LP38693
IN OUT
SNS**
GND
1 µF *1 µF *
VOUT
VIN
VEN EN
LP38691
IN OUT
SNS**
GND
1 µF *1 µF *
VOUT
VIN
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Reference
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LP3869x/-Q1 500-mA Low-Dropout CMOS Linear Regulators
Stable With Ceramic Output Capacitors
1 Features 3 Description
The LP3869x low-dropout CMOS linear regulators
1• Wide Input Voltage Range (2.7 V to 10 V) provide tight output tolerance (2% typical), extremely
• All WSON Options are Available as AEC-Q100 low dropout voltage (250 mV at 500-mA load current,
Grade 1 VOUT = 5 V), and excellent AC performance using
• 2% Output Accuracy (25°C) ultralow equivalent series resistance (ESR) ceramic
output capacitors.
• Low Dropout Voltage: 250 mV at 500 mA (Typical,
5 V Out) The low thermal resistance of the WSON, SOT-223,
and TO-252 packages allow use of the full operating
• Precision (Trimmed) Bandgap Reference current even in high ambient temperature
• Ensured Specifications for –40°C to 125°C environments.
• 1-µA Off-State Quiescent Current The use of a PMOS power transistor means that no
• Thermal Overload Protection DC base-drive current is required to bias it, thus
• Foldback Current Limiting allowing ground pin current to remain below 100 µA
• Ground Pin Current: 55 µA (typical) at full load regardless of load current, input voltage, or operating
temperature.
• Enable Pin (LP38693)
Device Information(1)
2 Applications PART NUMBER PACKAGE BODY SIZE (NOM)
• Hard Disk Drives TO-252 (3) 6.58 mm × 6.10 mm
LP38691
• Notebook Computers WSON (6) 3.00 mm × 3.00 mm
• Battery-Powered Devices SOT-223 (5) 6.50 mm × 3.56 mm
LP38693
• Portable Instrumentation WSON (6) 3.00 mm × 3.00 mm
LP38691-Q1 WSON (6) 3.00 mm × 3.00 mm
LP38693-Q1
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Typical Application Circuits
* Minimum value required for stability * Minimum value required for stability
** WSON package devices only ** WSON package devices only
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
8.4 Device Functional Modes........................................ 13
1 Features.................................................................. 19 Application and Implementation ........................ 14
2 Applications ........................................................... 19.1 Application Information............................................ 14
3 Description............................................................. 19.2 Typical Application ................................................. 14
4 Typical Application Circuits ................................. 110 Power Supply Recommendations ..................... 19
5 Revision History..................................................... 211 Layout................................................................... 19
6 Pin Configuration and Functions......................... 311.1 Layout Guidelines ................................................. 19
7 Specifications......................................................... 411.2 Layout Example .................................................... 19
7.1 Absolute Maximum Ratings ...................................... 411.3 WSON Mounting................................................... 20
7.2 ESD Ratings: LP38691 and LP38693....................... 412 Device and Documentation Support................. 21
7.3 ESD Ratings: LP38691-Q1 and LP38693-Q1........... 412.1 Documentation Support ........................................ 21
7.4 Recommended Operating Conditions....................... 412.2 Related Links ........................................................ 21
7.5 Thermal Information.................................................. 512.3 Community Resources.......................................... 21
7.6 Electrical Characteristics........................................... 512.4 Trademarks........................................................... 21
7.7 Typical Characteristics.............................................. 712.5 Electrostatic Discharge Caution............................ 21
8 Detailed Description............................................ 11 12.6 Glossary................................................................ 21
8.1 Overview................................................................. 11 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagrams ..................................... 11 Information........................................................... 21
8.3 Feature Description................................................. 13
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (March 2015) to Revision O Page
• Added top navigator icon for TI Designs ............................................................................................................................... 1
• Added Caution note to Foldback Current Limiting subsection ............................................................................................ 13
Changes from Revision M (February 2015) to Revision N Page
• Added "Cout = xx pF" to "Cout = µF" for Figures 4 through 6 in Typical Characteristics...................................................... 1
Changes from Revision L (December 2014) to Revision M Page
• Changed wording of Description and added one item to Features; update Vin, Vout and Ven pin names to IN, OUT,
and EN in text and graphics .................................................................................................................................................. 1
• Added top navigator icon for TI Designs ............................................................................................................................... 1
• Changed "PFM" to 'TO-252" .................................................................................................................................................. 4
• Changed Handling Ratings to ESD Ratings format ............................................................................................................... 4
Changes from Revision K (April 2013) to Revision L Page
• Added Handling Rating table, Feature Description section, Device Functional Modes,Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section; update thermal values.......................... 1
Changes from Revision J (April 2013) to Revision K Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 18
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IN
2
34
5
6
1
GND
EN OUT
SNS
IN
Exposed Pad
on Bottom
(DAP)
IN
2
34
5
6
1
GND
N/C OUT
SNS
IN
Exposed Pad
on Bottom
(DAP)
N/C
OUT
GND
EN
IN
1
2
4
3
5
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6 Pin Configuration and Functions
NDP Package
3-Pin TO-252
Top View
NDC Package
5-Pin SOT-223
Top View
NC - No internal connection
NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38691SD Top View
NC - No internal connection
NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38693SD Top View
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Pin Functions
PIN I/O DESCRIPTION
TO- SOT-
NAME WSON
252 223
WSON Only - The DAP (Exposed Pad) functions as a thermal connection when
DAP — √ √ — — soldered to a copper plane. See WSON Mounting section for more information.
