltage (V)
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Marking Diagram
Marking Diagram (industrial)
Notes:
1. ###### is the lot number.
2. YYWW is the last two digits of the year and week that the
part was assembled.
3. “L” denotes Pb (lead) free package.
Marking Diagram (Pb free)
Marking Diagram (Pb free/industrial)
BOTTOM
TOP
$$##
####
YYWW
304N1
14
58
BOTTOM
TOP
YYWW
04NI1
14
58
$$##
####
BOTTOM
TOP
YYWW
304NL
14
58
##
####
BOTTOM
TOP
##
####
YYWW
04NIL
14
58
ICS2304NZ-1
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Package Outline and Package Dimensions (8-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch)
Package dimensions are kept current with JEDEC Publication No. 95, MO-153
Ordering Information
*NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01.
Parts that are ordered with a “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, IDT assumes no responsibility for either its use
or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses
are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended
temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing
by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product
for use in life support devices or critical medical instruments.
Part / Order Number Marking Shipping Packaging Package Temperature
2304NZG-1*
see page 8
Tubes 8-pin TSSOP 0 to +70° C
2304NZG-1T* Tape and Reel 8-pin TSSOP 0 to +70° C
2304NZG-1LF Tubes 8-pin TSSOP 0 to +70° C
2304NZG-1LFT Tape and Reel 8-pin TSSOP 0 to +70° C
2304NZGI-1* Tubes 8-pin TSSOP -40 to +85° C
2304NZGI-1T* Tape and Reel 8-pin TSSOP -40 to +85° C
2304NZGI-1LF Tubes 8-pin TSSOP -40 to +85° C
2304NZGI-1LFT Tape and Reel 8-pin TSSOP -40 to +85° C
INDEX
AREA
1 2
8
D
E1 E
SEATING
PLANE
A1
A
A2
e
- C -
b
aaa C
c
L
Millimeters Inches
Symbol Min Max Min Max
A--1.20--0.047
A1 0.05 0.15 0.002 0.006
A2 0.80 1.05 0.032 0.041
b 0.19 0.30 0.007 0.012
C 0.09 0.20 0.0035 0.008
D 2.90 3.10 0.114 0.122
E 6.40 BASIC 0.252 BASIC
E1 4.30 4.50 0.169 0.177
e 0.65 Basic 0.0256 Basic
L 0.45 0.75 0.018 0.030
α0°8°0°8°
aaa -- 0.10 -- 0.004
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their respective owners.
Printed in USA
Corporate Headquarters
Integrated Device Technology, Inc.
www.idt.com
For Sales
800-345-7015
408-284-8200
Fax: 408-284-2775
For Tech Support
www.idt.com/go/clockhelp
Innovate with IDT and accelerate your future networks. Contact:
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ICS2304NZ-1
LOW SKEW PCI/PCI-X BUFFER FAN OUT BUFFER