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COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT23S09E
3.3V ZERO DELAY CLOCK BUFFER
AUGUST 2009
2006 Integrated Device Technology, Inc. DSC - 6399/11c
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
FEATURES:
• Phase-Lock Loop Clock Distribution
• 10MHz to 200MHz operating frequency
• Distributes one clock input to one bank of five and one bank of
four outputs
• Separate output enable for each output bank
• Output Skew < 250ps
• Low jitter <200 ps cycle-to-cycle
• IDT23S09E-1 for Standard Drive
• IDT23S09E-1H for High Drive
• No external RC network required
• Operates at 3.3V VDD
• Spread spectrum compatible
• Available in SOIC and TSSOP packages
IDT23S09E
3.3V ZERO DELAY
CLOCK BUFFER, SPREAD
SPECTRUM COMPATIBLE
DESCRIPTION:
The IDT23S09E is a high-speed phase-lock loop (PLL) clock buffer,
designed to address high-speed clock distribution applications. The zero
delay is achieved by aligning the phase between the incoming clock and
the output clock, operable within the range of 10 to 200MHz.
The IDT23S09E is a 16-pin version of the IDT23S05E. The IDT23S09E
accepts one reference input, and drives two banks of four low skew clocks.
The -1H version of this device operates up to 200MHz frequency and has
higher drive than the -1 device. All parts have on-chip PLLs which lock
to an input clock on the REF pin. The PLL feedback is on-chip and is
obtained from the CLKOUT pad. In the absence of an input clock, the
IDT23S09E enters power down. In this mode, the device will draw less
than 12µA for Commercial Temperature range and less than 25µA for
Industrial temperature range, and the outputs are tri-stated.
The IDT23S09E is characterized for both Industrial and Commercial
operation.
PLL
S1
CLKA1
CLKA2
CLKA3
CLKA4
CLKB1
CLKB2
CLKB3
CLKB4
Control
Logic
1
REF
S2
16 CLKOUT
8
9
2
3
14
15
6
7
10
11
FUNCTIONAL BLOCK DIAGRAM
NOTE: EOL for non-green parts to occur on 5/13/10 per
PDN U-09-01
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COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT23S09E
3.3V ZERO DELAY CLOCK BUFFER
PIN CONFIGURATION
SOIC/ TSSOP
TOP VIEW
Symbol Rating Max. Unit
VDD Supply Voltage Range –0.5 to +4.6 V
VI (2) Input Voltage Range (REF) –0.5 to +5.5 V
VIInput Voltage Range –0.5 to V
(except REF) VDD+0.5
IIK (VI < 0) Input Clamp Current –50 mA
IO (VO = 0 to VDD) Continuous Output Current ±50 mA
VDD or G N D Continuous Current ±100 mA
TA = 55°C Maximum Power Dissipation 0 .7 W
(in still air)(3)
TSTG Storage Temperature Range –65 to +150 °C
Operating Commercial Temperature 0 to +70 °C
Temperature Range
Operating Industrial Temperature -40 to +85 °C
Temperature Range
NOTES:
1 . Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2 . The input and output negative-voltage ratings may be exceeded if the input and output
clamp-current ratings are observed.
3. The maximum package power dissipation is calculated using a junction temperature
of 150°C and a board trace length of 750 mils.
NOTES:
