TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 Gort Road Business Park, Ennis, Co. Clare, Ireland
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
Website: http: //www.microsemi.com
NPN SILICON
HIGH-FREQUENCY TRANSISTOR
Qualified per MIL-PRF-19500/398
T4-LDS-0175 Rev. 1 (101096) Page 1 of 4
DEVICES LEVELS
2N3866 2N3866UB JAN
2N3866A 2N3866AUB JANTX
JANTXV
JANS
ABSOLUTE MAXIMUM RATI NG S (TC = +25°C unless otherwise noted)
Parameters / Test Conditions Symbol Value Unit
Collector-Emitter Voltage VCEO 30 Vdc
Collector-Base Voltage VCBO 60 Vdc
Emitter-Base Voltage VEBO 305 Vdc
Collector Current IC 400 mAdc
Total Power Dissipation
@ TA = +25°C
2N3866, A
2N3866UB / AUB PT
1.0
0.5 W
Operating & Storage Junction Temperature Range Tj, Tstg -65 to +200 °C
Thermal Resistance, Junction-to-Case RθJC 60.0 °C/W
NOTE:
1. Derate linearly 5.71mW/°C (2N3866, 2N3866A) and 3.08mW/°C (2N3866UB /
2N3866AUB) above TA > +25°C
2. TA = room ambient as defined in the general requirements of MIL-PRF-19500
3. PT = 2.9W at TC = +25°C, derate at 16.6mW/°C above TC > +25°C
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted)
Parameters / Test Conditions Symbol Min. Max. Unit
OFF CHARACTERTICS
Collector-Emitter Breakdown Voltage
IC = 5.0mAdc V(BR)CEO 30 Vdc
Collector-Base Breakdown Voltage
IC = 100µAdc V(BR)CBO 60 Vdc
Emitter-Base Breakdown Voltage
IE = 100µAdc V(BR)EBO 3.5 Vdc
Collector-Emitter Cutoff Current
VCE = 28Vdc ICEO 20 μAdc
Collector-Emitter Cutoff Current
VCE = 55Vdc ICES1 100 μAdc
TO-39 (TO-205AD)
2N3866, 2N3866A
UB Package
2N3866UB, 2N3866AUB
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 Gort Road Business Park, Ennis, Co. Clare, Ireland
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
Website: http: //www.microsemi.com
T4-LDS-0175 Rev. 1 (101096) Page 2 of 4
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted)
Parameters / Test Conditions Symbol Min. Max. Unit
ON CHARACTERISTICS (3)
Forward-Current Transfer Ratio
hFE
IC = 100μAdc, VCE = 5.0Vdc 2N3866, 2N3866UB 15 200
2N3866A, 2N3866AUB 25 200
IC = 360mAdc, VCE = 5.0Vdc 2N3866, 2N3866UB 5
2N3866A, 2N3866AUB 8
Collector-Emitter Saturation Voltage
VCE(sat)
Vdc
IC = 100mAdc, IB = 10mAdc 1.0
Collector-Emitter Cutoff Current – High Temperature Operation
ICES2
mAdc
VCE = 55Vdc
TA = +150°C
2.0
Forward Current Transfer Ratio – Low Temperature Operation
HFE3
VCE = 5.0Vdc
IC = 50mAdc, TA = -55°C
2N3866, 2N3866UB 7
2N3866A, 2N3866AUB 12
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions Symbol Min. Max. Unit
Magnitude of Common Emitter Small–Signal Short-Circuit Forward
Current Transfer Ratio |hfe|
IC = 50mAdc, VCE = 15Vdc, f = 100MHz 2N3866, 2N3866UB
2N3866A, 2N3866AUB
2.5
4.0
8.0
7.5
Output Capacitance
Cobo 3.5 pF
VCB = 28Vdc, IE = 0, 100kHz ≤ f ≤ 1.0MHz
POWER OUTPUT CHARACTERISTICS
Parameters / Test Conditions Symbol Min. Max. Unit
Power Output
VCC = 28Vdc; Pin = 0.15W; f = 400MHz *
VCC = 28Vdc; Pin = 0.075W; f = 400MHz *
P1out
P2out
1.0
0.5
2.0
W
Collector Efficiency
VCC = 28Vdc; Pin = 0.15W; f = 400MHz
VCC = 28Vdc; Pin = 0.075W; f = 400MHz
* See Figure 4 on /398
n1
n2
45
40 %
Clamp Inductive
Collector-Emitter Breakdown Voltage
VBE = 1.5Vdc
IC = 40mAdc
V(BR)CEX 55 Vdc
(4) Pulse Test: Pulse Width = 300μs, Duty Cycle ≤ 2.0%.
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 Gort Road Business Park, Ennis, Co. Clare, Ireland
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
Website: http: //www.microsemi.com
T4-LDS-0175 Rev. 1 (101096) Page 3 of 4
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Beyond r (radius) maximum, TW shall be held for a minimum length of .011 (0.28 mm).
4. Dimension TL measured from maximum HD.
5. Body contour optional within zone defined by HD, CD, and Q.
6. CD shall not vary more than .010 inch (0.25 mm) in zone P. This zone is controlled for automatic handling.
7. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18
mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. The device may be
measured by direct methods or by gauging procedure.
8. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is
uncontrolled in and beyond LL minimum.
9. All three leads.
10. The collector shall be internally connected to the case.
11. Dimension r (radius) applies to both inside corners of tab.
12. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
13. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
FIGURE 1. Physical dimensions (TO-39)
PACKAGE DIMENSIONS
Dimensions
Symbol Inches Millimeters Notes
Min Max Min Max
CD .305 .335 7.75 8.51 6
CH .240 .260 6.10 6.60
HD .335 .370 8.51 9.40
LC .200 TP 5.08 TP 7
LD .016 .021 0.41 0.53 8, 9
LL .500 .750 12.70 19.05 8, 9
LU .016 .019 0.41 0.48 8, 9
L1 .050 1.27 8, 9
L2 .250 6.35 8, 9
P .100 2.54 7
Q .030 0.76 5
TL .029 .045 0.74 1.14 3, 4
TW .028 .034 0.71 0.86 3
r .010 0.25 10
α 45° TP 7
TO-39
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 Gort Road Business Park, Ennis, Co. Clare, Ireland
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
Website: http: //www.microsemi.com
T4-LDS-0175 Rev. 1 (101096) Page 4 of 4
Dimensions
Letter Inches Millimeters Note
Min Max Min Max
BH .046 .056 1.17 1.42
BL .115 .128 2.92 3.25
BW .085 .108 2.16 2.74
CL .128 3.25
CW .108 2.74
LL1 .022 .038 0.56 0.96
LL2 .017 .035 0.43 0.89
LS1 .036 .040 0.91 1.02
LS2 .071 .079 1.81 2.01
LW .016 .024 0.41 0.61
r .008 .203
r1 .012 .305
r2 .022 .559
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Hatched areas on package denote metallized areas.
4. Lid material: Kovar.
5. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid.
6. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
FIGURE 3. Physical dimensions, surface mount (UB).
PACKAGE DIMENSIONS