The EN pin allows the part to be turned ON and OFF by pulling this pin high or
EN — — 3 1 I low.
Circuit ground for the regulator. For the TO-252 and SOT-223 packages this is
GND TAB 2 2 5 — thermally connected to the die and functions as a heat sink when the soldered
down to a large copper plane.
This is the input supply voltage to the regulator. For WSON devices, both IN
IN 3 1, 6 1, 6 4 I pins must be tied together for full current operation (250 mA maximum per pin).
OUT 1 4 4 3 O Regulated output voltage
WSON Only - Output SNS pin allows remote sensing at the load which eliminate
SNS — 5 5 — I the error in output voltage due to voltage drops caused by the resistance in the
traces between the regulator and the load. This pin must be tied to OUT.
7 Specifications
7.1 Absolute Maximum Ratings(1)(2)
MIN MAX UNIT
Lead temp. (Soldering, 5 seconds) 260 °C
Power dissipation(3) Internally Limited V
V(max) All pins (with respect to GND) –0.3 12 V
IOUT(4) Internally Limited V
Junction temperature –40 150 °C
Storage temperature, Tstg −65 150
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a
heatsink is used). When using the WSON package, refer to AN-1187 Leadless Leadframe Package (LLP),SNOA401, and the WSON
Mounting section in this datasheet. If power dissipation causes the junction temperature to exceed specified limits, the device goes into
thermal shutdown.
(4) If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to
ground.
7.2 ESD Ratings: LP38691 and LP38693 VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.3 ESD Ratings: LP38691-Q1 and LP38693-Q1 VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.4 Recommended Operating Conditions MIN NOM MAX UNIT
VIN supply voltage 2.7 10 V
Operating junction temperature −40 125 °C
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7.5 Thermal Information LP38691 LP38693 LP3869x
THERMAL METRIC(1) TO-252 WSON SOT-223 UNIT
3 PINS 6 PINS 5 PINS
RθJA(2) Junction-to-ambient thermal resistance 50.5 50.6 68.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52.6 44.4 52.2 °C/W
RθJB Junction-to-board thermal resistance 29.7 24.9 13.0 °C/W
ψJT Junction-to-top characterization parameter 4.8 0.4 5.5 °C/W
ψJB Junction-to-board characterization parameter 29.3 25.1 12.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.5 5.4 n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Junction-to-ambient thermal resistance, High-K.
7.6 Electrical Characteristics
Unless otherwise specified, limits apply for TJ= 25°C, VIN = VOUT + 1 V, CIN = COUT = 10 µF, ILOAD = 10 mA. Minimum and
maximum limits are specified through testing, statistical correlation, or design.
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
–2 2
100 µA < IL< 0.5 A
VOOutput voltage tolerance %VOUT
VO+ 1 V ≤VIN ≤10 V –4 4
Full operating temperature range
VO+ 0.5 V ≤VIN ≤10 V 0.03
IL= 25 mA
Output voltage line
ΔVO/ΔVIN %/V
VO+ 0.5 V ≤VIN ≤10 V
regulation(2) IL= 25 mA 0.1
Full operating temperature range
1 mA < IL< 0.5 A 1.8
VIN = VO+ 1 V
Output voltage load
ΔVO/ΔIL%/A
1 mA < IL< 0.5 A
regulation(3) VIN = VO+ 1 V 5
Full operating temperature range
IL= 0.1 A 80
(VO= 2.5 V) IL= 0.5 A 430
(VO= 2.5 V) IL= 0.1 A 145
Full operating temperature IL= 0.5 A 725
range IL= 0.1 A 65
(VO= 3.3 V) IL= 0.5 A 330
VIN – VOUT Dropout voltage(4) mV
(VO= 3.3 V) IL= 0.1 A 110
Full operating temperature IL= 0.5 A 550
range IL= 0.1 A 45
(VO= 5 V) IL= 0.5 A 250
(VO= 5 V) IL= 0.1 A 100
Full operating temperature IL= 0.5 A 450
range
(1) Typical numbers represent the most likely parametric norm for 25°C operation.
(2) Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.
(3) Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1 mA to
full load.
(4) Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100 mV of nominal value.
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Electrical Characteristics (continued)
Unless otherwise specified, limits apply for TJ= 25°C, VIN = VOUT + 1 V, CIN = COUT = 10 µF, ILOAD = 10 mA. Minimum and
maximum limits are specified through testing, statistical correlation, or design.
