Audio ICs Low-current audio headphone driver BA3575FS The BA3575FS is a headphone driver with an AVC circuit that keeps the output below a fixed level. It features low current consumption, and low output noise, and is ideal for use in portable digital audio equipment. Applications Portable CD players Features 1) Low current consumption (when VCC = 2.4 V, the quiescent current is 4.9mA). 2) Suitable for use in digital audio equipment (voltage gain: GV = 11.8dB, output noise voltage: VNO = -102dBm typ.). 3) ATT circuit (gain switch). 4) AVC (Auto Volume Control) circuit, for output limiting. 5) Internal standby switch. 6) Internal mute switch. 7) Internal ripple filter. 8) No output coupling capacitor required. 9) Internal beep circuit. 10) SSOP-A20 package. Absolute maximum ratings (Ta = 25C) Recommended operating conditions (Ta = 25C) 871 Audio ICs Block diagram 872 BA3575FS Audio ICs BA3575FS Pin descriptions 873 Audio ICs 874 BA3575FS Audio ICs BA3575FS 875 Audio ICs 876 BA3575FS Audio ICs BA3575FS Electrical characteristics(unless otherwis noted, Ta = 25C, VCC = 2.4V, RL = 16, f = 1kHz, DIN AUDIO, PWSW = ON, MUTE = OFF, ATT = OFF, and AVC = OFF) 877 Audio ICs Measurement circuit 878 BA3575FS Audio ICs BA3575FS Measurement circuit switch table (Fig.1) 879 Audio ICs Application example 880 BA3575FS Audio ICs BA3575FS Application notes (1) "Pop" sound By operating the BA3575FS according to the timing chart shown in Fig.3, it is possible to suppress generation of "pop" noise in the headphone output. (2) Application circuits Provided the recommended circuit constants are used, the application circuits should function correctly. However, we recommend that you confirm the characteristics of the circuits in actual use. If you change the circuit constants, check both the static and transient characteristics of the circuit, and allow sufficient margin to accommodate variations between both ICs and external components. In particular, the capacitors connected to the OUT 1, OUT 2, and VREF pins must have low impedance at high frequency, and have sufficient margin in their temperature characteristics. Also, use an electrolytic or tantalum capacitor for the capacitor connected to the BIASOUT terminal. (3) The PCB pattern for the external components should be designed carefully to prevent oscillation and degradation of the circuit characteristics. Keep the wiring tracks as short as possible, and ensure that there is no impedance between the common connections. The ripple filter pins (1 and 2) and the bias amplifier pins (3 and 4) cannot be used for external power supplies or reference voltages. 881 Audio ICs (4) Recommended operating conditions The curves in Fig.4 below show the maximum allowable power output (PO (Max.) / ch) plotted against the supply voltage (VCC) for different values of ambient temperature (Ta). When VCC 3.6 V, operate the IC in the region below the dotted line, and do not exceed it. If the maximum allowable power output for each channel (PO (Max.) / ch) is exceeded, the internal power consumption will exceed the power dissipation capacity of the package, and destroy the IC. Electrical characteristics curves 882 BA3575FS Audio ICs BA3575FS External dimensions (Units: mm) 883 Product Designation Page 1 of 2 ROHM-logo Product Designation l l l When ordering, specify the part number. Check each code against the tables shown below. Fill in from the left, leaving any extra boxes empty on the right. Product Designation Ordering information Packing and forming information only required for SOP, and QFP parts that are required in tape and reel containers. For example, to order part BA4558F on paper tape type E2, order number is BA4558F-E2, when required in tube container, order number is BA4558F. Quick reference of packaging specifications Package Container type DIP/SDIP Tube container SIP/HSIP/ZIP/SZIP/RSIP-A3 Tube container SOP/SSOP/HSOP/WSOP-10/WSOPL10 Packaging specification code Tube container Embossed E1, E2 tape file://F:\export\projects\bitting1\imaging\BITTING\cpl\20010105\01042001\ROHM...\7form.htm 1/5/01 Product Designation SSOP-A54 Page 2 of 2 Embossed E2 tape Tray Tray (dry QFP/SQFP/VQFP/UQFP/TQFP/PBGA pack) VP Embossed E1, E2 tape Bulk TO220FP Tube container SMP5 Embossed TL, TR tape TO252 Embossed E1, E2 tape RSLP8 Embossed E2(Sprocket 1pin, tape Horizontal) RSIP13 E2(Sprocket 1pin, Embossed Horizontal), E4 tape (Sprocket 1pin, Vertical) Note: SOP type can be delivered in tube, paper tape, or embossed tape. BGA/CSP package | SIP/ZIP package QFP package | Photo package SOP package | Product Designation DIP package | Packaging Specification [LSI Package Assemblies] [HOME | Selection Guide] file://F:\export\projects\bitting1\imaging\BITTING\cpl\20010105\01042001\ROHM...\7form.htm 1/5/01