1. Weak pull down.
2. Weak pull down on all outputs.
3. Weak pull ups on these inputs.
PIN DESCRIPTION
ABSOLUTE MAXIMUM RATINGS(1)
Pin Name Pin Number Type Functional Description
REF(1) 1 IN Input reference clock, 5 Volt tolerant input
CLKA1(2) 2 O u t Output clock for bank A
CLKA2(2) 3 O u t Output clock for bank A
VDD 4, 13 PWR 3.3V Supply
GND 5, 12 GND Ground
CLKB1(2) 6 O u t Output clock for bank B
CLKB2(2) 7 O u t Output clock for bank B
S2(3) 8 IN Select input Bit 2
S1(3) 9 IN Select input Bit 1
CLKB3(2) 10 O u t Output clock for bank B
CLKB4(2) 11 O u t Output clock for bank B
CLKA3(2) 14 O u t Output clock for bank A
CLKA4(2) 15 O u t Output clock for bank A
CLKOUT(2) 1 6 Out Output clock, internal feedback on this pin
APPLICATIONS:
•SDRAM
•Telecom
•Datacom
•PC Motherboards/Workstations
•Critical Path Delay Designs
REF
CLKA1
S2
2
3
4
5
6
7
89
10
11
12
13
14
15
161
CLKA2
GND
CLKB1
CLKOUT
CLKA4
GND
S1
VDD
VDD
CLKB2 CLKB3
CLKB4
CLKA3
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COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT23S09E
3.3V ZERO DELAY CLOCK BUFFER
DC ELECTRICAL CHARACTERISTICS - COMMERCIAL
Symbol Parameter Conditions Min. Max. Unit
VIL Input LOW Voltage Level — 0.8 V
VIH Input HIGH Voltage Level 2 — V
IIL Input LOW Current VIN = 0V — 50 µA
IIH Input HIGH Current VIN = VDD — 100 µA
VOL Output LOW Voltage Standard Drive IOL = 8mA — 0.4 V
High Drive IOL = 12mA (-1H)
VOH Output HIGH Voltage Standard Drive IOH = -8mA 2.4 — V
High Drive IOH = -12mA (-1H)
IDD_PD Power Down Current REF = 0MHz (S2 = S1 = H) — 12 µA
IDD Supply Current Unloaded Outputs at 66.66MHz, SEL inputs at VDD or GND — 3 2 mA
SWITCHING CHARACTERISTICS (23S09E-1) - COMMERCIAL(1,2)
Symbol Parameter Conditions Min. Typ. Max. Unit
t1Output Frequency 10pF Load 10 — 200 MHz
30pF Load 10 — 100
Duty Cycle = t2 ÷ t1Measured at 1.4V, FOUT = 66.66MHz 40 50 60 %
t3Rise Time Measured between 0.8V and 2V — — 2 .5 ns
t4Fall Time Measured between 0.8V and 2V — — 2 .5 ns
t5Output to Output Skew All outputs equally loaded — — 250 ps
t6A Delay, REF Rising Edge to CLKOUT Rising Edge(2) Measured at VDD/2 — 0 ±350 ps
t6B Delay, REF Rising Edge to CLKOUT Rising Edge(2) Measured at VDD/2 in PLL bypass mode (IDT23S09E only) 1 5 8. 7 n s
t7Device-to-Device Skew Measured at VDD/2 on the CLKOUT pins of devices — 0 7 0 0 p s
tJCycle-to-Cycle Jitter Measured at 66.66MHz, loaded outputs — — 200 ps
tLOCK PLL Lock Time Stable power supply, valid clock presented on REF pin — — 1 ms
NOTES:
1. REF Input has a threshold voltage of VDD/2.
2. All parameters specified with loaded outputs.
Symbol Parameter Min. Max. Unit
VDD Supply Voltage 3 3.6 V
TAOperating Temperature (Ambient Temperature) 0 70 °C
CLLoad Capacitance < 100MHz — 3 0 pF
Load Capacitance 100MHz - 200MHz — 1 0
CIN Input Capacitance — 7 pF
OPERATING CONDITIONS - COMMERCIAL
FUNCTION TABLE(1)
S2 S1 CLKA CLKB CLKOUT(2) Output Source PLL Shut Down
L L Tri-State Tri-State Driven PLL N
L H Driven Tri-State Driven PLL N
H L Driven Driven Driven REF Y
H H Driven Driven Driven PLL N
NOTES:
1 . H = HIGH Voltage Level.
L = LOW Voltage Level
2. This output is driven and has an internal feedback for the PLL. The load on this ouput can be adjusted to change the skew between the REF and the output.
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COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT23S09E
3.3V ZERO DELAY CLOCK BUFFER
SWITCHING CHARACTERISTICS (23S09E-1H) - COMMERCIAL(1,2)
Symbol Parameter Conditions Min. Typ. Max. Unit
t1Output Frequency 10pF Load 10 — 200 MHz
30pF Load 10 — 100
Duty Cycle = t2 ÷ t1Measured at 1.4V, FOUT = 66.66MHz 40 50 60 %
Duty Cycle = t2 ÷ t1Measured at 1.4V, FOUT <50MHz 45 50 55 %
t3Rise Time Measured between 0.8V and 2V — — 1.5 n s
t4Fall Time Measured between 0.8V and 2V — — 1. 5 ns
t5Output to Output Skew All outputs equally loaded — — 250 ps
t6A Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 — 0 ±350 ps
t6B Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 in PLL bypass mode (IDT23S09E only) 1 5 8 .7 n s
t7Device-to-Device Skew Measured at VDD/2 on the CLKOUT pins of devices — 0 7 0 0 ps
t8Output Slew Rate Measured between 0.8V and 2V using Test Circuit 2 1 — — V/ns
tJCycle-to-Cycle Jitter Measured at 66.66MHz, loaded outputs — — 200 ps
tLOCK PLL Lock Time Stable power supply, valid clock presented on REF pin — — 1 ms
NOTES:
