TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 TELECOMMUNICATION SYSTEM 100 A 10/1000 OVERVOLTAGE PROTECTORS 8 kV 10/700, 200 A 5/310 ITU-T K.20/21 rating Ion-Implanted Breakdown Region Precise and Stable Voltage Low Voltage Overshoot under Surge DEVICE `4070 `4080 `4095 `4115 `4125 `4145 `4165 `4180 `4200 `4220 `4240 `4250 `4265 `4290 `4300 `4350 `4395 `4400 VDRM V(BO) V 58 65 75 90 100 120 135 145 155 160 180 190 200 220 230 275 320 300 V 70 80 95 115 125 145 165 180 200 220 240 250 265 290 300 350 395 400 SMBJ PACKAGE (TOP VIEW) R(B) 1 2 T(A) MDXXBG device symbol T SD4XAA R Terminals T and R correspond to the alternative line designators of A and B Low Differential Capacitance . . . 67 pF max. ..................UL Recognized Component Rated for International Surge Wave Shapes WAVE SHAPE STANDARD 2/10 s 8/20 s 10/160 s 10/700 s 10/560 s 10/1000 s GR-1089-CORE IEC 61000-4-5 FCC Part 68 ITU-T K.20/21 FCC Part 68 GR-1089-CORE ITSP A 500 300 250 200 160 100 description These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by a.c. power system or lightning flash disturbances which are induced or conducted on to the telephone line. A single device provides 2-point protection and is typically used for the protection of 2-wire telecommunication equipment (e.g. between the Ring and Tip wires for telephones and modems). Combinations of devices can be used for multi-point protection (e.g. 3-point protection between Ring, Tip and Ground). The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup as the diverted current subsides. HOW TO ORDER DEVICE PACKAGE CARRIER ORDER AS TISP4xxxH3BJ BJ (J-Bend DO-214AA/SMB) Embossed Tape Reeled TISP4xxxH3BJR Insert xxx value corresponding to protection voltages of 070, 080, 095, 115 etcetera. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessary include testing of all parameters. Copyright (c) 2000 Texas Instruments Incorporated Designed and manufactured by Power Innovations, A Bourns Company, under private label for Texas Instruments. 1 TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 This TISP4xxxH3BJ range consists of eighteen voltage variants to meet various maximum system voltage levels (58 V to 320 V). They are guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. These high (H) current protection devices are in a plastic package SMBJ (JEDEC DO-214AA with J-bend leads) and supplied in embossed carrier reel pack. For alternative voltage and holding current values, consult the factory. For lower rated impulse currents in the SMB package, the 50 A 10/1000 TISP4xxxM3BJ series is available. absolute maximum ratings, TA = 25 C (unless otherwise noted) RATING Repetitive peak off-state voltage, (see Note 1) SYMBOL `4070 `4080 `4095 `4115 `4125 `4145 `4165 `4180 `4200 `4220 `4240 `4250 `4265 `4290 `4300 `4350 `4395 `4400 Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4) 2/10 s (GR-1089-CORE, 2/10 s voltage wave shape) 8/20 s (IEC 61000-4-5, 1.2/50 s voltage, 8/20 current combination wave generator) 10/160 s (FCC Part 68, 10/160 s voltage wave shape) 5/200 s (VDE 0433, 10/700 s voltage wave shape) 0.2/310 s (I3124, 0.5/700 s voltage wave shape) 5/310 s (ITU-T K.20/21, 10/700 s voltage wave shape) 5/310 s (FTZ R12, 10/700 s voltage wave shape) 10/560 s (FCC Part 68, 10/560 s voltage wave shape) 10/1000 s (GR-1089-CORE, 10/1000 s voltage wave shape) Non-repetitive peak on-state current (see Notes 2, 3 and 5) 20 ms (50 Hz) full sine wave 16.7 ms (60 Hz) full sine wave 1000 s 50 Hz/60 Hz a.c. Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 200 A Junction temperature Storage temperature range NOTES: 1. 2. 3. 4. 5. 2 VDRM ITSP VALUE 58 65 75 90 100 120 135 145 155 160 180 190 200 220 230 275 320 300 500 300 250 220 200 200 200 160 100 UNIT V A diT/dt TJ 55 60 2.1 400 -40 to +150 A/s C Tstg -65 to +150 C ITSM A See Applications Information and Figure 10 for voltage values at lower temperatures. Initially the TISP4xxxH3BJ must be in thermal equilibrium with TJ = 25 C. The surge may be repeated after the TISP4xxxH3BJ returns to its initial conditions. See Applications Information and Figure 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring track widths. See Figure 8 for the current ratings at other durations. Derate current values at -0.61 %/C for ambient temperatures above 25 C TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 electrical characteristics, TA = 25 C (unless otherwise noted) IDRM PARAMETER Repetitive peak offstate current TEST CONDITIONS VD = VDRM V(BO) Breakover voltage dv/dt = 250 V/ms, RSOURCE = 300 V(BO) Impulse breakover voltage dv/dt 1000 V/s, Linear voltage ramp, Maximum ramp value = 500 V di/dt = 20 A/s, Linear current ramp, Maximum ramp value = 10 A I(BO) VT IH Breakover current On-state voltage Holding current dv/dt = 250 V/ms, RSOURCE = 300 IT = 5 A, tW = 100 s IT = 5 A, di/dt = +/-30 mA/ms dv/dt ID Critical rate of rise of off-state voltage Off-state current MIN TA = 25 C TA = 85 C `4070 `4080 `4095 `4115 `4125 `4145 `4165 `4180 `4200 `4220 `4240 `4250 `4265 `4290 `4300 `4350 `4395 `4400 `4070 `4080 `4095 `4115 `4125 `4145 `4165 `4180 `4200 `4220 `4240 `4250 `4265 `4290 `4300 `4350 `4395 `4400 0.15 0.15 Linear voltage ramp, Maximum ramp value < 0.85VDRM VD = 50 V TYP MAX 5 10 70 80 95 115 125 145 165 180 200 220 240 250 265 290 300 350 395 400 78 88 103 124 134 154 174 189 210 230 250 261 276 301 311 362 408 413 0.6 3 0.6 5 TA = 85 C UNIT A V V A V A kV/s 10 A 3 TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 electrical characteristics, TA = 25 C (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS f = 100 kHz, Vd = 1 V rms, VD = 0, f = 100 kHz, Vd = 1 V rms, VD = -1 V Coff Off-state capacitance f = 100 kHz, Vd = 1 V rms, VD = -2 V f = 100 kHz, Vd = 1 V rms, VD = -50 V f = 100 kHz, Vd = 1 V rms, VD = -100 V (see Note 6) NOTE MIN `4070 thru `4115 `4125 thru `4220 `4240 thru `4400 `4070 thru `4115 `4125 thru `4220 `4240 thru `4400 `4070 thru `4115 `4125 thru `4220 `4240 thru `4400 `4070 thru `4115 `4125 thru `4220 `4240 thru `4400 `4125 thru `4220 `4240 thru `4400 TYP 145 80 70 130 71 60 120 65 55 62 30 24 28 22 MAX 170 90 84 150 79 67 140 74 62 73 35 28 33 26 UNIT TYP MAX UNIT pF 6: To avoid possible voltage clipping, the `4125 is tested with VD = -98 V. thermal characteristics PARAMETER RJA NOTE 4 Junction to free air thermal resistance TEST CONDITIONS MIN EIA/JESD51-3 PCB, IT = ITSM(1000), TA = 25 C, (see Note 7) 265 mm x 210 mm populated line card, 4-layer PCB, IT = ITSM(1000), TA = 25 C 113 C/W 50 7: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths. TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 PARAMETER MEASUREMENT INFORMATION +i Quadrant I ITSP Switching Characteristic ITSM IT V(BO) VT I(BO) IH VDRM -v IDRM ID VD ID IDRM VD VDRM +v IH I(BO) V(BO) VT IT ITSM Quadrant III Switching Characteristic ITSP -i PMXXAAB Figure 1. VOLTAGE-CURRENT CHARACTERISTIC FOR T AND R TERMINALS ALL MEASUREMENTS ARE REFERENCED TO THE R TERMINAL 5 TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 TYPICAL CHARACTERISTICS OFF-STATE CURRENT vs JUNCTION TEMPERATURE TCHAG 100 1.10 NORMALISED BREAKOVER VOLTAGE vs JUNCTION TEMPERATURE TC4HAF VD = 50 V Normalised Breakover Voltage |ID| - Off-State Current - A 10 1 0*1 0*01 1.05 1.00 0.95 0*001 -25 0 25 50 75 100 125 TJ - Junction Temperature - C -25 150 Figure 2. 