PAN1026A
Bluetooth Basic Data Rate and Low Energy Module
Product Specification
Rev. 0.1
Wireless Modules

PAN1026A Bluetooth Module
Product Specification Rev. 0.1 Page 2
Overview
The PAN1026A is a Class 2 Bluetooth 4.2 Basic
Data Rate and Low Energy module for easy
implementation of Bluetooth functionality into
various electronic devices.
Features
• Bluetooth 4.2 Basic Data Rate (BR) and Low
Energy (LE)
• Embedded SPP profile
• Embedded GATT profile
• High-level API commands
• Bluetooth 4.2 (LE) embedded GATT profile with
high-level API commands, compatible with
Toshiba reference BLE profiles
• Operational temperature range -40 to +85 °C
• Operational voltage 2.7 V to 3.6 V +/- 10 %
• Power consumption Tx: 46 mA
• Dimensions 15.6 x 8.7 x 1.9 mm
• Output power 4 dBm
• -88 dBm sensitivity
• Integrated high speed crystal oscillator (26 MHz)
New Features
• Increased (2.5 x) BLE data transfer rates through
extended MTU size (64 bytes to 160 bytes)
• More complex BLE profiles possible through
extended GATT functionality
• Data base pool, number of services and
characteristics, data flow control
• Fast SPP classic connection/disconnection times
• Interlaced inquiry/page scan & extended inquiry
response
• Transmission (Tx) power control
• Improved PER (peak-error-rate) for BLE traffic
• Integration of BT 4.2 secure connecting feature
implementing ECDH technology
Bluetooth
• GAP support for SPP
• GAP Peripheral and Broadcast support for LE
• GATT server and client mode support for LE
• GAP Central and Observer not supported for LE
Interfaces
• UART, GPIO (10 input/output pins), wake-up
control pins
Block Diagram
Chip
antenna
Toshiba
TC35661
EEPROM
32 kbit
UART
GPIOs
Host wake up
Reset
32 kHz input
Wake up
Vcc 3.3 V
LPF
PAN1026A
Bluetooth 4.2 Module
Crystal
26 MHz
PAN1026A Bluetooth Module
Product Specification Rev. 0.1 Page 3
PAN1026A Bluetooth Module
Product Specification Rev. 0.1 Page 4
Table of Contents
1 About This Document ......................................................................................................................... 5
1.1 Purpose and Audience .............................................................................................................. 5
1.2 Revision History ......................................................................................................................... 5
1.3 Use of Symbols ......................................................................................................................... 5
1.4 Related Documents ................................................................................................................... 5
2 Overview .............................................................................................................................................. 6
2.1 Block Diagram ........................................................................................................................... 7
2.2 Pin Configuration ....................................................................................................................... 8
2.3 UART Interface ........................................................................................................................ 10
2.4 Bluetooth Features .................................................................................................................. 10
3 Detailed Description ......................................................................................................................... 11
3.1 Dimensions .............................................................................................................................. 11
3.2 Footprint .................................................................................................................................. 12
3.3 Packaging ................................................................................................................................ 13
3.4 Case Marking .......................................................................................................................... 16
4 Specification ..................................................................................................................................... 17
4.1 Default Test Conditions ........................................................................................................... 17
4.2 Absolute Maximum Ratings ..................................................................................................... 17
4.3 Recommended Operating Conditions ...................................................................................... 18
4.4 Current Consumption............................................................................................................... 18
4.5 Bluetooth ................................................................................................................................. 19
4.6 Reliability Tests ....................................................................................................................... 19
4.7 Recommended Soldering Profile ............................................................................................. 20
5 Cautions ............................................................................................................................................ 21
5.1 Design Notes ........................................................................................................................... 21
5.2 Installation Notes ..................................................................................................................... 21
5.3 Usage Condition Notes ............................................................................................................ 22
5.4 Storage Notes .......................................................................................................................... 22
5.5 Safety Cautions ....................................................................................................................... 22
5.6 Other Cautions ........................................................................................................................ 23
5.7 Life Support Policy ................................................................................................................... 23
6 Regulatory and Certification Information ....................................................................................... 24
6.1 RoHS and REACH Declaration ............................................................................................... 24
6.2 Further Regulatory Information ................................................................................................ 24
7 Appendix ........................................................................................................................................... 25
7.1 Ordering Information ................................................................................................................ 25
7.2 Contact Details ........................................................................................................................ 26
PAN1026A Bluetooth Module
1 About This Document
Product Specification Rev. 0.1 Page 5
1 About This Document
1.1 Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN1026A module. It is intended for hardware design,
application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to
as “the PAN1026A” or “the module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
0.1
23.03.2017
1st preliminary version.