1. REF Input has a threshold voltage of VDD/2.
2. All parameters specified with loaded outputs.
DC ELECTRICAL CHARACTERISTICS - INDUSTRIAL
Symbol Parameter Conditions Min. Max. Unit
VIL Input LOW Voltage Level — 0.8 V
VIH Input HIGH Voltage Level 2 — V
IIL Input LOW Current VIN = 0V — 50 µA
IIH Input HIGH Current VIN = VDD — 100 µA
VOL Output LOW Voltage Standard Drive IOL = 8mA — 0.4 V
High Drive IOL = 12mA (-1H)
VOH Output HIGH Voltage Standard Drive IOH = -8mA 2.4 — V
High Drive IOH = -12mA (-1H)
IDD_PD Power Down Current REF = 0MHz (S2 = S1 = H) — 25 µ A
IDD Supply Current Unloaded Outputs at 66.66MHz, SEL inputs at VDD or GND — 3 5 mA
Symbol Parameter Min. Max. Unit
VDD Supply Voltage 3 3.6 V
TAOperating Temperature (Ambient Temperature) -40 +85 °C
CLLoad Capacitance < 100MHz — 3 0 pF
Load Capacitance 100MHz - 200MHz — 1 0
CIN Input Capacitance — 7 pF
OPERATING CONDITIONS - INDUSTRIAL
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COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT23S09E
3.3V ZERO DELAY CLOCK BUFFER
SWITCHING CHARACTERISTICS (23S09E-1H) - INDUSTRIAL(1,2)
Symbol Parameter Conditions Min. Typ. Max. Unit
t1Output Frequency 10pF Load 10 — 200 MHz
30pF Load 10 — 100
Duty Cycle = t2 ÷ t1Measured at 1.4V, FOUT = 66.66MHz 40 50 60 %
Duty Cycle = t2 ÷ t1Measured at 1.4V, FOUT <50MHz 45 50 55 %
t3Rise Time Measured between 0.8V and 2V — — 1.5 ns
t4Fall Time Measured between 0.8V and 2V — — 1.5 ns
t5Output to Output Skew All outputs equally loaded — — 250 ps
t6A Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 — 0 ±350 ps
t6B Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 in PLL bypass mode (IDT23S09E only) 1 5 8. 7 n s
t7Device-to-Device Skew Measured at VDD/2 on the CLKOUT pins of devices — 0 7 0 0 p s
t8Output Slew Rate Measured between 0.8V and 2V using Test Circuit 2 1 — — V/ns
tJCycle-to-Cycle Jitter Measured at 66.66MHz, loaded outputs — — 200 ps
tLOCK PLL Lock Time Stable power supply, valid clock presented on REF pin — — 1 ms
NOTES:
1. REF Input has a threshold voltage of VDD/2.
2. All parameters specified with loaded outputs.
SWITCHING CHARACTERISTICS (23S09E-1) - INDUSTRIAL(1,2)
Symbol Parameter Conditions Min. Typ. Max. Unit
t1Output Frequency 10pF Load 10 — 200 MHz
30pF Load 10 — 100
Duty Cycle = t2 ÷ t1Measured at 1.4V, FOUT = 66.66MHz 40 50 60 %
t3Rise Time Measured between 0.8V and 2V — — 2. 5 ns
t4Fall Time Measured between 0.8V and 2V — — 2.5 ns
t5Output to Output Skew All outputs equally loaded — — 250 ps
t6A Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 — 0 ±350 ps
t6B Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 in PLL bypass mode (IDT23S09E only) 1 5 8. 7 n s
t7Device-to-Device Skew Measured at VDD/2 on the CLKOUT pins of devices — 0 70 0 p s
tJCycle-to-Cycle Jitter Measured at 66.66MHz, loaded outputs — — 200 ps
tLOCK PLL Lock Time Stable power supply, valid clock presented on REF pin — — 1 ms
NOTES:
1. REF Input has a threshold voltage of VDD/2.
2. All parameters specified with loaded outputs.
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COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT23S09E
3.3V ZERO DELAY CLOCK BUFFER
ZERO DELAY AND SKEW CONTROL
All outputs should be uniformly loaded in order to achieve Zero I/O Delay. Since the CLKOUT pin is the internal feedback for the PLL, its relative
loading can affect and adjust the input/output delay.