100 TA = 25 C tW = 100 s Normalised Holding Current IT - On-State Current - A 20 15 5 4 3 2 1.5 1 0.7 '4125 THRU '4220 '4240 THRU '4400 1 1.5 2 3 4 5 VT - On-State Voltage - V 1.0 0.9 0.8 0.7 0.6 0.5 '4070 THRU '4115 Figure 4. 6 NORMALISED HOLDING CURRENT vs JUNCTION TEMPERATURE TC4HAD 1.5 50 40 30 7 2.0 TC4HACB 70 10 150 Figure 3. ON-STATE CURRENT vs ON-STATE VOLTAGE 200 150 0 25 50 75 100 125 TJ - Junction Temperature - C 0.4 7 10 -25 0 25 50 75 100 125 TJ - Junction Temperature - C Figure 5. 150 TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 TYPICAL CHARACTERISTICS DIFFERENTIAL OFF-STATE CAPACITANCE vs RATED REPETITIVE PEAK OFF-STATE VOLTAGE TC4HABB Capacitance Normalised to VD = 0 0.7 0.6 0.5 '4070 THRU '4115 0.4 0.3 '4125 THRU '4220 '4240 THRU '4400 0.2 0.5 '4145 '4165 '4180 '4200 '4220 '4240 '4250 '4265 '4290 '4300 '4350 '4395 '4400 '4125 70 '4115 TJ = 25C Vd = 1 Vrms 0.8 '4095 0.9 TCHAEB 75 C - Differential Off-State Capacitance - pF 1 '4070 '4080 NORMALISED CAPACITANCE vs OFF-STATE VOLTAGE 65 60 55 C = Coff(-2 V) - Coff(-50 V) 50 45 40 35 30 1 2 3 5 10 20 30 VD - Off-state Voltage - V Figure 6. 50 100150 50 60 70 80 90100 150 200 250 300 VDRM - Repetitive Peak Off-State Voltage - V Figure 7. 7 TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 RATING AND THERMAL INFORMATION TI4HAC 30 VGEN = 600 Vrms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 C 20 15 10 9 8 7 6 5 4 3 2 1.5 0*1 THERMAL IMPEDANCE vs POWER DURATION 1 10 100 100 70 50 40 30 20 15 10 7 5 4 3 1 0*1 1000 1 10 100 1000 t - Power Duration - s Figure 8. Figure 9. VDRM DERATING FACTOR vs MINIMUM AMBIENT TEMPERATURE IMPULSE RATING vs AMBIENT TEMPERATURE TI4HADB 1.00 700 600 0.99 500 0.98 400 Impulse Current - A Derating Factor ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 C 2 1.5 t - Current Duration - s 0.97 '4070 THRU '4115 0.96 0.95 TC4HAA BELLCORE 2/10 IEC 1.2/50, 8/20 300 FCC 10/160 250 ITU-T 10/700 200 FCC 10/560 150 '4125 THRU '4220 120 0.94 '4240 THRU '4440 0.93 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 TAMIN - Minimum Ambient Temperature - C Figure 10. 8 TI4HAE 150 ZJA(t) - Transient Thermal Impedance - C/W ITSM(t) - Non-Repetitive Peak On-State Current - A NON-REPETITIVE PEAK ON-STATE CURRENT vs CURRENT DURATION 100 90 -40 -30 -20 -10 0 BELLCORE 10/1000 10 20 30 40 50 60 70 80 TA - Ambient Temperature - C Figure 11. TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 APPLICATIONS INFORMATION deployment These devices are two terminal overvoltage protectors. They may be used either singly to limit the voltage between two conductors (Figure 12) or in multiples to limit the voltage at several points in a circuit (Figure 13). Th3 Th1 Th1 Th2 Figure 12. TWO POINT PROTECTION Figure 13. MULTI-POINT PROTECTION In Figure 12, protector Th1 limits the maximum voltage between the two conductors to V(BO). This configuration is normally used to protect circuits without a ground reference, such as modems. In Figure 13, protectors Th2 and Th3 limit the maximum voltage between each conductor and ground to the V(BO) of the individual protector. Protector Th1 limits the maximum voltage between the two conductors to its V(BO) value. If the equipment being protected has all its vulnerable components connected between