HCC/HCF40107B
September 1988
DUAL 2-INPUT NAND BUFFER/DRIVER
.32 TIMES STANDARD B-SERIES OUTPUT
CURRENTDRIVE SINKING CAPABILITY
136mATYP. @ VDD = 10V, VDS =1V
.QUIESCENT CURRENT SPECIFIED AT 20V
FOR HCC DEVICE
.5V, 10V, AND 15VPARAMETRIC RATINGS
.INPUT CURRENTOF100nA AT 18V AND 25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENTCURRENT
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVE STANDARD N°. 13A, STANDARD
SPECIFICATIONS FOR DESCRIPTIONOF ”B”
SERIESCMOS DEVICES”
DESCRIPTION
The HCC40107B (extended temperature range)
andHCF40107B (intermediate temperature range)
are monolithic integrated circuits, available in 14-
lead dual in-line ceramic package 8-lead minidip
plastic package and 8-lead plastic micropackage.
The HCC/HCF40107B is a dual 2-input NAND buf-
fer/driver containing twoindependent 2-input NAND
buffers with open-drain single n-channel transistor
outputs. This device features a wired-OR capability
and high output sink current capability (136mA typ.
at VDD = 10V,VDS = 1V).
EY
(Plastic Package) F
(Ceramic Frit Seal Package)
M1
(Micro Package) C1
(Plastic Chip Carrier)
ORDER CODES
HCC40107BF HCF40107BM1
HCF40107BEY HCF40107BC1
PIN CONNECTIONS
1/14
Stresses above those listed under ”Absolute Maximum Ratings” may causepermanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability.
* All voltages values are referred to VSS pin voltage.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
VDD Supply Voltage : HCC Types
HCF Types 3to18
3to15 V
V
V
IInput Voltage 0 to VDD V
Top Operating Temperature : HCC Types
HCF Types 55 to + 125
–40to+85 °C
°C
FUNCTIONAL DIAGRAM
Symbol Parameter Value Unit
VDD*Supply Voltage : HCC types
HCF types 0.5 to + 20
0.5 to + 18 V
ViInput Voltage 0.5 to VDD + 0.5 V
IIDC Input Current (any one input) ±10 mA
Ptot Total Power Dissipation (per package)
Dissipation per Output Transistor
for Top = full package-temperature Range
200
100 mW
Top Operating Temperature : HCC types
HCF types 55 to + 125
–40to+85 °C
T
stg Storage Temperature 65 to + 150 °C
ABSOLUTE MAXIMUM RATINGS
HCC/HCF40107B
2/14
SCHEMATIC DIAGRAM AND TRUTH TABLE
* Requires external and pull-up resis-
tor (RL)toV
DD.
# Without pull-up resistor (3-state).
AB C
0 0 1* Z#
1 0 1* Z#
0 1 1* Z#
110
*T
Low =–55°C for HCC device ; 40°C for HCF device.
*T
High = + 125°C for HCC device ; + 85°C for HCF device.
The Noise Margin, full package temperature range, RLto VDD =10k: 1V min with VDD = 5V, 2V min with VDD = 10V, 2.5V min with VDD = 15V.
** Measured with external pull-up resistor, RL= 10kto VDD.
*** Forced output disabled.
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions Value
VIVO|IO|V
DD TLow*25°CT
High*
Symbol Parameter (V) (V) (µA) (V) Min. Max. Min. Typ. Max. Min. Max.
Unit
ILQuiescent
Current HCC
Types
0/ 5 5 1 0.02 1 30
µA
0/10 10 2 0.02 2 60
0/15 15 4 0.02 4 120
0/20 20 20 0.04 20 600
HCF
Types
0/ 5 5 4 0.02 4 30
0/10 10 8 0.02 8 60
0/15 15 16 0.02 16 120
VIH** Input High
Voltage 0.5/4.5 < 1 5 3.5 3.5 3.5 V
1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
VIL** Input Low
Voltage 4.5 < 1 5 1.5 1.5 1.5 V
9<110 3 3 3
13.5 < 1 15 4 4 4
HCC/HCF40107B
3/14
STATIC ELECTRICAL CHARACTERISTICS (continued)
Test Conditions Value
VIVO|IO|V
DD TLow*25°CT
High*
Symbol Parameter (V) (V) (µA) (V) Min. Max. Min. Typ. Max. Min. Max.
