Applications
• Notebook computers, digital cameras • Gaming consoles, GPS receivers
• High Power LED driver • Wireless notebook adapters
• Battery power, TFT-LCD Bias supplies • Wireless handsets, handheld
instruments
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 2600 per 13” diameter reel
Low-Profile Power Inductors
SD6030 Series
1111 BU-SB111167 Page 1 of 4 Data Sheet: 4314
SMD Device
Description
• 125°C maximum total temperature operation
• Low profile surface mount inductors
• 6.0 x 6.0 x 3.0mm maximum surface mount package
• Ferrite core material
• Shielded drum core reduces EMI
• Inductance range from 2.7µH to 660µH
• Current range from 0.16 to 4.08 Amps
• Frequency range up to 1MHz
Pb
HALOGEN
HF
FREE
Product Specifications
Part Number5OCL1 µH ± 30% Irms2(Amps) Isat3.(Amps) Typ. DCR mΩ @ 20°C Max DCR mΩ@ 20°C K-factor4
SD6030-2R7-R 2.7 4.08 2.60 13 18 34
SD6030-3R3-R 3.3 3.54 2.40 18 24 30
SD6030-4R2-R 4.1 3.11 2.20 23 31 27
SD6030-5R0-R 4.9 2.81 1.90 28 38 24
SD6030-5R8-R 5.8 2.58 1.80 33 45 22
SD6030-7R8-R 7.8 2.38 1.60 39 53 19
SD6030-100-R 9.3 2.15 1.30 48 65 17
SD6030-120-R 11.3 1.99 1.20 56 76 16
SD6030-150-R 14.1 1.71 1.10 76 103 14
SD6030-180-R 17.1 1.65 1.00 82 110 13
SD6030-220-R 20.4 1.57 0.90 90 122 12
SD6030-270-R 26.0 1.31 0.85 130 175 11
SD6030-330-R 32.4 1.26 0.75 140 189 9.3
SD6030-360-R 34.4 1.19 0.70 157 212 8.7
SD6030-440-R 44.0 1.10 0.62 185 250 7.9
SD6030-520-R 52.0 0.99 0.58 226 305 7.2
SD6030-680-R 65.6 0.92 0.52 263 355 6.5
SD6030-820-R 81.6 0.80 0.46 343 463 5.9
SD6030-101-R 94.4 0.76 0.42 385 520 5.6
SD6030-121-R 110.1 0.70 0.40 517 620 5.6
SD6030-151-R 144.5 0.64 0.35 608 730 5.0
SD6030-181-R 175.7 0.55 0.32 817 980 4.5
SD6030-221-R 210.9 0.50 0.30 1000 1200 4.0
SD6030-271-R 264.2 0.44 0.27 1300 1560 3.6
SD6030-331-R 313.5 0.38 0.25 1733 2080 3.3
SD6030-391-R 373.7 0.35 0.22 2083 2500 3.0
SD6030-471-R 460.0 0.33 0.20 2250 2700 2.8
SD6030-561-R 546.2 0.30 0.18 2767 3320 2.5
SD6030-681-R 659.4 0.27 0.16 3458 4150 2.3
1) Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc.
2I
rms: DC current for an approximate ΔT of 40°C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions veri-
fied in the end application.
3I
sat Amps peak for 35% rolloff (@25°C)
4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*ΔI, Bp-p (mT), K:
(K factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps).
5 Part Number Definition: SD6030-xxx-R
SD6030 = Product code and size; -xxx = Inductance value in μH;
R = decimal point; If no R is present, third character = # of zeros.
-R suffix = RoHS compliant
Dimensions - mm
Packaging Information - mm
Core Loss
1111 BU-SB111167 Page 2 of 4 Data Sheet: 4314
0.0001
0.001
0.01
0.1
1
1 10 100 1000
Core Loss (W)
Bp-p (mT)
1MHz
500kHz
300kHz
200kHz
100kHz
Parts packaged on 13" diameter reel, 2600 parts per reel.
Part Marking: Coiltronics logo, xxx = Inductance value in uH. R = decimal point. If no R is present third character = # of zeros, wwlly or wwllyy = Date code, R = Revision level.
1111 BU-SB111167 Page 3 of 4 Data Sheet: 4314
Inductance Characteristics
Temperature Rise vs. Loss
-40°C
+25°C
+85°C
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
© 2011 Cooper Bussmann
www.cooperbussmann.com
1111 BU-SB111167 Page 4 of 4 Data Sheet: 4314
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume
Packagemm
3mm3
Thickness <350 >
_350
<2.5mm 235°C220°C
>
_2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Packagemm
3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
Average ramp up rate Tsmaxto Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C217°C
Time at liquidous (tL)60-150 Seconds60-150 Seconds
Peak package body temperature (TP)*Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tpto Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
