© 2009 IXYS CORPORATION,All Rights Reserved
Symbol Test Conditions Maximum Ratings
VDSS TJ= 25°C to 150°C 500 V
VDGR TJ= 25°C to 150°C, RGS = 1MΩ500 V
VGSS Continuous ± 20 V
VGSM Transient ± 30 V
ID25 TC= 25°C44A
IDM TC= 25°C, Pulse Width Limited by TJM 184 A
IAR TC= 25°C44A
EAR TC= 25°C60mJ
EAS TC= 25°C 2.5 J
dV/dt IS IDM, VDD VDSS, TJ 150°C 10 V/ns
PDTC= 25°C 500 W
TJ- 55 ... +150 °C
TJM 150 °C
Tstg - 55 ... +150 °C
TL1.6mm (0.062 in.) from Case for 10s 300 °C
TSOLD Plastic Body for 10s 260 °C
MdMounting Torque (TO-264) 1.13/10 Nm/lb.in.
FCMounting Force (TO-247) 20..120/4.5..27 Nm/lb.
Weight TO-264 10 g
TO-247 6 g
Single MOSFET Die
N-Channel Enhancement Mode
Avalanche Rated, Low Qg, Low Intrinsic Rg
High dV/dt, Low trr
Features
zRF Capable MOSFETs
zDouble Metal Process for Low Gate
Resistance
zAvalanche Rated
zLow Package Inductance
zFast Intrinsic Rectifier
Advantages
zSpace Savings
zHigh Power Density
Applications
zDC-DC Converters
zSwitch-Mode and Resonant-Mode
Power Supplies, > 500kHz Switching
zDC Choppers
z13.5 MHz Industrial Applications
zPulse Generation
zLaser Drivers
zRF Amplifiers
IXFK44N50F
IXFX44N50F
VDSS = 500V
ID25 = 44A
RDS(on)
120mΩΩ
ΩΩ
Ω
trr
250ns
DS98731C(10/09)
HiPerRFTM
Power MOSFETs
F-Class: MegaHertz Switching
Symbol Test Conditions Characteristic Values
(TJ = 25°C Unless Otherwise Specified) Min. Typ. Max.
BVDSS VGS = 0V, ID = 250μA 500 V
VGS(th) VDS = VGS, ID = 4mA 3.0 5.5 V
IGSS VGS = ± 20V, VDS = 0V ± 100 nA
IDSS VDS = VDSS, VGS = 0V 100 μA
TJ = 125°C 2 mA
RDS(on) VGS = 10V, ID = 0.5 • ID25, Note 1 120 mΩ
G = Gate D = Drain
S = Source Tab = Drain
PLUS247 (IXFX)
TO-264 (IXFK)
Tab
S
G
D
Tab
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IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXFK44N50F
IXFX44N50F
Symbol Test Conditions Characteristic Values
(TJ = 25°C Unless Otherwise Specified) Min. Typ. Max.
gfs VDS = 10V, ID = 0.5 • ID25, Note 1 22 32 S
Ciss 5500 pF
Coss VGS = 0V, VDS = 25V, f = 1MHz 990 pF
Crss 330 pF
td(on) 23 ns
tr 18 ns
td(off) 53 ns
tf 8 ns
Qg(on) 156 nC
Qgs VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 37 nC
Qgd 90 nC
RthJC 0.26 °C/W
RthCS 0.15 °C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(TJ = 25°C Unless Otherwise Specified) Min. Typ. Max.
ISVGS = 0V 44 A
ISM Repetitive, Pulse Width Limited by TJM 164 A
VSD IF = IS, VGS = 0V, Note 1 1.5 V
trr 250 ns
QRM 1.1 μC
IRM 12.0 A
Note 1. Pulse test, t 300μs; duty cycle, d 2%.
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
IF = 22A, -di/dt = 100A/μs
VR = 100V, VGS = 0V
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 1Ω (External)
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
4 - Drain (Collector)
PLUS 247TM (IXFX) Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.83 5.21 .190 .205
A12.29 2.54 .090 .100
A21.91 2.16 .075 .085
b 1.14 1.40 .045 .055
b11.91 2.13 .075 .084
b22.92 3.12 .115 .123
C 0.61 0.80 .024 .031
D 20.80 21.34 .819 .840
E 15.75 16.13 .620 .635
e 5.45 BSC .215 BSC
L 19.81 20.32 .780 .800
L1 3.81 4.32 .150 .170
Q 5.59 6.20 .220 0.244
R 4.32 4.83 .170 .190
TO-264 AA Outline
Millimeter Inches
Min. Max. Min. Max.
