RS3A thru RS3K Vishay Semiconductors formerly General Semiconductor Surface Mount Fast Switching Rectifier DO-214AB (SMC) Reverse Voltage 50 to 800V Forward Current 3.0A Cathode Band 0.245 (6.22) 0.220 (5.59) 0.126 (3.20) 0.114 (2.90) Mounting Pad Layout 0.185 MAX. (4.69 MAX.) Dimensions in inches and (millimeters) 0.280 (7.11) 0.260 (6.60) 0.126 MIN. (3.20 MIN.) 0.012 (0.305) 0.006 (0.152) 0.103 (2.62) 0.079 (2.06) 0.060 MIN. (1.52 MIN.) 0.060 (1.52) 0.030 (0.76) 0.320 (8.13) 0.305 (7.75) 0.320 REF 0.008 (0.203) Max. Mechanical Data Features Case: JEDEC DO-214AB molded plastic over glass passivated chip Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.007 oz., 0.25 g Packaging codes/options: 9/3.5K per 13" Reel (16mm Tape) 7/850 EA per 7" Reel (16mm Tape) * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Low profile surface mount package * Built-in strain relief * Fast switching for high efficiency * Easy pick and place * Glass passivated chip junction * High temperature soldering: 250C/10 seconds at terminals Maximum Ratings & Thermal Characteristics Ratings at 25C ambient temperature unless otherwise specified. Parameters Symbols Device marking code RS3A RS3B RS3D RS3G RS3J RS3K Units RA RB RD RG RJ RK Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 V Maximum RMS voltage VRMS 35 70 140 280 420 500 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 V Maximum average forward rectified current at TL=75C IF(AV) 3.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) TL=75C IFSM 100 A RJA RJL 50 15 C/W TJ, TSTG -55 to +150 C Typical thermal resistance (1) Operating junction and storage temperature range Electrical Characteristics Ratings at 25C ambient temperature unless otherwise specified. Maximum instantaneous forward voltage at 2.5A VF 1.3 V IR 10 250 A Maximum reverse recovery time IF=0.5A, IR=1.0A, Irr=0.25A trr 150 Typical junction capacitance at 4.0V, 1MHz CJ 44 Maximum DC reverse current at rated DC blocking voltage Notes: TA=25C TA=125C 250 500 34 ns pF (1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.3 x 0.3" (8.0 x 8.0mm) copper pad area Document Number 88709 19-Apr-04 www.vishay.com 1 RS3A thru RS3K Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (TA = 25C unless otherwise noted) Fig. 1 - Forward Current Derating Curve Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current 150 3.0 Peak Forward Surge Current (A) Average Forward Current (A) Resistive or Inductive Load 2.5 2.0 1.0 P.C.B. Mounted 0.3 x 0.3" (8.0 x 8.0 mm) Copper Pad Areas 0 0 50 150 100 75 50 25 1 200 10 100 Lead Temperature (C) Number of Cycles at 60 HZ Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 4 - Typical Reverse Characteristics 100 Instantaneous Reverse Current (A) Instantaneous Forward Current (A) 125 0 100 100 TJ = 125C 10 TJ = 25C Pulse Width = 300s 1% Duty Cycle 1 TJ = - 40C 0.1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 TJ = 125C 10 TJ = 75C 1 TJ = 25C 0.1 0.01 2.0 20 0 40 60 80 Instantaneous Forward Voltage (V) Percent of Rated Peak Reverse Voltage (%) Fig. 5 - Typical Junction Capacitance Fig. 6 - Typical Transient Thermal Impedance 100 100 Transient Thermal Impedance (CW) 100 Junction Capacitance (pF) TL = 75C 8.3ms Single Half Sine-Wave (JEDEC Method) RS3A-RS3G RS3J-RS3K 10 1 1 10 Reverse Voltage (V) www.vishay.com 2 100 Mounted on 0.20 x 0.27" (5 x 7 mm) Copper Pad Areas 10 1 0.1 0.01 0.1 1 10 100 t, Pulse Duration, sec Document Number 88709 19-Apr-04