The PA series fixed, chip inductor provides a cubed shape which is easily handied by automatic equipment for assembly into thick or thin film circuitry. Other unique features are also offered by this series. An edge plating is provided for forming a solder fillet. The special metalization on the contact area prevents leaching of the gold plating from the substrate. The ceramic substrate is interlocked into the epoxy molded case so that it cannot detach from the case during reflow soldering. The internal connections are welded so that they cannot be loosened by the soldering process. The overall design and materials are carefully selected to withstand several attachments and removals using PA SERIES 8 reflow techniques without damage or degradation in per formance. ELECTRICAL CHARACTERISTICS Piconics Mil L Q Test | SRF | DCR Ide Part Dash uH Min Freq Min Max Max Number No +/-10% MHz | MHz | Ohms ma PA100K-8I 1 0.010 36 200 1200 .03 750 PA120K-8I 2 0.012 30 200 1200 .03 750 PA150K-8! 3 0.015 30 200 1200 .05 750 PA180K-8I 4 0.018 30 200 1200 .06 750 PA220K-8I 5 0.022 30 200 1000 .07 750 PA270K-8I 6 0.027 30 200 1000 .08 750 PA330K-8! 7 0.033 30 200 1000 .08 640 PA390K-8I 8 0.039 30 200 1000 .09 600 PA470K-8l 9 0.047 30 100 1000 10 550 PA560K-8I 10 0.056 30 100 1000 13 520 PA680K-8I 1 0.068 30 100 800 14 480 PA820K-8l 12 0.082 30 100 800 15 470 PA101K-8I 13 0.10 30 25. 750 16 460 PA121K-8l 14 0.12 30 25. 700 7 455 PA151K-8l 15 0.15 30 25. 650 19 450 PA181K-8l 16 0.18 30 25. 600 20 430 PA221K-8l 17 0.22 30 25. 570 30 350 PA271K-8I 18 0.27 30 25. 500 235 310 PA331K-8l 19 0.33 30 25. 400 72 280 PA391K-8I 20 0.39 30 25. 380 -80 250 PA471K-8I 21 0.47 30 25. 350 1.26 230 PA561K-81 22 0.56 30 25. 325 1.30 220 PA681K-8i 23 0.68 30 25. 300 1.40 210 PA821K-8I 24 0.82 30 25. 250 1.50 200 PA102K-6l 25 1.0 25 7.9 220 1.60 200 PA122K-6l 26 1.2 25 7.9 175 1.70 200 PA152K-6l 27 1.5 25 7.9 135 2.50 190 PA182K-6l 28 1.8 25 7.9 120 3.00 185 PA222K-6l 29 2.2 25 7.9 75 3.30 180 PA272K-6l 30 2.7 25 7.9 85 3.65 176 PA332K-6I 31 3.3 25 7.9 70 4.00 170 PA392K-6l 32 3.9 25 7.9 60 4.2 165 PA472K-6l 33 4.7 25 7.9 50 4.2 165 PA562K-6l 34 5.6 25 7.9 40 4.2 165 PA682K-6l 35 6.8 25 7.9 30 4.2 165 PA822K-6l 36 8.2 25 7.9 22 4.3 120 PA103K-3F 37 10.0 20 2.5 20 4.7 105 PA123K-3F 38 12.0 20 2.5 15 5.0 91 PA153K-3F 39 15.0 20 2.5 13 5.0 87 PA183K-3F 40 18.0 20 2.5 12 5.0 81 PA223K-3F 44 22.0 20 2.5 10 5.0 77 PA273K-3F 42 27 20 2.5 9.0 5.0 73 PA333K-3F 43 33 20 2.5 9.0 5.7 69 PA393K-3F 44 39 20 2.5 6.5 6.5 65 PA473K-3F 45 47 20 2.5 6.2 6.0 63 PA563K-3F 46 56 20 2.5 6.0 6.3 60 PA683K-3F 47 68 20 2.5 5.8 6.7 57 PA823K-3F 48 82 20 2.5 5.2 7.5 55 PA104K-3F 49 100 20 79 4.0 13. 50 FEATURES * High Packing Density Reflow Solderable * QPL listed ABSOLUTE MAXIMUM RATINGS * Operating temperature rangs: - 55C to + 125C. * Storage temperature range: - 55C to + 125C. * Temperature rise (at 90C): 35C * Maximum operating temperature: 125C. + Dielectric withstanding voltage: Method 301 of MIL-STD-202, Test voltage 700 valts rms. * Barometric pressure: Method 105, test condition C of MIL-STD-202, (70,000 feet), test voltage 200 volts rms. PHYSICAL CHARACTERISTICS * Terminations: Alumina substrate base; gold plated over nickel; welded internal connection. * Case: Dially! Phthalate * Weight: 0.5 gram maximum. ( > L 100 1 al VILLE, _' 018" 100" MIN 7 | .100 b | as Wf, DESIGNATES [| 7A, METALIZATION TOLERANCE +/- 0.005" UNLESS NOTED MQ Q QQ 20 PICONICS, INC., TYNGSBORO, MA 01879 TEL (508) 649-7501 FAX (508) 649-9643