MC12026A 1.1 GHz Dual Modulus Prescaler Description The MC12026 is a high frequency, low voltage dual modulus prescaler used in phase-locked loop (PLL) applications. The MC12026A can be used with CMOS synthesizers requiring positive edges to trigger internal counters in a PLL to provide tuning signals up to 1.1 GHz in programmable frequency steps. A Divide Ratio Control (SW) permits selection of an 8/9 or 16/17 divide ratio as desired. The Modulus Control (MC) selects the proper divide number after SW has been biased to select the desired divide ratio. http://onsemi.com MARKING DIAGRAM 8 SOIC-8 D SUFFIX CASE 751 8 1 1 Features * * * * * * * * 1.1 GHz Toggle Frequency Supply Voltage 4.5 to 5.5 V Low Power 4.0 mA Typical Operating Temperature Range of -40 to 85C The MC12026 is Pin Compatible with the MC12022 Short Setup Time (tset ) 6.0 ns Typical @ 1.1 GHz Modulus Control Input Level is Compatible with Standard CMOS and TTL Pb-Free Packages are Available Table 1. FUNCTIONAL TABLE SW MC H 8 H L 9 L H 16 L L 17 = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package PIN CONNECTIONS IN VCC SW OUT Divide Ratio H A L Y W G 026A ALYW G 1 8 2 7 3 6 4 5 IN NC MC GND (Top View) 1. SW: H = VCC, L = Open. A logic L can also be applied by grounding this pin, but this is not recommended due to increased power consumption. 2. MC: H = 2.0 V to VCC, L = GND to 0.8 V. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Table 2. MAXIMUM RATINGS Characteristics Symbol Value Unit VCC -0.5 to 7.0 Vdc Operating Temperature Range TA -40 to 85 C Storage Temperature Range Tstg -65 to 150 C Modulus Control Input, Pin 6 MC -0.5 to 6.5 Vdc IO 10.0 mA Power Supply Voltage, Pin 2 Maximum Output Current, Pin 4 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. NOTE: ESD data available upon request. (c) Semiconductor Components Industries, LLC, 2006 January, 2006 - Rev. 8 1 Publication Order Number: MC12026A/D MC12026A Table 3. ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5; TA = -40 to 85C, unless otherwise noted.) Symbol Min Typ Max Unit ft 0.1 1.4 1.1 GHz Supply Current Output Unloaded (Pin 2) ICC - 4.0 5.3 mA Modulus Control Input High (MC) VIH1 2.0 - VCC V Modulus Control Input Low (MC) VIL1 GND - 0.8 V Divide Ratio Control Input High (SW) VIH2 VCC - 0.5 V VCC VCC + 0.5 V V Divide Ratio Control Input Low (SW) VIL2 OPEN OPEN OPEN - Output Voltage Swing (RL = 560 W; IO = 5.5 mA) (Note 3) (RL = 1.1 kW; IO = 2.9 mA) (Note 4) Vout 1.0 1.6 - Vpp Modulus Setup Time MC to Out (Note 5) tSET - 6.0 9.0 ns Input Voltage Sensitivity 100-250 MHz 250-1100 MHz Vin 400 100 - - 1000 1000 Characteristic Toggle Frequency (Sin Wave) 3. Divide Ratio of /8/9 at 1.1 GHz, CL = 8.0 pF. 4. Divide Ratio of /16/17 at 1.1 GHz, CL = 8.0 pF. 5. Assuming RL = 560 W at 1.1 GHz. In In D Q D Q C QB C QB D Q QB C M MC 1 D QB D QB C Q C Q 0 SW Out Figure 1. Logic Diagram (MC12026A) Prop. Delay In Out MC Setup MC Release Modulus setup time MC to out is the MC setup or MC release plus the prop delay. Figure 2. Modulus Setup Time http://onsemi.com 2 MC mVpp MC12026A VCC = 4.5 to 5.5V C3 SINE WAVE GENERATOR C1 VCC SW IN 50 W OUT C2 RL IN MC CL GND EXTERNAL COMPONENTS C1 = C2 = 1000 pF C3 = 0.1mF CL = 8pF (Including Scope and Jig Capacitance) RL = 560W (for /8/9 at 1.1GHz) MC INPUT Figure 3. AC Test Circuit +15.0 +1257.40 EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE +5.0 0 +397.64 +223.61 OPERATING WINDOW -5.0 -10.0 -15.0 -20.0 +125.74 +70.71 +39.76 +22.36 -25.0 +12.57 -30.0 +7.07 -35.0 +3.98 -40.0 +2.24 -45.0 +1.26 -50.0 0 200 400 600 800 1000 1200 1400 1600 +0.71 1800 FREQUENCY (MHz) Divide Ratio = 8; VCC = 5.0 V; TA = 25C Figure 4. Input Signal Amplitude versus Input Frequency 2000 1600 1200 800 400 0 200 400 600 800 1000 1200 1400 FREQUENCY (MHz) Figure 5. Output Amplitude versus Input Frequency http://onsemi.com 3 1600 0 1800 mVpp AMPLITUDE (dBm) +707.11 mVrms +10.0 MC12026A 5.88V 880mV 36.6ns 86.6ns (/8, 1.1 GHz Input Frequency, VCC = 5.0, TA = 25C, Output Loaded With 8.0pF) Figure 6. Typical Output Waveform http://onsemi.com 4 MC12026A 200 150 100 R MHz 50 0 -50 OHMS -100 -150 -200 -250 -300 -350 -400 -450 jX -500 -550 -600 -650 100 200 300 400 500 600 700 800 900 1000 1100 1200 Figure 7. Typical Input Impedance versus Input Frequency ORDERING INFORMATION Device MC12026AD Package Shipping SOIC-8 98 Units / Rail MC12026ADG SOIC-8 (Pb-Free) 98 Units / Rail MC12026ADR2 SOIC-8 2500 / Tape & Reel SOIC-8 (Pb-Free) 2500 / Tape & Reel MC12026ADR2G For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MC12026A PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE AG -X- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. A 8 5 S B 1 0.25 (0.010) M Y M 4 -Y- K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE -Z- 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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