Unit
IOL Output
Sink
Current HCC
Types
5 0.4 5 21 16 32 12
mA
51 544 3068 25
10 0.5 10 49 37 74 28
10 1 10 89 68 136 51
15 0.5 15 66 50 100 38
HCF
Types
5 0.4 5 17 13.6 32 12
5 1 5 35.7 25.5 68 22
10 0.5 10 39.1 31.4 74 27
10 1 10 72.2 57.8 136 51
15 0.5 15 53.5 42.5 100 37
IOH Output Drive
Current No Internal Pull-up Device mA
IIH,I
IL Input
Leakage
Current
HCC
Types 0/18
Any Input 18 ±0.1 ±10–5 ± 0. 1 ±1µA
HCF
Types 0/15 15 ±0.3 ±10–5 ±0.3 ± 1
IOH,IOL
*** 3-State
Output
Leakage
Current
HCC
Types 0/18 18 18 2 ±10–4 220
µA
HCF
Types 0/15 15 15 2 ±10–4 220
C
I
Input Capacitance Any Input 5 7.5 pF
COOutput
Capacitance Any Output 30 pF
*T
Low =–55°C for HCC device ; 40°C for HCF device.
*T
High = + 125°C for HCC device ; + 85°C for HCF device.
The Noise Margin, full package temperature range, RLto VDD =10k: 1V min with VDD = 5V, 2V min with VDD = 10V, 2.5V min with VDD = 15V.
** Measured with external pull-up resistor, RL= 10kto VDD.
*** Forced output disabled.
HCC/HCF40107B
4/14
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =25°C, CL= 50pF, typical temperature
coefficient for all VDD values is 0.3%/°C, all inputrise and fall time = 20ns)
Value
Symbol Parameter Test Conditions
VDD (V) Min. Typ. Max. Unit
tPHL,
tPLH
Propagation Delay Time
High to Low RL* = 1205 100 200 ns
10 45 90
15 30 60
Low to High RL* = 1205 100 200 ns
10 60 120
15 50 100
tTHL,
tTLH Transition Time
High to Low RL* = 1205 50 100 ns
10 20 40
15 10 20
Low to High RL* = 1205 50 100 ns
10 35 70
15 25 50
*R
Lis external pull-up resistor to VDD.
Output Low (sink) Current Characteristics. Typical Propagation Delay Time vs. Load Capacit-
ance.
HCC/HCF40107B
5/14
Typical Transition Time vs. Load Capacitance. TypicalDynamic Power Dissipation vs. Input Fre-
quency.
TYPICAL APPLICATIONS
The bar on the output line of this logic diagram indicates that the output is open drain as is shown in the pre-
viousschematic diagram and truthtable.
LogicDiagram of The HCC/HCF40107B nand
Buffer. A 2.2-wattIncandescent Lamp-driver Circuit.
Solenoid Driver Circuit.
Interface of 40107B with Triac, with COS/MOS
Component and Triac isolated.
HCC/HCF40107B
6/14
Direct Dc Driver Interface of 40107B with a Triac.Line-driver Circuit.
Multiplexed LedCircuit.
TYPICAL APPLICATIONS (continued)
HCC/HCF40107B
7/14
TYPICAL APPLICATIONS (continued) Led Driver Circuit.
Motor-controller Circuit.
A B Motor Function
O
I
I
O
I
O
O
I
I
I
OFF
COUNTER CLOCKWISE
AS PREVIOUS STATE
CLOCKWISE
AS PREVIOUS STATE
INHIBIT ENABLE OUTPUT
0
1
0
0
0
0
1
1
OFF
OFF
OFF
ON
TEST CIRCUITS
Quiescent Device Current. InputVoltage.
HCC/HCF40107B
8/14
TEST CIRCUITS (continued)
Dynamic Power Dissipation.
Dynamic Power Dissipation.
HCC/HCF40107B
9/14
Minidip (0.4) MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 3.3 0.130
a1 0.7 0.028
B 1.39 1.65 0.055 0.065
B1 0.91 1.04 0.036 0.041
b 0.5 0.020
b1 0.38 0.5 0.015 0.020
D 9.8 0.386
E 8.8 0.346
e 2.54 0.100
e3 7.62 0.300
e4 7.62 0.300
F 7.1 0.280
I 4.8 0.189
L 3.3 0.130
Z 0.44 1.6 0.017 0.063
P001F
HCC/HCF40107B
10/14
Ceramic DIP14/1 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7.0 0.276
D 3.3 0.130
E 0.38 0.015
e3 15.24 0.600
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 1.52 2.54 0.060 0.100
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
P053C
HCC/HCF40107B
11/14
SO8 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.25 0.003 0.009
a2 1.65 0.064
a3 0.65 0.85 0.025 0.033
b 0.35 0.48 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.019
c1 45°(typ.)
D 4.8 5.0 0.188 0.196
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 3.81 0.150
F 3.8 4.0 0.14 0.157
L 0.4 1.27 0.015 0.050
M 0.6 0.023
S8°(max.)
P013M
HCC/HCF40107B
12/14
PLCC20 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
P027A
HCC/HCF40107B
13/14
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability forthe
consequences of use of such information nor for any infringementof patents or other rights of third partieswhich may results from its use. No
license is granted by implication or otherwiseunder any patent or patent rights ofSGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorizedforuse ascritical componentsin life supportdevices orsystems withoutexpress
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics- All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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HCC/HCF40107B
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