1. Product profile
1.1 General description
Two planar PIN diodes in series configuration in a SOT323 small SMD plastic package.
1.2 Features
1.3 Applications
2. Pinning information
3. Ordering information
BAP70-04W
Silicon PIN diode
Rev. 01 — 5 March 2004 Product data
■High voltage current control RF resistor
for RF attenuators
■Low diode capacitance
■Low series inductance.
■RF attenuators and switches.
Table 1: Discrete pinning
Pin Description Simplified outline Symbol
1 anode
2 cathode
3 common connection
3
12
sot323_so
sym015
1
2
3
Table 2: Ordering information
Type number Package
Name Description Version
BAP70-04W - plastic surface mounted package; 3 leads SOT323
9397 750 12557 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 5 March 2004 2 of 7
Philips Semiconductors BAP70-04W
Silicon PIN diode
4. Marking
5. Limiting values
6. Thermal characteristics
7. Characteristics
Table 3: Marking
Type number Marking code
BAP70-04W 1Np
Table 4: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRcontinuous reverse voltage - 50 V
IFcontinuous forward current - 100 mA
Ptot total power dissipation Ts = 90 °C - 260 mW
Tstg storage temperature −65 +150 °C
Tjjunction temperature −65 +150 °C
Table 5: Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-s) thermal resistance from junction
to soldering point 230 K/W
Table 6: Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage IF= 50 mA 0.95 1.1 V
IRreverse current VR=50V - 20 nA
Cddiode capacitance see Figure 1; f = 1 MHz;
VR= 0 V 600 - fF
VR= 1 V 430 - fF
VR= 20 V 250 300 fF
9397 750 12557 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 5 March 2004 3 of 7
Philips Semiconductors BAP70-04W
Silicon PIN diode
rDdiode forward resistance see Figure 2; f = 100 MHz;
IF= 0.5 mA 77 100 Ω
IF= 1 mA 40 50 Ω
IF= 10 mA 5.4 7 Ω
IF= 100 mA 1.4 1.9 Ω
τLcharge carrier life time when switched from IF= 10 mA to
IR= 6 mA; RL= 100 Ω; measured at
IR=3mA
1.25 - µs
LSseries inductance IF= 100 mA; f = 100 MHz 1.4 - nH
Table 6: Characteristics
…continued
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
f = 1 MHz; Tj=25°C. f = 100 MHz; Tj=25°C.
Fig 1. Diode capacitance as a function of reverse
voltage; typical values. Fig 2. Forward resistance as a function of forward
current; typical values.
VR (V)
02015510
001aaa461
400
300
500
600
Cd
(fF)
200
103
102
10
1
mce007
10−1110
rD
(Ω)
IF (mA) 102
9397 750 12557 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 5 March 2004 4 of 7
Philips Semiconductors BAP70-04W
Silicon PIN diode
8. Package outline
Fig 3. Package outline.
UNIT A1
max bpcD Ee1HELpQwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.1
1.1
0.8 0.4
0.3 0.25
0.10 2.2
1.8 1.35
1.15 0.65
e
1.3 2.2
2.0 0.23
0.13 0.20.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT323 SC-70
wM
bp
D
e1
e
A
B
A1
Lp
Q
detail X
c
HE
E
vMA
AB
y
0 1 2 mm
scale
A
X
12
3
Plastic surface mounted package; 3 leads SOT323
97-02-28
9397 750 12557 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 5 March 2004 5 of 7
Philips Semiconductors BAP70-04W
Silicon PIN diode
9. Revision history
Table 7: Revision history
Document ID Release date Data sheet status Change notice Order number Supersedes
BAP70-04W_1 20040305 Product data - 9397 750 12557 -
Philips Semiconductors BAP70-04W
Silicon PIN diode
9397 750 12557 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 5 March 2004 6 of 7
10. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
11. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
12. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
13. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights. Date of release: 5 March 2004
Document order number: 9397 750 12557
Published in The Netherlands
Philips Semiconductors BAP70-04W
Silicon PIN diode
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 2
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . . 6
11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
13 Contact information . . . . . . . . . . . . . . . . . . . . . 6