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VIN ≤10 V, IL=100 µA - 0.5 A 55
VIN ≤10 V, IL=100 µA - 0.5 A
IQQuiescent current 100
Full operating temperature range µA
VEN ≤0.4 V, (LP38693 Only) 0.001 1
VIN – VO≤4 V
IL(MIN) Minimum load current 100
Full operating temperature range
VIN – VO> 5 V 350
IFB Foldback current limit mA
VIN – VO< 4 V 850
PSRR Ripple rejection VIN = VO+ 2 V(DC), with 1 V(p-p) / 120-Hz Ripple 55 dB
Thermal shutdown activation
TSD 160
(junction temp) °C
TSD Thermal shutdown hysteresis 10
(HYST) (junction temp) BW = 10 Hz to 10 kHz
enOutput noise 0.7 µV/√Hz
VO= 3.3 V
VO(LEAK) Output leakage current VO= VO(NOM) + 1 V at 10 VIN 0.5 12 µA
Output = OFF 0.4
Full operating temperature range
Output = ON, VIN = 4 V 1.8
Full operating temperature range
Enable voltage (LP38693
VEN V
Only) Output = ON, VIN = 6 V 3
Full operating temperature range
Output = ON, VIN = 10 V 4
Full operating temperature range
Enable pin leakage VEN = 0 V or 10 V, VIN = 10 V
IEN –1 0.001 1 µA
(lLP38693 only)
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7.7 Typical Characteristics
Unless otherwise specified: TJ= 25°C, CIN = COUT = 10 µF, EN pin is tied to IN (LP38693 only), VOUT = 1.8 V, VIN = VOUT 1 V,
IL= 10 mA.
Figure 2. Noise vs Frequency
Figure 1. Noise vs Frequency
Figure 3. Noise vs Frequency Figure 4. Ripple Rejection
Figure 5. Ripple Rejection Figure 6. Ripple Rejection
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20
10
0
-10
-20
'VOUT (mV)
3
4
5
VIN (V)
VIN
VOUT
VOUT = 3.3V
COUT = 100 PF
200 Ps/DIV
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Typical Characteristics (continued)
Unless otherwise specified: TJ= 25°C, CIN = COUT = 10 µF, EN pin is tied to IN (LP38693 only), VOUT = 1.8 V, VIN = VOUT 1 V,
IL= 10 mA.
Figure 7. Line Transient Response Figure 8. Line Transient Response
Figure 9. Line Transient Response Figure 10. Load Transient Response
Figure 12. VOUT vs Temperature (5.0 V)
Figure 11. Load Transient Response
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Typical Characteristics (continued)
Unless otherwise specified: TJ= 25°C, CIN = COUT = 10 µF, EN pin is tied to IN (LP38693 only), VOUT = 1.8 V, VIN = VOUT 1 V,
IL= 10 mA.
Figure 14. VOUT vs Temperature (2.5 V)
Figure 13. VOUT vs Temperature (3.3 V)
Figure 15. VOUT vs Temperature (1.8 V) Figure 16. VOUT vs VIN (1.8 V)
Figure 18. Enable Voltage vs Temperature
Figure 17. VOUT vs VIN, Power-Up
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0 100 200 300 400 500
2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
MIN VIN (V)
IOUT (mA)
-40°C
25°C
125°C
0 100 200 300 400 500
IOUT (mA)
0
100
200
300
400
500
600
700
800
900
VDROPOUT (mV)
-40°C
25°C
125°C
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Typical Characteristics (continued)
Unless otherwise specified: TJ= 25°C, CIN = COUT = 10 µF, EN pin is tied to IN (LP38693 only), VOUT = 1.8 V, VIN = VOUT 1 V,
IL= 10 mA.
Figure 19. Load Regulation vs Temperature Figure 20. Line Regulation vs Temperature
Figure 22. Dropout Voltage vs IOUT
Figure 21. MIN VIN vs IOUT
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ENABLE
LOGIC
-
+MOSFET
DRIVER
FOLDBACK
CURRENT
LIMITING
1.25-V
REFERENCE
THERMAL
SHUTDOWN
IN
OUT
GND
P-FET
P-FET
R1
R2
ENABLE
LOGIC
-
+MOSFET
DRIVER
FOLDBACK
CURRENT
LIMITING
1.25-V
REFERENCE
THERMAL
SHUTDOWN
IN
OUT
GND
P-FET
P-FET
N/C
R1
R2
SNS
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8 Detailed Description
8.1 Overview
The LP38691 and LP38693 are designed to meet the requirements of portable, battery-powered digital systems
providing an accurate output voltage with fast start-up. When disabled via a low logic signal at the enable pin
(EN), the power consumption is reduced to virtually zero (LP38693 only).
The LP38691 and LP38693 perform well with a single 1-μF input capacitor and a single 1-μF ceramic output
capacitor.
8.2 Functional Block Diagrams
Figure 23. LP38691 Functional Diagram (WSON)
Figure 24. LP38691 Functional Diagram (TO-252)
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ENABLE
LOGIC
-
+MOSFET
DRIVER
FOLDBACK
CURRENT
LIMITING
1.25-V
REFERENCE
THERMAL
SHUTDOWN
IN
OUT
GND
P-FET
P-FET
EN
R1
R2
ENABLE
LOGIC
-
+MOSFET
DRIVER
FOLDBACK
CURRENT
LIMITING
1.25-V
REFERENCE
THERMAL
SHUTDOWN
IN
OUT
GND
P-FET
P-FET
EN
R1
R2
SNS
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Functional Block Diagrams (continued)
Figure 25. LP38693 Functional Diagram (WSON)
Figure 26. LP38693 Functional Diagram (SOT-223)
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8.3 Feature Description
8.3.1 Enable (EN)
The LP38693 has an Enable pin (EN) which allows an external control signal to turn the regulator output On and
Off. The Enable On/Off threshold has no hysteresis. The voltage signal must rise and fall cleanly, and promptly,
through the ON and OFF voltage thresholds. The EN pin voltage must be higher than the VEN(MIN) threshold to
ensure that the device is fully enabled under all operating conditions. The EN pin voltage must be lower than the
VEN(MAX) threshold to ensure that the device is fully disabled. The EN pin has no internal pullup or pulldown to
establish a default condition and, as a result, this pin must be terminated either actively or passively. If the EN
pin is driven from a source that actively pulls high and low, the drive voltage must not be allowed to go below
ground potential or higher than VIN. If the application does not require the Enable function, the pin must be
connected directly to the IN pin.
