RS3A thru RS3K
Vishay Semiconductors
formerly General Semiconductor
Document Number 88709 www.vishay.com
19-Apr-04 1
Surface Mount Fast Switching Rectifier
Reverse Voltage 50 to 800V
Forward Current 3.0A
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameters Symbols RS3A RS3B RS3D RS3G RS3J RS3K Units
Device marking code RA RB RD RG RJ RK
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 V
Maximum RMS voltage VRMS 35 70 140 280 420 500 V
Maximum DC blocking voltage VDC 50 100 200 400 600 800 V
Maximum average forward rectified current
at TL=75°C IF(AV) 3.0 A
Peak forward surge current
8.3ms single half sine-wave superimposed on IFSM 100 A
rated load (JEDEC Method) TL=75°C
Typical thermal resistance (1) RΘJA 50
RΘJL 15 °C/W
Operating junction and storage temperature range TJ, TSTG -55 to +150 °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Maximum instantaneous forward voltage at 2.5A VF1.3 V
Maximum DC reverse current TA=25°C 10
at rated DC blocking voltage TA=125°C IR250 µA
Maximum reverse recovery time
IF=0.5A, IR=1.0A, Irr=0.25A trr 150 250 500 ns
Typical junction capacitance at 4.0V, 1MHz CJ44 34 pF
Notes: (1) Thermal resistance from junction to ambient and from junction to lead mounted on
P.C.B. with 0.3 x 0.3” (8.0 x 8.0mm) copper pad area
Dimensions in inches
and (millimeters)
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• Low profile surface mount package
• Built-in strain relief
• Fast switching for high efficiency
• Easy pick and place
• Glass passivated chip junction
• High temperature soldering: 250°C/10 seconds at terminals
Mechanical Data
Case: JEDEC DO-214AB molded plastic over glass
passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.007 oz., 0.25 g
Packaging codes/options:
9/3.5K per 13" Reel (16mm Tape)
7/850 EA per 7" Reel (16mm Tape)
0.280 (7.11)
0.260 (6.60)
0.012 (0.305)
0.006 (0.152)
0.008
(0.203)
Max.
0.320 (8.13)
0.305 (7.75)
0.060 (1.52)
0.030 (0.76)
0.245 (6.22)
0.220 (5.59)
0.126 (3.20)
0.114 (2.90)
0.103 (2.62)
0.079 (2.06)
Cathode Band
DO-214AB (SMC)
0.185 MAX.
(4.69 MAX.)
0.126 MIN.
(3.20 MIN.)
0.060 MIN.
(1.52 MIN.)
0.320 REF
Mounting Pad Layout
RS3A thru RS3K
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com Document Number 88709
219-Apr-04
Lead Temperature (°C)
Fig. 1 – Forward Current
Derating Curve
Average Forward Current (A)
Fig. 3 – Typical Instantaneous
Forward Characteristics
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Current (µA)
Fig. 4 – Typical Reverse
Characteristics
Number of Cycles at 60 HZ
Fig. 2 – Maximum Non-Repetitive
Peak Forward Surge Current
Peak Forward Surge Current (A)
t, Pulse Duration, sec
Transient Thermal Impedance (°CW)
Fig. 6 – Typical Transient Thermal
Impedance
050 100 150 200
0
1.0
2.0
2.5
3.0
P.C.B. Mounted
0.3 x 0.3" (8.0 x 8.0 mm)
Copper Pad Areas
Resistive or Inductive Load
110 100
0
25
50
75
100
125
150
TL = 75°C
8.3ms Single Half Sine-Wave
(JEDEC Method)
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0.1
1
10
100
Pulse Width = 300µs
1% Duty Cycle
020 40 60 80 100
0.01
0.1
1
10
100
0.01 0.1 110 100
0.1
1
10
100
Mounted on
0.20 x 0.27" (5 x 7 mm)
Copper Pad Areas
Reverse Voltage (V)
Junction Capacitance (pF)
Fig. 5 – Typical Junction
Capacitance
1
100
110 100
10
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = - 40°C
TJ = 125°C
TJ = 75°C
RS3A-RS3G
RS3J-RS3K
Ratings and
Characteristic Curves (TA= 25°C unless otherwise noted)