the conductors and ground, then protector Th1 is not required. impulse testing To verify the withstand capability and safety of the equipment, standards require that the equipment is tested with various impulse wave forms. The table below shows some common values. SERIES TISP4xxxH3 CURRENT PEAK CURRENT VOLTAGE PEAK VOLTAGE WAVE FORM 25 C RATING RESISTANCE VALUE WAVE FORM SETTING A s A s V 2500 2/10 500 2/10 500 GR-1089-CORE 0 1000 10/1000 100 10/1000 100 1500 10/160 200 10/160 250 0 800 10/560 100 10/560 160 0 FCC Part 68 1500 9/720 37.5 5/320 200 0 (March 1998) 1000 9/720 25 5/320 200 0 I3124 1500 0.5/700 37.5 0.2/310 200 0 37.5 1500 5/310 200 0 10/700 ITU-T K.20/K.21 100 4000 FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K.21 10/700 impulse generator STANDARD If the impulse generator current exceeds the protectors current rating then a series resistance can be used to reduce the current to the protectors rated value and so prevent possible failure. The required value of series resistance for a given waveform is given by the following calculations. First, the minimum total circuit impedance is found by dividing the impulse generators peak voltage by the protectors rated current. The impulse generators fictive impedance (generators peak voltage divided by peak short circuit current) is then subtracted from the minimum total circuit impedance to give the required value of series resistance. In some cases the equipment will require verification over a temperature range. By using the rated waveform values from Figure 11, the appropriate series resistor value can be calculated for ambient temperatures in the range of -40 C to 85 C. 9 TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 a.c. power testing The protector can withstand currents applied for times not exceeding those shown in Figure 8. Currents that exceed these times must be terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) resistors and fusible resistors are overcurrent protection devices which can be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to one ampere. In some cases it may be necessary to add some extra series resistance to prevent the fuse opening during impulse testing. The current versus time characteristic of the overcurrent protector must be below the line shown in Figure 8. In some cases there may be a further time limit imposed by the test standard (e.g. UL 1459 wiring simulator failure). capacitance The protector characteristic off-state capacitance values are given for d.c. bias voltage, VD, values of 0, -1 V, -2 V and -50 V. Where possible values are also given for -100 V. Values for other voltages may be calculated by multiplying the VD = 0 capacitance value by the factor given in Figure 6. Up to 10 MHz the capacitance is essentially independent of frequency. Above 10 MHz the effective capacitance is strongly dependent on connection inductance. In many applications, such as Figure 15 and Figure 17, the typical conductor bias voltages will be about -2 V and -50 V. Figure 7 shows the differential (line unbalance) capacitance caused by biasing one protector at -2 V and the other at -50 V. normal system voltage levels The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as ringing without the line connected, some degree of clipping is permissible. Under this condition about 10 V of clipping is normally possible without activating the ring trip circuit. Figure 10 allows the calculation of the protector VDRM value at temperatures below 25 C. The calculated value should not be