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product. Non-observance
can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates crossreferences within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4 Related Documents
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 0.1 Page 6
2 Overview
The PAN1026A is based on Toshiba´s single-chip TC35661 Bluetooth semiconductor device
with an embedded Toshiba Bluetooth SIG certified stack. The PAN1026A is a highly integrated
Dual Mode Bluetooth controller that delivers high-speed operation at ultra-low power
consumption. An embedded SPP (Serial Port Profile of Bluetooth Classic) and a GATT (Generic
Attribute Profile of Bluetooth LE) stack are integrated. The module significantly reduces external
component count and power consumption in applications requiring support of Bluetooth 4.2
standards. EDR (Enhanced Data Rate) or Central Mode are not supported. Details about iAP
integration can be provided on request. The integrated EEPROM has a Panasonic
MAC address and it can be used to store link keys.
The module allows for serving both legacy Bluetooth Classic and Bluetooth Low Energy
connections with rapid connection and disconnection, needed by a wide range of applications,
all at a small form factor. Compared to the PAN1026, the PAN1026A has additional features for
secure connections via Bluetooth LE and it is fully backwards compatible. Next to increased low
energy transfer speed, transmission power can also be controlled.
The PAN1026A module is manufactured in a small 15.6 x 8.7 x 1.9 mm SMD package with a
shielded case and it is qualified according to the Bluetooth 2.1 and 4.2 standards.
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
Further information on the variants and versions 7.1 Ordering Information.
PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 0.1 Page 7
2.1 Block Diagram
Total capacitor value: 6.7 µF +/-10 %
Total inductance: 2 NH +/-10 %
Total resistance: 220 KΩ +/-10 %
Chip
antenna
Toshiba
TC35661
EEPROM
32 kbit
UART
GPIOs
Host wake up
Reset
32 kHz input
Wake up
Vcc 3.3 V
LPF
PAN1026A
Bluetooth 4.2 Module
Crystal
26 MHz
PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 0.1 Page 8
2.2 Pin Configuration
Pin Assignment
Top View
Pin Functions
No
Pin Name
GPIO No
Pin Type
Description
A1
GND
Ground Pin
Connect to ground
A2
NC
NC
Not connected, leave open
A3
Reset
Digital Input
Reset, active low
A4
VCC
Power
analog/digital power supply connection
A5
VCC
Power
analog/digital power supply connection
A6
VCC
Power
analog/digital power supply connection
A7
GND
Ground Pin
Connect to ground
A8
NC
NC
Not connected
A9
GND
Ground Pin
Connect to ground
A11
GND
Ground Pin
Connect to ground
A12
GND
Ground Pin
Connect to ground
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4
PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 0.1 Page 9
No
Pin Name
GPIO No
Pin Type
Description
B1
NC
NC
Not connected, leave open
B2
BTS
GPIO 11
B3
BTA
GPIO 10
B4
NC
NC
Not connected, leave open
B5
NC
NC
Not connected, leave open
B6
NC
NC
Not connected, leave open
B7
NC
NC
Not connected, leave open
B8
NC
NC
Not connected, leave open
B9
NC
NC
Not connected, leave open
C1
CS0X
GPIO 17
C2
BTI
GPIO 13
C3
WIA
GPIO 12
C4
NC
NC
Not connected, leave open
C5
NC
NC
Not connected, leave open
C6
PCMCLK
GPIO 04
Digital I/O
PCM clock
C7
FSYNC
GPIO 05
Digital I/O
PCM synchronization
C8
GND
Ground Pin
Connect to ground
C9
GND
Ground Pin
Connect to ground
D1
CS1X
GPIO 18
D2
DIN
GPIO 16
D3
GPIO1
GPIO 01
Digital I/O
D4
GPIO0
Digital I/O
D5
NC
NC
Not connected, leave open
D6
PCMIN
GPIO 03
Digital Input
PCM In: Not supported
D7
GND
Ground Pin
Connect to ground
D8
GND
Ground Pin
Connect to ground
D9
ANT
RF-Signal
Antenna pin (not connected for standard version)
E1
SDA
GPIO 15
Digital I/O
I2C interface (only internal), connect to test pin
E2
SCL
GPIO 14
Digital I/O
I2C interface (only internal), connect to test pin
E3
GND
Ground Pin
Connect to ground
E4
USB
USB direct is not supported by the IC. Leave this
pin open.