8.3.2 Thermal Overload Protection (TSD)
Thermal Shutdown disables the output when the junction temperature rises to approximately 160°C which allows
the device to cool. When the junction temperature cools to approximately 150°C, the output circuitry enables.
Based on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may
cycle on and off. This thermal cycling limits the dissipation of the regulator and protects it from damage as a
result of overheating. The Thermal Shutdown circuitry of the LP38693 has been designed to protect against
temporary thermal overload conditions.
The Thermal Shutdown circuitry was not intended to replace proper heat-sinking. Continuously running the
LP38693 device into thermal shutdown degrades device reliability.
8.3.3 Foldback Current Limiting
Foldback current limiting is built into the LP38691 and LP38693 devices which reduces the amount of output
current the part can deliver as the output voltage is reduced. The amount of load current is dependent on the
differential voltage between the IN and OUT pins. Typically, when this differential voltage exceeds 5 V, the load
current limits at about 350 mA. When the VIN – VOUT differential is reduced below 4 V, load current is limited to
about 850 mA.
CAUTION
When toggling the LP38693 Enable (EN) after the input voltage (VIN) is applied, the
foldback current limit circuitry is functional the first time that the EN pin is taken high.
The foldback current limit circuitry is non-functional the second, and subsequent, times
that the EN pin is taken high. Depending on the input and output capacitance values
the input inrush current may be higher than expected which can cause the input
voltage to droop.
If the EN pin is connected to the IN pin, the foldback current limit circuitry is functional
when VIN is applied if VIN starts from less than 0.4 V.
8.4 Device Functional Modes
8.4.1 Enable (EN)
The EN pin voltage must be higher than the VEN(MIN) threshold to ensure that the device is fully enabled under all
operating conditions.
8.4.2 Minimum Operating Input Voltage (VIN)
The LP38691 and LP38693 do not include any dedicated UVLO circuitry. Neither device internal circuitry is fully
functional until VIN is at least 2.7 V. The output voltage is not regulated until VIN ≥(VOUT + VDO), or 2.7 V,
whichever is higher.
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LP38691
IN OUT
SNS**
GND
1 µF *1 µF *
VOUT
VIN
LP38693
IN OUT
SNS**
GND
1 µF *1 µF *
VOUT
VIN
VEN EN
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Reverse Voltage
A reverse voltage condition exists when the voltage at the output pin is higher than the voltage at the input pin.
Typically this happens when VIN is abruptly taken low and COUT continues to hold a sufficient charge such that
the input to output voltage becomes reversed. A less common condition is when an alternate voltage source is
connected to the output.
There are two possible paths for current to flow from the OUT pin back to IN during a reverse voltage condition.
1. While VIN is high enough to keep the control circuity alive, and the EN pin (LP38693 only) is above the
VEN(ON) threshold, the control circuitry attempts to regulate the output voltage. If the input voltage is less than
the programmed output voltage, the control circuit drives the gate of the pass element to the full ON
condition. In this condition, reverse current flows from the OUT to the IN pin, limited only by the RDS(ON) of
the pass element and the output to input voltage differential. Discharging an output capacitor up to 1000 μF
in this manner does not damage the device as the current rapidly decays. However, continuous reverse
current must be avoided. When the EN pin is low, this condition is prevented.
2. The internal PFET pass element has an inherent parasitic diode. During normal operation, the input voltage
is higher than the output voltage and the parasitic diode is reverse biased. However, when VIN is below the
value where the control circuity is alive, or the EN pin is low (LP38693 only), and the output voltage is more
than 500 mV (typical) above the input voltage the parasitic diode becomes forward biased and current flows
from the output pin to the input pin through the diode. The current in the parasitic diode must be limited to
less than 1-A continuous and 5-A peak.
If used in a dual-supply system where the regulator output load is returned to a negative supply, the output
pin must be diode-clamped to ground to limit the negative voltage transition. A Schottky diode is
recommended for this protective clamp.
9.2 Typical Application
* Minimum value required for stability.
**WSON package devices only.
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9.2.1 Design Requirements
Table 1. Design Parameters
DESIGN PARAMETERS EXAMPLE VALUE
Input voltage range 2.7 V to 10 V
Output range 1.8 V
Output current 1 A
Output capacitor range 1 µF
Input and output capacitor ESR range 5 mΩto 500 mΩ
9.2.2 Detailed Design Procedure
9.2.2.1 Power Dissipation and Device Operation
The permissible power dissipation for any package is a measure of the capability of the device to pass heat from
the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus, the power
dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces
between the die junction and ambient air.
The maximum allowable power dissipation for the device in a given package can be calculated using Equation 1:
PD-MAX = ((TJ-MAX – TA) / RθJA) (1)
The actual power being dissipated in the device can be represented by Equation 2:
PD= (VIN – VOUT)×IOUT (2)
These two equations establish the relationship between the maximum power dissipation allowed due to thermal
consideration, the voltage drop across the device, and the continuous current capability of the device. These two
equations must be used to determine the optimum operating conditions for the device in the application.
