Low-Profile Power Inductors HALOGEN HF Pb FREE SD6030 Series Applications SMD Device * Notebook computers, digital cameras * Gaming consoles, GPS receivers * High Power LED driver * Wireless notebook adapters * Battery power, TFT-LCD Bias supplies * Wireless handsets, handheld instruments Description Environmental Data * * * * * * * * * Storage temperature range: -40C to +125C * Operating temperature range: -40C to +125C (ambient plus self-temperature rise) * Solder reflow temperature: J-STD-020D compliant 125C maximum total temperature operation Low profile surface mount inductors 6.0 x 6.0 x 3.0mm maximum surface mount package Ferrite core material Shielded drum core reduces EMI Inductance range from 2.7H to 660H Current range from 0.16 to 4.08 Amps Frequency range up to 1MHz Packaging * Supplied in tape and reel packaging, 2600 per 13" diameter reel Product Specifications Part Number5 SD6030-2R7-R SD6030-3R3-R SD6030-4R2-R SD6030-5R0-R SD6030-5R8-R SD6030-7R8-R SD6030-100-R SD6030-120-R SD6030-150-R SD6030-180-R SD6030-220-R SD6030-270-R SD6030-330-R SD6030-360-R SD6030-440-R SD6030-520-R SD6030-680-R SD6030-820-R SD6030-101-R SD6030-121-R SD6030-151-R SD6030-181-R SD6030-221-R SD6030-271-R SD6030-331-R SD6030-391-R SD6030-471-R SD6030-561-R SD6030-681-R OCL1 H 30% 2.7 3.3 4.1 4.9 5.8 7.8 9.3 11.3 14.1 17.1 20.4 26.0 32.4 34.4 44.0 52.0 65.6 81.6 94.4 110.1 144.5 175.7 210.9 264.2 313.5 373.7 460.0 546.2 659.4 Irms2 (Amps) 4.08 3.54 3.11 2.81 2.58 2.38 2.15 1.99 1.71 1.65 1.57 1.31 1.26 1.19 1.10 0.99 0.92 0.80 0.76 0.70 0.64 0.55 0.50 0.44 0.38 0.35 0.33 0.30 0.27 Isat3.(Amps) 2.60 2.40 2.20 1.90 1.80 1.60 1.30 1.20 1.10 1.00 0.90 0.85 0.75 0.70 0.62 0.58 0.52 0.46 0.42 0.40 0.35 0.32 0.30 0.27 0.25 0.22 0.20 0.18 0.16 1) Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc. 2 Irms: DC current for an approximate T of 40C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125C under worst case operating conditions verified in the end application. Typ. DCR m @ 20C 13 18 23 28 33 39 48 56 76 82 90 130 140 157 185 226 263 343 385 517 608 817 1000 1300 1733 2083 2250 2767 3458 Max DCR m @ 20C 18 24 31 38 45 53 65 76 103 110 122 175 189 212 250 305 355 463 520 620 730 980 1200 1560 2080 2500 2700 3320 4150 4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*I, Bp-p (mT), K: (K factor from table), L: (Inductance in H), I (Peak to peak ripple current in Amps). 5 Part Number Definition: SD6030-xxx-R SD6030 = Product code and size; -xxx = Inductance value in H; R = decimal point; If no R is present, third character = # of zeros. -R suffix = RoHS compliant 3 Isat Amps peak for 35% rolloff (@25C) 1111 BU-SB111167 K-factor4 34 30 27 24 22 19 17 16 14 13 12 11 9.3 8.7 7.9 7.2 6.5 5.9 5.6 5.6 5.0 4.5 4.0 3.6 3.3 3.0 2.8 2.5 2.3 Page 1 of 4 Data Sheet: 4314 Dimensions - mm Part Marking: Coiltronics logo, xxx = Inductance value in uH. R = decimal point. If no R is present third character = # of zeros, wwlly or wwllyy = Date code, R = Revision level. Packaging Information - mm Parts packaged on 13" diameter reel, 2600 parts per reel. Core Loss 500kHz 1MHz 300kHz 1 200kHz 100kHz Core Loss (W) 0.1 0.01 0.001 0.0001 1 10 100 1000 Bp-p (mT) 1111 BU-SB111167 Page 2 of 4 Data Sheet: 4314 Temperature Rise vs. Loss Inductance Characteristics -40C +25C +85C 1111 BU-SB111167 Page 3 of 4 Data Sheet: 4314 Solder Reflow Profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Package Thickness <2.5mm _2.5mm > TL Preheat A Temperature T smax Table 1 - Standard SnPb Solder (T c) t Volume mm3 <350 235C 220C Volume mm3 _350 > 220C 220C Table 2 - Lead (Pb) Free Solder (T c) Tsmin 25C ts Package Thickness <1.6mm 1.6 - 2.5mm >2.5mm Time 25C to Peak Volume mm3 <350 260C 260C 250C Volume mm3 350 - 2000 260C 250C 245C Volume mm3 >2000 260C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak * Temperature min. (Tsmin) Standard SnPb Solder 100C Lead (Pb) Free Solder 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to Peak Temperature 60-120 Seconds 60-120 Seconds 3C/ Second Max. 3C/ Second Max. 183C 60-150 Seconds 217C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6C/ Second Max. 6C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire * LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. (c) 2011 Cooper Bussmann w w w. c o o p e r bu s s m a n n . c o m 1111 BU-SB111167 Page 4 of 4 Data Sheet: 4314