E5
CLKREQ
Digital Output
Active high once crystal frequency is stable
E6
UART RXD
Digital Input
UART RXD
PAN1026A Bluetooth Module
2 Overview
Product Specification Rev. 0.1 Page 10
No
Pin Name
GPIO No
Pin Type
Description
E7
PCMOUT
GPIO 02
Digital Output
PCM Output: not supported
E8
GND
Ground Pin
Connect to ground
E9
GND
Ground Pin
Connect to ground
F1
GND
Ground Pin
Connect to ground
F2
EEPROM_WP
Digital Input
Internal EEPROM Write Protect (active high)
F3
GND
Ground Pin
Connect to ground
F4
GND
Ground Pin
Connect to ground
F5
UART CTS
Digital Input
UART CTS
F6
SLEEPCLK
Digital Input
Input clock for 32.768 KHz
F7
UARTTXD
Digital Output
UART TX
F8
UARTRTS
Digital Output
UART RTS
F9
GND
Ground Pin
Connect to ground
F11
GND
Ground Pin
Connect to ground
F12
GND
Ground Pin
Connect to ground
2.3 UART Interface
• Full-duplex 4-wire data transfer: RX, TX, RTS, CTS
• Programmable baud rate: 2 400 bps to 4.33 Mbps
• Default baud rate: 115 200 bps
• Data format: 8N1, LSB first
• Error detection: Character timeout, Overrun error, Framing error
2.4 Bluetooth Features
• Bluetooth 4.0 with SPP & GATT
• GAP support for SPP
• GATT server and client mode supported for LE
• Class 2 TX power w/o external PA (improved link robustness)
• Excellent link budget (up to 91 dB), enabling long-range applications
• GAP peripheral support for LE
PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 0.1 Page 11
3 Detailed Description
3.1 Dimensions
All dimensions are in millimeters.
No.
Item
Dimension
Tolerance
Remark
1
Width
8.70
± 0.20
2
Length
15.60
± 0.20
3
Height
1.80
± 0.20
With case
PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 0.1 Page 12
3.2 Footprint
The outer dimensions have a tolerance of 0.3 mm.
Top View
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4
PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 0.1 Page 13
3.3 Packaging
The product is a mass production status product and will be delivered in the package described
below.
