SPEC NO: CDA0208 REV NO: V.3 DATE: MAR/30/2002 PAGE: 1 OF 4
APPROVED : J. Lu CHECKED : DRAWN: L.Q.YANG
3.0x1.0mm SMD CHIP LED LAMP
APBA3010SRSGWPR SUPER BRIGHT RED
SUPER BRIGHT GREEN
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.15(0.006") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Package Dimensions
Features
!3.0mmx1.0mm SMT LED, 2.0mm THICKNESS.
!LOW POWER CONSUMPTION.
!WIDE VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
!VARIOUS COLORS AND LENS TYPES AVAILABLE.
!PACKAGE : 2000PCS / REEL.
Description
The Super Bright Red source color devices are made with
Gallium Aluminum Arsenide Red Light Emitting Diode.
The Super Bright Green source color devices are made with
Gallium Phosphide Green Light Emitting Diode.
SPEC NO: CDA0208 REV NO: V.3 DATE: MAR/30/2002 PAGE: 2 OF 4
APPROVED : J. Lu CHECKED : DRAWN: L.Q.YANG
Selection Guide
Electrical / Optical Characteristics at T)=25°°
°°
°C
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T)=25°°
°°
°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
.oNtraP.oNtraP .oNtraP .oNtraP.oNtraPeciDeciD eciD eciDeciDepyTsneLepyTsneL epyTsneL epyTsneLepyTsneL
)dcm(vI)dcm(vI )dcm(vI )dcm(vI)dcm(vI
Am02@
gniweiVgniweiV gniweiV gniweiVgniweiV
elgnA
.niM.niM .niM .niM.niM.pyT.pyT .pyT .pyT.pyT 2/1θ22/1θ2 2/1θ2 2/1θ22/1θ2
RPWGSRS0103ABPA )sAlAaG(DERTHGIRBREPUS DESUFFIDETIHW 0407°041
)PaG(NEERGTHGIRBREPUS861
lobmySlobmyS lobmyS lobmySlobmySretemaraPretemaraP retemaraP retemaraPretemaraPeciveDeciveD eciveD eciveDeciveD.pyT.pyT .pyT .pyT.pyT.xaM.xaM .xaM .xaM.xaMstinUstinU stinU stinUstinUsnoitidnoCtseTsnoitidnoCtseT snoitidnoCtseT snoitidnoCtseTsnoitidnoCtseT
λkaep htgnelevaWkaeP deRthgirBrepuS
neerGthgirBrepuS
066
565 mnAm02=FI
λDhtgnelevaWetanimoD deRthgirBrepuS
neerGthgirBrepuS
046
865 mnAm02=FI
λ 2/1 htdiwflaHeniLlartcepS deRthgirBrepuS
neerGthgirBrepuS
02
03 mnAm02=FI
CecnaticapaC deRthgirBrepuS
neerGthgirBrepuS
54
51 FpzHM1=f;V0=FV
V
F
egatloVdrawroF deRthgirBrepuS
neerGthgirBrepuS
58.1
2.2
5.2
5.2 VAm02=FI
I
R
tnerruCesreveRllA01AuV5=RV
retemaraPretemaraP retemaraP retemaraPretemaraPdeRthgirBrepuSdeRthgirBrepuS deRthgirBrepuS deRthgirBrepuSdeRthgirBrepuSneerGthgirBrepuSneerGthgirBrepuS neerGthgirBrepuS neerGthgirBrepuSneerGthgirBrepuSstinUstinU stinU stinUstinU
noitapissidrewoP001501Wm
tnerruCdrawroFCD0352Am
]1[tnerruCdrawroFkaeP551041Am
egatloVesreveR55V
erutarepmeTegarotS/gnitarepO 04- °58+oTC °C
SPEC NO: CDA0208 REV NO: V.3 DATE: MAR/30/2002 PAGE: 3 OF 4
APPROVED : J. Lu CHECKED : DRAWN: L.Q.YANG
Super Bright Red / Super Bright Green APBA3010SRSGWPR
SPEC NO: CDA0208 REV NO: V.3 DATE: MAR/30/2002 PAGE: 4 OF 4
APPROVED : J. Lu CHECKED : DRAWN: L.Q.YANG
APBA3010SRSGWPR
SMT Reflow Soldering Instructions
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.