In applications where lower power dissipation (PD) and/or excellent package thermal resistance (RθJA) is present,
the maximum ambient temperature (TA-MAX) may be increased.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum
ambient temperature (TA-MAX) may have to be derated. TA-MAX is dependent on the maximum operating junction
temperature (TJ-MAX-OP = 125°C), the maximum allowable power dissipation in the device package in the
application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA),
as given by Equation 3:
TA-MAX = (TJ-MAX-OP – (RθJA × PD-MAX)) (3)
Alternately, if TA-MAX can not be derated, the PDvalue must be reduced. This can be accomplished by reducing
VIN in the VIN – VOUT term as long as the minimum VIN is met, or by reducing the IOUT term, or by some
combination of the two.
9.2.2.2 External Capacitors
In common with most regulators, the LP38691 and LP38693 require an external capacitors for regulator stability.
The devices are specifically designed for portable applications requiring minimum board space and smallest
components. These capacitors must be correctly selected for good performance.
9.2.2.3 Input Capacitor
An input capacitor is required for stability. TI recommends that a 1-µF capacitor be connected between the
devices' IN pin and GND pin (this capacitance value may be increased without limit).
This capacitor must be located a distance of not more than 1 cm from the IN pin and returned to a clean
analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LP38691 LP38693 LP38691-Q1 LP38693-Q1
LP38691
,
LP38693
,
LP38691-Q1
,
LP38693-Q1
SNVS321O –JANUARY 2005–REVISED DECEMBER 2015
www.ti.com
Important: To ensure stable operation it is essential that good PCB design practices are employed to minimize
ground impedance and keep input inductance low. If these conditions cannot be met, or if long leads are used to
connect the battery or other power source to the LP38691 or LP38693, then TI recommends that the input
capacitor is increased. Also, tantalum capacitors can suffer catastrophic failures due to surge current when
connected to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is
used at the input, it must be ensured by the manufacturer to have a surge current rating sufficient for the
application.
There are no requirements for the equivalent series resistance (ESR) on the input capacitor, but tolerance and
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance remains
approximately 1 µF over the entire operating temperature range.
9.2.2.4 Output Capacitor
The LP3869x is designed specifically to work with very small ceramic output capacitors. A 1-µF ceramic
capacitor (temperature types Z5U, Y5V or X7R/X5R) with ESR between 5 mΩto 500 mΩ, is suitable in the
LP3869x application circuit.
For this device the output capacitor must be connected between the OUT pin and GND pin.
It is also possible to use tantalum or film capacitors at the device output, but these are not as attractive for
reasons of size and cost.
The output capacitor must meet the requirement for the minimum value of capacitance and also have an ESR
value that is within the range 5 mΩto 500 mΩfor stability.
9.2.2.5 No-Load Stability
The LP3869x remains stable and in regulation with no external load. This is an important consideration in some
circuits, for example CMOS RAM keep-alive applications.
9.2.2.6 Capacitor Characteristics
The LP3869x is designed to work with ceramic capacitors on the output to take advantage of the benefits they
offer. For capacitance values in the range of 0.47 µF to 4.7 µF, ceramic capacitors are the smallest, least
expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise. The
ESR of a typical 1-µF ceramic capacitor is in the range of 20 mΩto 40 mΩ, which easily meets the ESR
requirement for stability for the LP3869x.
For both input and output capacitors, careful interpretation of the capacitor specification is required to ensure
correct device operation. The capacitor value can change greatly, depending on the operating conditions and
capacitor type.
In particular, the output capacitor selection must take account of all the capacitor parameters, to ensure that the
specification is met within the application. The capacitance can vary with DC bias conditions as well as
temperature and frequency of operation. Capacitor values also show some decrease over time due to aging. The
capacitor parameters are also dependent on the particular case size, with smaller sizes giving poorer
performance figures in general. As an example, Figure 27 shows a typical graph comparing different capacitor
case sizes in a Capacitance vs. DC Bias plot. As shown in the graph, increasing the DC Bias condition can result
in the capacitance value falling below the minimum value given in the recommended capacitor specifications
table (0.7 µF in this case). Note that the graph shows the capacitance out of specification for the 0402 case size
capacitor at higher bias voltages. It is therefore recommended that the capacitor manufacturers’ specifications for
the nominal value capacitor are consulted for all conditions, as some capacitor sizes (for example, 0402) may not
be suitable in the actual application.
16 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated
Product Folder Links: LP38691 LP38693 LP38691-Q1 LP38693-Q1
0402, 6.3V, X5R
0603, 10V, X5R
0 1.0 2.0 3.0 4.0 5.0
DC BIAS (V)
20%
40%
60%
80%
100%
CAP VALUE (% of NOMINAL 1 PF)
LP38691
,
LP38693
,
LP38691-Q1
,
LP38693-Q1
www.ti.com
SNVS321O –JANUARY 2005–REVISED DECEMBER 2015
Figure 27. Typical Variation In Capacitance vs DC Bias
The value of the ceramic capacitor can vary with temperature. The capacitor type X7R, which operates over a
temperature range of –55°C to 125°C, only varies the capacitance to within ±15%. The capacitor type X5R has a
similar tolerance over a reduced temperature range of –55°C to 85°C. Many large value ceramic capacitors,
larger than 1 µF, are manufactured with Z5U or Y5V temperature characteristics. Their capacitance can drop by
more than 50% as the temperature varies from 25°C to 85°C. Therefore, X7R and X5R types are recommended
over Z5U and Y5V in applications where the ambient temperature changes significantly above or below 25°C.
Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more costly
when comparing equivalent capacitance and voltage ratings in the 0.47-µF to 4.7-µF range.
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic
capacitor with the same ESR value. It mustalso be noted that the ESR of a typical tantalum increases about 2:1
as the temperature goes from 25°C down to –40°C, so some guard band must be allowed.
9.2.2.7 RFI/EMI Susceptibility
Radio frequency interference (RFI) and electromagnetic interference (EMI) can degrade any integrated circuit’s
performance because of the small dimensions of the geometries inside the device. In applications where circuit
sources are present which generate signals with significant high frequency energy content (> 1 MHz), care must
be taken to ensure that this does not affect the device regulator.
If RFI/EMI noise is present on the input side of the regulator (such as applications where the input source comes
from the output of a switching regulator), good ceramic bypass capacitors must be used at the input pin of the
device.
If a load is connected to the device output which switches at high speed (such as a clock), the high-frequency
current pulses required by the load must be supplied by the capacitors on the IC output. Because the bandwidth
of the regulator loop is less than 100 kHz, the control circuitry cannot respond to load changes above that
frequency. This means the effective output impedance of the device at frequencies above 100 kHz is determined
only by the output capacitors.
In applications where the load is switching at high speed, the output of the IC may need RF isolation from the
load. TI recommends that some inductance be placed between the output capacitor and the load, and good RF
bypass capacitors be placed directly across the load.
PCB layout is also critical in high noise environments, because RFI/EMI is easily radiated directly into PC traces.
Noisy circuitry must be isolated from clean circuits where possible, and grounded through a separate path. At
MHz frequencies, ground planes begin to look inductive and RFI/ EMI can cause ground bounce across the
ground plane. In multi-layer PCB applications, care must be taken in layout so that noisy power and ground
planes do not radiate directly into adjacent layers which carry analog power and ground.
Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LP38691 LP38693 LP38691-Q1 LP38693-Q1
LP38691
,
LP38693
,
LP38691-Q1
,
LP38693-Q1
SNVS321O –JANUARY 2005–REVISED DECEMBER 2015
www.ti.com
9.2.2.8 Output Noise
Noise is specified in two ways: Spot Noise or Output Noise Density is the RMS sum of all noise sources,
measured at the regulator output, at a specific frequency (measured with a 1-Hz bandwidth). This type of noise is
usually plotted on a curve as a function of frequency. Total Output Noise or Broad-Band Noise is the RMS sum
of spot noise over a specified bandwidth, usually several decades of frequencies.
Attention paid to the units of measurement. Spot noise is measured in units µV√Hz or nV√Hz, and total output
noise is measured in µVRMS.
The primary source of noise in low-dropout regulators is the internal reference. Noise can be reduced in two
ways: by increasing the transistor area or by increasing the current drawn by the internal reference. Increasing
the area decreases the chance of fitting the die into a smaller package. Increasing the current drawn by the
internal reference increases the total supply current (GND pin current).
9.2.3 Application Curves
Figure 28. VOUT vs VEN, ON (LP38693 Only) Figure 29. VOUT vs VEN, OFF (LP38693 Only)
18 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated
Product Folder Links: LP38691 LP38693 LP38691-Q1 LP38693-Q1
COUT
VOUT
CIN
LP38691DT
Power Ground
VIN IN
OUT
GND
VIN
CIN
COUT
SNS
OUT
LP38691SD
Power
Ground
1
2
3 4
5
6
Thermal
Pad
N/C
IN IN
LP38691
,
LP38693
,
LP38691-Q1
,
LP38693-Q1
www.ti.com
SNVS321O –JANUARY 2005–REVISED DECEMBER 2015
10 Power Supply Recommendations
The LP38691 and LP38693 are designed to operate from an input supply voltage range of 2.7 V to 10 V. The
input supply must be well regulated and free of spurious noise. To ensure that the device output voltage is well
regulated, input supply must be at least VOUT + 0.5 V, or 2.7 V, whichever is higher. A minimum capacitor value
of 1-μF is required to be within 1 cm of the IN pin.
11 Layout
11.1 Layout Guidelines
The dynamic performance of the LP38691 or LP38693 is dependent on the layout of the PCB. PCB layout
practices that are adequate for typical LDOs may degrade the load regulation, PSRR, noise, or transient
performance of the LP38691 or LP38693.
Best performance is achieved by placing CIN and COUT on the same side of the PCB as the LP38691 or
LP38693, and as close to the package as is practical. The ground connections for CIN and COUT must be back to
the LP38691 or LP38693 GND pin using as wide, and as short, a copper trace as is practical.
Connections using long trace lengths, narrow trace widths, or connections through vias must be avoided. These
add parasitic inductances and resistance that result in inferior performance especially during transient conditions.
A Ground Plane, either on the opposite side of a two-layer PCB, or embedded in a multi-layer PCB, is strongly
recommended. This Ground Plane serves two purposes:
• Provides a circuit reference plane to assure accuracy.