3.3.1 Tape Dimensions
3.3.2 Packing in Tape
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
100730-PAN1720.vsd
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 0.1 Page 14
3.3.3 Component Direction
3.3.4 Reel Dimension
PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 0.1 Page 15
3.3.5 Package Label
Example
(1T)
(1P)
(2P)
(9D)
(Q)
(HW/SW)
Lot code
Customer order number, if applicable
Order number
Date code
Quantity
Hardware/software version
3.3.6 Total Package
PAN1026A Bluetooth Module
3 Detailed Description
Product Specification Rev. 0.1 Page 16
3.4 Case Marking
Example
1
2
3
4
5
6
7
8
9
MIC ID
Brand name
Hardware/software version
Order number
FCC ID
Lot code
Engineering Sample marking, if applicable
Marking for Pin 1
2D barcode, for internal usage only
PAN1026A Bluetooth Module
4 Specification
Product Specification Rev. 0.1 Page 17
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1 Default Test Conditions
Temperature: 25 ± 10 °C
Humidity: 40 to 85 % RH
Supply Voltage: 3.3 V
4.2 Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
TSTOR
Storage
temperature
-40
+125
°C
VESD
ESD
robustness
All pads, according to human
body model (HBM), JEDEC
STD 22, method A114
1 000
V
According to charged device
model (CDM), JEDEC STD 22,
method C101
500
V
PRF
RF input level
+10
dBm
VDIG
Voltage on
any digital
pins
-0.3
VDD +
0.3
V
PAN1026A Bluetooth Module
4 Specification
Product Specification Rev. 0.1 Page 18
4.3 Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
TA
Ambient
operating
temperature
range
-40
+85
°C
VDD
3V3 Supply
voltage
2.7
3.3
3.6
V
4.4 Current Consumption
The current consumption depends on the user scenario and on the setup and
timing in the power modes.
Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated.
Parameter
Condition
Min.
Typ.
Max.
Units
Idle Current
After reset was pulled down.
7.8
mA
Connected
Peak Power
Sending DH5 packets. Max. output power.
62
mA
Connected
Peak Power
Sending DH3 packets. Max. output power.
61
mA
Connected
Peak Power
Sending DH1 packets. Max. output power.
55
mA
Sleep mode
activated
Sniff mode/not connected/BLE Advertising
2
mA
PAN1026A Bluetooth Module
4 Specification
Product Specification Rev. 0.1 Page 19
4.5 Bluetooth
Parameter
Condition
Min.
Typ.
Max.
Units
Operation
frequency
range
2 402
2 480
MHz
Channel
spacing
BT-Classic/BLE
1/2
MHz
Output Power
Maximum setting, measured at dual ended 50
ohm.
4
dBm
Sensitivity
-88
dBm
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
1
Spurious
emissions
Conducted measurement with a
50 Ω dual-ended load.
Complies with EN 300 328,
EN 300 440 class 2, FCC
CFR47, Part 15 and ARIB STD-
T-66.
<-30
dBm
4.6 Reliability Tests
The measurement should be done after the test device has been exposed to room temperature
and humidity for one hour.
No.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
• Freq.: 10~50 Hz; Amplitude: 1.5 mm;
20 min./cycle, 1 hrs. each of XYZ axis
• Freq.: 30~100 Hz, 6G; 20 min./cycle,
1 hrs. each of XYZ axis
2
Shock test
See above
Dropped onto hard wood from a height
of 50 cm for 3 times
3
Heat cycle test
See above
-40 °C for 30 min. and +85 °C for
30 min.; each temperature 300 cycles
4
Moisture test
See above
+60 °C, 90 % RH, 300 h
5
Low
temperature
test
See above
-40 °C, 300 h
6
High temp. test
See above
+85 °C, 300 h
PAN1026A Bluetooth Module
4 Specification
Product Specification Rev. 0.1 Page 20
4.7 Recommended Soldering Profile
• Reflow permissible cycle: 2
• Opposite side reflow is prohibited due to module weight
• More than 75 percent of the soldering area shall be coated by solder
• The soldering profiles should be adhered to in order to prevent electrical
or mechanical damage
• Soldering profile assumes lead-free soldering
PAN1026A Bluetooth Module
5 Cautions
Product Specification Rev. 0.1 Page 21
5 Cautions
Failure to follow the guidelines set forth in this document may result in
degrading of the product’s functions and damage to the product.
5.1 Design Notes
1. Follow the conditions written in this specification, especially the control signals of this
module.
2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF
directly at the module).
3. This product should not be mechanically stressed when installed.
4. Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
5. Avoid assembly and use of the target equipment in conditions where the product’s
temperature may exceed the maximum tolerance.
