EB52W4C30N-32.768M TR - Ecliptek Corporation

EB52W4C30N-32.768M TR

EB52W4 C 30 N -32.768M TR

Series

3.3Vdc LVCMOS PCB SMD TCXO

Operating Temperature Range

-20°C to +70°C

Frequency Stability

±3.0ppm Maximum

Packaging Options

Tape & Reel

Nominal Frequency

32.768MHz

Control Voltage

None (No Connect on Pin 1)

ELECTRICAL SPECIFICATIONS

Nominal Frequency 32.768MHz

Frequency Stability ±3.0ppm Maximum (Inclusive of Operating Temperature Range)

Frequency Stability vs. Input Voltage ±0.3ppm Maximum (±5%)

Aging at 25°C ±1ppm/Year Maximum

Frequency Stability vs. Load ±0.2ppm Maximum (±2pF)

Operating Temperature Range -20°C to +70°C

Supply Voltage 3.3Vdc ±5%

Input Current 35mA Maximum

Output Voltage Logic High (Voh) 90% of Vdd Minimum

Output Voltage Logic Low (Vol) 10% of Vdd Maximum

Rise/Fall Time 10nSec Maximum (Measured at 20% to 80% of waveform)

Duty Cycle 50% ±10% (Measured at 50% of waveform)

Load Drive Capability 15pF Maximum

Output Logic Type CMOS

Control Voltage None (No Connect on Pin 1)

Internal Trim ±3ppm Minimum (Top of Can)

Modulation Bandwidth 10kHz Minimum (Measured at -3dB with a Control Voltage of 1.65Vdc)

Input Impedance 10kOhms Typical

Phase Noise -70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, -

145dBc at 100kHz Offset (Typical Values Fo=19.200MHz at 25°C at Nominal Vdd and Vc)

Storage Temperature Range -40°C to +85°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)

Gross Leak Test MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)

Lead Integrity MIL-STD-883, Method 2004

Mechanical Shock MIL-STD-202, Method 213 Condition C

Resistance to Soldering Heat MIL-STD-202, Method 210

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010

Vibration MIL-STD-883, Method 2007 Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 1 of 5

EB52W4C30N-32.768M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

11.7

±0.5

1.5

±0.3 DIA 3.5 ±0.5

18.3 ±0.5

21.3 ±0.5

1.0

±0.1

4.0 ±0.3 1.7

±0.4

7.62

±0.30

4.5

±0.3

4.0 ±0.3

PIN CONNECTION

1 No Connect

2 Ground

3 Output

4 Supply Voltage

LINE MARKING

1ECLIPTEK

232.768M

M=MHz

3XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of the Year

ZZ=Week of the Year

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X4)

All Dimensions in Millimeters

14.8

5.9

1.6 (X4)

3.5 (X4)

OUTPUT WAVEFORM

VOH

VOL

80% of Waveform

50% of Waveform

20% of Waveform

Fall

Time

Rise

Time TW

Duty Cycle (%) = TW/T x 100

CLOCK OUTPUT

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 2 of 5

EB52W4C30N-32.768M TR

Supply

Voltage

(VDD)

Test Circuit for CMOS Output

Output

No Connect

or Tri-State

Ground

+ +

Power

Supply 0.01µF

(Note 1) 0.1µF

(Note 1) CL

(Note 3)

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and VDD pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.

Voltage

Meter

Current

Meter

Oscilloscope Frequency

Counter

Probe

(Note 2)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 3 of 5

DIA 50 MIN

DIA 20.2 MIN

DIA 13.0 ±0.2

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 40 MIN

Access Hole at

Slot Location

1.5 MIN

Tape & Reel Dimensions

*Compliant to EIA 481A

EB52W4C30N-32.768M TR

32.0 ±0.30

14.20 ±0.15

16.05 ±0.15

4.00 ±0.20

2.00 ±0.10

16.00 ±0.10 12.50 ±0.10

DIA 1.60 ±0.10

22.20

±0.10

0.40 ±0.05

5.00 ±0.10

30.4 MAX

360 MAX

1,000 pieces per reel

32.4 +2.0/-0/0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 4 of 5

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EB52W4C30N-32.768M TR

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 5 of 5