• Provides a thermal plane to remove heat from the LP38691 or LP38693 WSON package through thermal vias
under the package DAP.
11.2 Layout Example
Figure 30. TO-252 Package Figure 31. WSON LP38691 Layout
space
space
Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LP38691 LP38693 LP38691-Q1 LP38693-Q1
COUT
SNS
OUT
CIN
LP38693SD
Power
Ground
1
2
3 4
5
6
Thermal
Pad
EN
IN IN
COUT
VOUT
CIN
LP38693MP
Power
Ground
VIN
EN
NC
OUT
IN
GND
LP38691
,
LP38693
,
LP38691-Q1
,
LP38693-Q1
SNVS321O –JANUARY 2005–REVISED DECEMBER 2015
www.ti.com
Layout Example (continued)
Figure 32. SOT-223 Layout Figure 33. WSON LP38693 Layout
11.3 WSON Mounting
The NGG0006A (No Pullback) 6-Lead WSON package requires specific mounting techniques which are detailed
in the TI AN-1187 Application Report SNOA401. Referring to the section PCB Design Recommendations, note
that the pad style which must be used with the WSON package is the NSMD (non-solder mask defined) type.
Additionally, TI recommends the PCB terminal pads to be 0.2 mm longer than the package pads to create a
solder fillet to improve reliability and inspection.
The input current is split between two IN pins, 1 and 6. The two IN pins must be connected together to ensure
that the device can meet all specifications at the rated current.
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the
amount of additional copper area connected to the DAP.
The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive
die attach adhesive. The DAP has no direct electrical (wire) connection to any of the pins. There is a parasitic PN
junction between the die substrate and the device ground. As such, it is strongly recommend that the DAP be
connected directly to the ground at device lead 2 (that is, GND). Alternately, but not recommended, the DAP may
be left floating (that is, no electrical connection). The DAP must not be connected to any potential other than
ground.
20 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated
Product Folder Links: LP38691 LP38693 LP38691-Q1 LP38693-Q1
LP38691
,
LP38693
,
LP38691-Q1
,
LP38693-Q1
www.ti.com
SNVS321O –JANUARY 2005–REVISED DECEMBER 2015
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
Texas Instruments AN-1187 Leadless Leadframe Package (LLP) (SNOA401).
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
LP38691 Click here Click here Click here Click here Click here
LP38693 Click here Click here Click here Click here Click here
LP38691-Q1 Click here Click here Click here Click here Click here
LP38693-Q1 Click here Click here Click here Click here Click here
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Links: LP38691 LP38693 LP38691-Q1 LP38693-Q1
PACKAGE OPTION ADDENDUM
www.ti.com 6-Nov-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP38691DT-1.8 NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LP38691
DT-1.8
LP38691DT-1.8/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP38691
DT-1.8
LP38691DT-2.5/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP38691
DT-2.5
LP38691DT-3.3 NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LP38691
DT-3.3
LP38691DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP38691
DT-3.3
LP38691DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP38691
DT-5.0
LP38691DTX-1.8/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP38691
DT-1.8
LP38691DTX-2.5/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP38691
DT-2.5
LP38691DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP38691
DT-3.3
LP38691DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP38691
DT-5.0
LP38691QSD-1.8/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L256B
LP38691QSD-2.5/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L257B
LP38691QSD-3.3/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L258B
LP38691QSD-5.0/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L259B
LP38691QSDX-1.8/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L256B
LP38691QSDX-2.5/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L257B
LP38691QSDX-3.3/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L258B
PACKAGE OPTION ADDENDUM
www.ti.com 6-Nov-2018
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP38691QSDX-5.0/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L259B
LP38691SD-1.8/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L118B
LP38691SD-2.5/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L119B
LP38691SD-3.3/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L120B
LP38691SD-5.0/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L121B
LP38691SDX-1.8/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L118B
LP38691SDX-3.3/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L120B
LP38691SDX-5.0/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L121B
LP38693MP-1.8/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJVB
LP38693MP-2.5/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJXB
LP38693MP-3.3 NRND SOT-223 NDC 5 1000 TBD Call TI Call TI -40 to 125 LJYB
LP38693MP-3.3/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJYB
LP38693MP-5.0/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJZB
LP38693MPX-1.8/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJVB
LP38693MPX-2.5/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJXB
LP38693MPX-3.3/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJYB
LP38693MPX-5.0/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJZB
LP38693QSD-1.8/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L260B
PACKAGE OPTION ADDENDUM
www.ti.com 6-Nov-2018
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP38693QSD-2.5/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L261B
LP38693QSD-3.3/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L262B
LP38693QSD-5.0/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L263B
LP38693QSDX-1.8/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L260B
LP38693QSDX-2.5/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L261B
LP38693QSDX-3.3/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L262B
LP38693QSDX-5.0/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L263B
LP38693SD-1.8 NRND WSON NGG 6 1000 TBD Call TI Call TI -40 to 125 L128B
LP38693SD-1.8/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L128B
LP38693SD-2.5/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L129B
LP38693SD-3.3 NRND WSON NGG 6 1000 TBD Call TI Call TI -40 to 125 L130B
LP38693SD-3.3/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L130B
LP38693SD-5.0/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L131B
LP38693SDX-3.3/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L130B
LP38693SDX-5.0/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L131B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Nov-2018
Addendum-Page 4
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LP38691, LP38691-Q1, LP38693, LP38693-Q1 :
•Catalog: LP38691, LP38693
•Automotive: LP38691-Q1, LP38693-Q1