A 4.82 5.13 .190 .202
A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072
Dim.
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© 2009 IXYS CORPORATION,All Rights Reserved
IXFK44N50F
IXFX44N50F
Fi g . 1. Ou tp ut C har acter isti cs @ TJ = 25ºC
0
5
10
15
20
25
30
35
40
45
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
V
DS
- Volts
I
D
- Amperes
V
GS
= 10V
9V
7
V
8
V
6
V
Fi g . 2. Exte n d ed Ou tpu t Ch ar acter isti cs @ TJ = 25ºC
0
20
40
60
80
100
120
140
0 5 10 15 20 25 30
V
DS
- V o lt s
I
D
- Amperes
V
GS
= 10V
7
V
6
V
9
V
8
V
Fi g . 3. Ou tpu t C har acteri sti cs @ TJ = 125º C
0
5
10
15
20
25
30
35
40
45
0123456789101112
V
DS
- Volts
I
D
- Amperes
V
GS
= 10V
9V
8V
5
V
7V
6V
Fig. 4. RDS(on) Normalized to ID = 22A Val u e vs.
Junction Temperature
0.2
0.6
1.0
1.4
1.8
2.2
2.6
3.0
-50 -25 0 25 50 75 100 125 150
T
J
- Degrees Centigrade
R
DS(on)
- Normalized
V
GS
= 10V
I
D
= 44A
I
D
= 22A
Fig. 5. RDS(on) Normalized to ID = 22A Valu e vs.
Drain Current
0.6
1.0
1.4
1.8
2.2
2.6
3.0
0 102030405060708090100110120130
I
D
- Amp e res
R
DS(on)
- Normali zed
V
GS
= 10V T
J
= 125ºC
T
J
= 25ºC
Fi g . 6. Maximum D r ai n C u r r ent vs.
Case Temper atu re
0
5
10
15
20
25
30
35
40
45
50
-50-250 255075100125150
T
C
- Degrees Centigrade
I
D
- Amperes
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IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXFK44N50F
IXFX44N50F
Fi g . 7. I n pu t Admi ttance
0
10
20
30
40
50
60
70
80
90
100
4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
V
GS
- V olt s
I
D
- Amperes
T
J
= 125ºC
2C
- 4C
Fig . 8. Tr ansco nd u ct an ce
0
10
20
30
40
50
60
70
0 102030405060708090100
I
D
- Amp eres
g
f s
- Siemens
T
J
= - 40ºC
125ºC
25ºC
Fig. 9. Forward Voltage Drop of Intrinsic Diode
0
20
40
60
80
100
120
140
0.20.30.40.50.60.70.80.91.01.11.2
V
SD
- V olt s
I
S
- Amperes
T
J
= 125ºC
T
J
= 2C
Fig . 10. Ga te C h ar g e
0
2
4
6
8
10
12
14
16
0 20 40 60 80 100 120 140 160 180 200 220
Q
G
- NanoCoulombs
V
GS
- Vol ts
V
DS
= 250V
I
D
= 22A
I
G
= 10mA
Fig. 11. Capacitance
100
1,000
10,000
0 5 10 15 20 25 30 35 40
V
DS
- V olt s
Capacitance - PicoFarads
f
= 1 MHz
Ciss
Crss
Coss
Fig. 12. Forward-Bias Safe Operating Area
0.1
1.0
10.0
100.0
1,000.0
10 100 1,000
V
DS
- Volt s
I
D
- Amperes
T
J
= 150ºC
T
C
= 25ºC
Single Pulse
100µs
10ms
1ms
R
DS(on)
Limit
100ms
DC
25µs
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© 2009 IXYS CORPORATION,All Rights Reserved
IXFK44N50F
IXFX44N50F
IXYS REF: F_44N50F(8F)10-09-09
Fi g. 13. Maximu m T r ansi en t Ther mal Impedance
0.001
0.010
0.100
1.000
0.00001 0.0001 0.001 0.01 0.1 1 10
Pulse Width - Second s
Z
(th)JC
- ºC / W
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