For designs utilizing zero I/O Delay, all outputs including CLKOUT must be equally loaded. Even if the output is not used, it must have a capacitive
load equal to that on the other outputs in order to obtain true zero I/O Delay. For zero output-to-output skew, all outputs must be loaded equally.
SPREAD SPECTRUM COMPATIBLE
Many systems being designed now use a technology called Spread Spectrum Frequency Timing Generation. This product is designed not to filter
off the Spread Spectrum feature of the reference input, assuming it exists. When a zero delay buffer is not designed to pass the Spread Spectrum feature
through, the result is a significant amount of tracking skew, which may cause problems in systems requiring synchronization.
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COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT23S09E
3.3V ZERO DELAY CLOCK BUFFER
VDD
OUTPUTS
CLKOUT
CLOAD
VDD
GND GND
0.1 F
0.1 F
VDD
OUTPUTS
10pF
VDD
GND GND
0.1 F
0.1 F
1K
1K CLKOUT
Test Circuit 1 (all Parameters Except t8) Test Circuit 2 (t8, Output Slew Rate On -1H Devices)
TEST CIRCUITS
Output 1.4V
1.4V
t5
Output
REF VDD/2
t6
Output
CLKOUT
Device 1
t7
CLKOUT
Device 2
VDD/2
VDD/2
VDD/2
1.4V
1.4V
t2
t1
1.4V
2V
0.8V
t3 t4
0.8V 3.3V
0V
2V
Output
All Outputs Rise/Fall Time Input to Output Propagation Delay
Device to Device Skew
Output to Output Skew
Duty Cycle Timing
SWITCHING WAVEFORMS
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COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT23S09E
3.3V ZERO DELAY CLOCK BUFFER
ORDERING INFORMATION
CORPORATE HEADQUARTERS for SALES: for Tech Support:
6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 www.idt.com/go/clockhelp
San Jose, CA 95138 fax: 408-284-2775
www.idt.com
IDT XXXXX XX X
Package Process
Device Type
Blank
I
23S09E-1
23S09E-1H
Commercial (0oCto+70
oC)
Industrial (-40oCto+85
oC)
Zero Delay Clock Buffer with High Drive,
Spread Spectrum Compatible
Small Outline
SOIC - Green
Thin Shrink Small Outline Package
TSSOP - Green
DC
DCG
PG
PGG
ZDB with Standard Drive
ZDB with High Drive
Spread Spectrum Compatible
*NOTE: EOL for non-green parts to occur on 5/13/10 per
PDN U-09-01
Part / Order Number Shipping Packaging Package Temperature
23S09E-1DC* Tubes 16-pin SOIC 0° to +70° C
23S09E-1DC8* Tape and Reel 16-pin SOIC 0° to +70° C
23S09E-1DCI* Tubes 16-pin SOIC -40° to +85°C
23S09E-1DCI8* Tape and Reel 16-pin SOIC -40° to +85°C
23S09E-1HDC* Tubes 16-pin SOIC 0° to +70° C
23S09E-1HDC8* Tape and Reel 16-pin SOIC 0° to +70° C
23S09E-1HDCI* Tubes 16-pin SOIC -40° to +85°C
23S09E-1HDCI8* Tape and Reel 16-pin SOIC -40° to +85°C
23S09E-1HPG* Tubes 16-pin TSSOP 0° to +70° C
23S09E-1HPG8* Tape and Reel 16-pin TSSOP 0° to +70° C
23S09E-1HPGI* Tubes 16-pin TSSOP -40° to +85°C
23S09E-1HPGI8* Tape and Reel 16-pin TSSOP -40° to +85°C
23S09E-1DCG Tubes 16-pin SOIC 0° to +70° C
23S09E-1DCG8 Tape and Reel 16-pin SOIC 0° to +70° C
23S09E-1DCGI Tubes 16-pin SOIC -40° to +85°C
23S09E-1DCGI8 Tape and Reel 16-pin SOIC -40° to +85°C
23S09E-1HDCG Tubes 16-pin SOIC 0° to +70° C
23S09E-1HDCG8 Tape and Reel 16-pin SOIC 0° to +70° C
23S09E-1HDCGI Tubes 16-pin SOIC -40° to +85°C
23S09E-1HDCGI8 Tape and Reel 16-pin SOIC -40° to +85°C
23S09E-1HPGG Tubes 16-pin TSSOP 0° to +70° C
23S09E-1HPGG8 Tape and Reel 16-pin TSSOP 0° to +70° C
23S09E-1HPGGI Tubes 16-pin TSSOP -40° to +85°C
23S09E-1HPGGI8 Tape and Reel 16-pin TSSOP -40° to +85°C