6. The supply voltage should not be exceedingly high or reversed. It should not carry noise
and/or spikes.
7. Keep this product away from other high frequency circuits.
8. Refer to the recommended pattern when designing a board.
5.2 Installation Notes
1. Reflow soldering is possible twice based on the conditions set forth in
4.7 Recommended Soldering Profile. Set up the temperature at the soldering portion
of this product according to this reflow profile.
2. Carefully position the products so that their heat will not burn into printed circuit boards
or affect the other components that are susceptible to heat.
3. Carefully locate these products so that their temperatures will not increase due to the
effects of heat generated by neighboring components.
4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between the cover and
these products to occur.
5. This product should not be mechanically stressed or vibrated when reflowed.
6. To repair the board by hand soldering, follow the conditions set forth in this chapter.
7. Do not wash this product.
8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage
to the unit.
PAN1026A Bluetooth Module
5 Cautions
Product Specification Rev. 0.1 Page 22
5.3 Usage Condition Notes
1. Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, check and evaluate their operation befor assembly on the final products.
2. Do not use dropped products.
3. Do not touch, damage or soil the pins.
4. Follow the recommended condition ratings about the power supply applied to this
product.
5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on
PCB.
6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
7. These products are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information, and communication
equipment.
5.4 Storage Notes
1. The module should not be stressed mechanically during storage.
2. Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected:
– Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX,
– Storage in direct sunlight,
– Storage in an environment where the temperature may be outside the range of 5 °C
to 35 °C, or where the humidity may be outside the 45 to 85 percent range,
– Storage of the products for more than one year after the date of delivery storage
period: Please check the adhesive strength of the embossed tape and soldering
after 6 months of storage.
3. Keep this product away from water, poisonous gas, and corrosive gas.
4. This product should not be stressed or shocked when transported.
5. Follow the specification when stacking packed crates (max. 10).
5.5 Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a
short circuit occurs, provide the following failsafe functions as a minimum:
PAN1026A Bluetooth Module
5 Cautions
Product Specification Rev. 0.1 Page 23
1. Ensure the safety of the whole system by installing a protection circuit and a protection
device.
2. Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
5.6 Other Cautions
1. Do not use the products for other purposes than those listed.
2. Be sure to provide an appropriate fail-safe function on your product to prevent any
additional damage that may be caused by the abnormal function or the failure of the
product.
3. This product has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
4. These products are not intended for uses other than under the special conditions shown
below. Before using these products under such special conditions, carefully check their
performance and reliability under the said special conditions to determine whether or not
they can be used in such a manner:
– In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash.
– In direct sunlight, outdoors, or in a dusty environment.
– In an environment where condensation occurs.
– In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOX).
5. If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
6. When you have any question or uncertainty, contact Panasonic.
5.7 Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.
PAN1026A Bluetooth Module
6 Regulatory and Certification Information
Product Specification Rev. 0.1 Page 24
6 Regulatory and Certification Information
6.1 RoHS and REACH Declaration
The latest declaration of environmental compatibility (Restriction of Hazardous Substances,
RoHS and Registration, Evaluation, Authorisation, and Restriction of Chemicals, REACH) for
supplied products can be found on the Panasonic website in the “Downloads” section of the
respective product 7.2.2 Product Information.
6.2 Further Regulatory Information
To be discussed.
PAN1026A Bluetooth Module
7 Appendix
Product Specification Rev. 0.1 Page 25
7 Appendix
7.1 Ordering Information
Variants and Versions
Order Number
Brand Name
Description
MOQ1
ENW89837A5KF2
PAN1026A
Bluetooth BT4.2 Basic Data Rate and Low Energy module
1 500
1
Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces,
fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution
channels.
2
Samples are available on customer demand.
PAN1026A Bluetooth Module
7 Appendix
Product Specification Rev. 0.1 Page 26
7.2 Contact Details
7.2.1 Contact Us
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to
find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
7.2.2 Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
http://www.panasonic.com/rfmodules