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP38691DTX-1.8/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LP38691DTX-2.5/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LP38691DTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LP38691DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LP38691QSD-1.8/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691QSD-2.5/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691QSD-3.3/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691QSD-5.0/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691QSDX-1.8/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691QSDX-2.5/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691QSDX-3.3/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691QSDX-5.0/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691SD-1.8/NOPB WSON NGG 6 1000 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691SD-2.5/NOPB WSON NGG 6 1000 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691SD-3.3/NOPB WSON NGG 6 1000 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691SD-5.0/NOPB WSON NGG 6 1000 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691SDX-1.8/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38691SDX-3.3/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP38691SDX-5.0/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693MP-1.8/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP38693MP-2.5/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP38693MP-3.3 SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP38693MP-3.3/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP38693MP-5.0/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP38693MPX-1.8/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP38693MPX-2.5/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP38693MPX-3.3/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP38693MPX-5.0/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LP38693QSD-1.8/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693QSD-2.5/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693QSD-3.3/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693QSD-5.0/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693QSDX-1.8/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693QSDX-2.5/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693QSDX-3.3/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693QSDX-5.0/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693SD-1.8 WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693SD-1.8/NOPB WSON NGG 6 1000 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693SD-2.5/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693SD-3.3 WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693SD-3.3/NOPB WSON NGG 6 1000 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693SD-5.0/NOPB WSON NGG 6 1000 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693SDX-3.3/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LP38693SDX-5.0/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP38691DTX-1.8/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LP38691DTX-2.5/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LP38691DTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LP38691DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LP38691QSD-1.8/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LP38691QSD-2.5/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LP38691QSD-3.3/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LP38691QSD-5.0/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LP38691QSDX-1.8/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38691QSDX-2.5/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38691QSDX-3.3/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38691QSDX-5.0/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38691SD-1.8/NOPB WSON NGG 6 1000 203.0 203.0 35.0
LP38691SD-2.5/NOPB WSON NGG 6 1000 203.0 203.0 35.0
LP38691SD-3.3/NOPB WSON NGG 6 1000 203.0 203.0 35.0
LP38691SD-5.0/NOPB WSON NGG 6 1000 203.0 203.0 35.0
LP38691SDX-1.8/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38691SDX-3.3/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38691SDX-5.0/NOPB WSON NGG 6 4500 346.0 346.0 35.0
LP38693MP-1.8/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP38693MP-2.5/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP38693MP-3.3 SOT-223 NDC 5 1000 367.0 367.0 35.0
LP38693MP-3.3/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP38693MP-5.0/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0
LP38693MPX-1.8/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0
LP38693MPX-2.5/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0
LP38693MPX-3.3/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0
LP38693MPX-5.0/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0
LP38693QSD-1.8/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LP38693QSD-2.5/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LP38693QSD-3.3/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LP38693QSD-5.0/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LP38693QSDX-1.8/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38693QSDX-2.5/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38693QSDX-3.3/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38693QSDX-5.0/NOPB WSON NGG 6 4500 367.0 367.0 35.0
LP38693SD-1.8 WSON NGG 6 1000 210.0 185.0 35.0
LP38693SD-1.8/NOPB WSON NGG 6 1000 203.0 203.0 35.0
LP38693SD-2.5/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LP38693SD-3.3 WSON NGG 6 1000 210.0 185.0 35.0
LP38693SD-3.3/NOPB WSON NGG 6 1000 203.0 203.0 35.0
LP38693SD-5.0/NOPB WSON NGG 6 1000 203.0 203.0 35.0
LP38693SDX-3.3/NOPB WSON NGG 6 4500 346.0 346.0 35.0
LP38693SDX-5.0/NOPB WSON NGG 6 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 4
MECHANICAL DATA
NDC0005A
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www.ti.com
PACKAGE OUTLINE
C
10.42
9.40
6.73
6.35
6.22
5.97 1.27
0.88
5.46
4.96
2.285
4.57
1.02
0.64
3X 0.88
0.64
2.55 MAX
0.88
0.46
8
8
1.14
0.89
0.60
0.46
0.17
0.51 MIN
4.32 MIN
(2.345)
(2.5)
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-252.
0.25 C A B
TOP & BOTTOM
PKG
1
2
3
OPTIONAL
SEATING PLANE
4
3
2
1
SCALE 1.500
A
B
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EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
(4.57)
2X (1.3) 2X (2.15) (5.7)
(5.5)
(2.285)(4.38)
(R0.05) TYP
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
SYMM
PKG
1
3
4
SEE SOLDER MASK
DETAIL
EXPOSED
METAL
METAL EDGE
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED) SOLDER MASK DETAIL
EXPOSED
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK DEFINED
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EXAMPLE STENCIL DESIGN
2X (2.15)
2X (1.3)
(4.57)
(4.38)
(1.32) TYP
(1.35) TYP
(0.26) (R0.05) TYP
16X (1.12)
16X (1.15)
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 8X
MECHANICAL DATA
NGG0006A
www.ti.com
SDE06A (Rev A)
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