STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-93187
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
L SHEET 3
DSCC FORM 2234
APR 97
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All
levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and
E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class Device performance documentation
K Highest reliability class available. This level is intended for use in space
applications.
H Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: 1/
Outline letter Descriptive designator Terminals Package style
M See figure 1 66 Hex-in-line, single cavity, without standoffs
N See figure 1 66 Hex-in-line, single cavity, without standoffs
T See figure 1 66 Hex-in-line, single cavity, with standoffs
U See figure 1 66 Hex-in-line, single cavity, without standoffs
X See figure 1 66 Hex-in-line, single cavity, with standoffs
Y See figure 1 66 Hex-in-line, single cavity, without standoffs
4 See figure 1 66 Hex-in-line, single cavity, with standoffs
5 See figure 1 66 Hex-in-line, single cavity, with standoffs
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 2/
Supply voltage range (VCC)........................................................ -0.5 V dc to +7.0 V dc
Signal voltage range (any pin) ................................................... -0.5 V dc to +7.0 V dc
Power dissipation (PD):
Device types 01 through 08, and 12 through 15..................... 2.2 W
Device types 09, 10, 11, 16, 17, and 18 ................................ 4.4 W
Thermal resistance junction-to-case (θJC) ................................. 6.6°C/W
Storage temperature range........................................................ -65°C to +150°C
Lead temperature (soldering, 10 seconds)................................. +300°C
1/ Additional case outlines are available on Standard Microcircuit Drawing 5962-95595.
2/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.