TRPGP40TGC SCBS887 - JANUARY 2012 www.ti.com 12-mm LOW-FREQUENCY GLASS-ENCAPSULATED TRANSPONDER, CCT Check for Samples: TRPGP40TGC FEATURES APPLICATIONS * * 1 * * * Best-in-Class Performance Through Patented HDX Technology Patented Transponder Tuning Provides Stable and High Read Performance 80-Bit Customer-Configurable Transponder (CCT) Type Insensitive to Almost All Nonmetallic Materials Animal ID DESCRIPTION Texas Instruments 12-mm low-frequency (LF) glass transponders provide superior performance and operate at a resonance frequency of 134.2 kHz. The products are compliant to ISO/IEC 11784/11785 global open standards. Texas Instruments LF glass transponders are manufactured with TI's patented tuning process to provide consistent read performance. Prior to delivery, the transponders undergo complete functional and parametric testing, to provide the high quality customers have come to expect from TI. ORDERING INFORMATION PACKAGE (1) TA -25C to 85C (1) Glass encapsulated Container/Bulk ORDERABLE PART NUMBER QUANTITY TRPGP40TGC 2000 For the most current package and ordering information, see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) TRPGP40TGC TA Operating temperature -25C to 70C TSTG Storage temperature -40C to 100C 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2012, Texas Instruments Incorporated TRPGP40TGC SCBS887 - JANUARY 2012 www.ti.com PARAMETER TRPGP40TGC Functionality Not programmed Memory (bits) 80 Memory (pages) 1 Resonance frequency 134.6 kHz Modulation FSK (frequency shift keying) 134.2 kHz / 124.2 kHz Transmission principle HDX (half duplex) Power source Powered from the reader signal (battery-less) Typical reading range 60 cm (1) Typical reading time 70 ms Case material Glass Protection glass Hermetically sealed EMC Programmed code is not affected by natural electromagnetic interference or x-rays Signal penetration Transponder can be read through almost all nonmetallic material Mechanical shock IEC 60068-2-32 free-fall drop test, 20 times from 1.5-m height Dimensions O 2.12 0.05 mm x 12.0 0.5 mm Weight 0.10 g (1) 2 Depends on RF regulation in country of use, the reader antenna configuration used, and the environmental conditions. Submit Documentation Feedback Copyright (c) 2012, Texas Instruments Incorporated Product Folder Link(s): TRPGP40TGC PACKAGE OPTION ADDENDUM www.ti.com 20-Feb-2012 PACKAGING INFORMATION Orderable Device TRPGP40TGC Status (1) ACTIVE Package Type Package Drawing RFIDT TGC Pins Package Qty 0 2000 Eco Plan TBD (2) Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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