less than the maximum normal system voltages. The TISP4265H3BJ, with a VDRM of 200 V, can be used for the protection of ring generators producing 100 V r.m.s. of ring on a battery voltage of -58 V (Th2 and Th3 in Figure 17). The peak ring voltage will be 58 + 1.414*100 = 199.4 V. However, this is the open circuit voltage and the connection of the line and its equipment will reduce the peak voltage. In the extreme case of an unconnected line, clipping the peak voltage to 190 V should not activate the ring trip. This level of clipping would occur at the temperature when the VDRM has reduced to 190/200 = 0.95 of its 25 C value. Figure 10 shows that this condition will occur at an ambient temperature of -22 C. In this example, the TISP4265H3BJ will allow normal equipment operation provided that the minimum expected ambient temperature does not fall below -22 C. JESD51 thermal measurement method To standardise thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard (JESD51-2, 1995) describes the test environment. This is a 0.0283 m3 (1 ft3) cube which contains the test PCB (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages smaller than 27 mm on a side and the other for packages up to 48 mm. The SMBJ measurements used the smaller 76.2 mm x 114.3 mm (3.0 " x 4.5 ") PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high thermal resistance) and represent a worse case condition. The PCBs used in the majority of applications will achieve lower values of thermal resistance and so can dissipate higher power levels than indicated by the JESD51 values. 10 TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 typical circuits MODEM TIP WIRE RING FUSE RING DETECTOR R1a Th3 HOOK SWITCH TISP4350 PROTECTED EQUIPMENT Th1 D.C. SINK Th2 SIGNAL TIP AI6XBMA RING WIRE Figure 14. MODEM INTER-WIRE PROTECTION E.G. LINE CARD R1b AI6XBK Figure 15. PROTECTION MODULE R1a Th3 SIGNAL Th1 Th2 R1b AI6XBL D.C. Figure 16. ISDN PROTECTION TIP WIRE OVERCURRENT PROTECTION RING/TEST PROTECTION TEST RELAY RING RELAY SLIC RELAY S3a R1a Th3 S1a SLIC PROTECTION Th4 S2a SLIC Th1 Th2 RING WIRE Th5 R1b S3b S1b S2b TISP6xxxx, TISPPBLx, 1/2TISP6NTP2 C1 220 nF TEST EQUIPMENT RING GENERATOR VBAT AI6XBJ Figure 17. LINE CARD RING/TEST PROTECTION 11 TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 MECHANICAL DATA recommended printed wiring footprint. SMB Pad Size 2.54 2.40 2.16 ALL LINEAR DIMENSIONS IN MILLIMETERS MDXXBI device symbolization code Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified. DEVICE TISP4070H3BJ TISP4080H3BJ TISP4095H3BJ TISP4115H3BJ TISP4125H3BJ TISP4145H3BJ TISP4165H3BJ TISP4180H3BJ TISP4200H3BJ TISP4220H3BJ TISP4240H3BJ TISP4250H3BJ TISP4265H3BJ TISP4290H3BJ TISP4300H3BJ TISP4350H3BJ TISP4395H3BJ TISP4400H3BJ SYMOBLIZATION CODE 4070H3 4080H3 4095H3 4115H3 4125H3 4145H3 4165H3 4180H3 4200H3 4220H3 4240H3 4250H3 4265H3 4290H3 4300H3 4350H3 4395H3 4400H3 carrier information Devices are shipped in one of the carriers below. Unless a specific method of shipment is specified by the customer, devices will be shipped in the most practical carrier. For production quantities the carrier will be embossed tape reel pack. Evaluation quantities may be shipped in bulk pack or embossed tape. CARRIER Embossed Tape Reel Pack Bulk Pack 12 ORDER # TISP4xxxH3BJR TISP4xxxH3BJ TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 MECHANICAL DATA SMBJ (DO-214AA) plastic surface mount diode package This surface mount package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. SMB 4,57 4,06 3,94 3,30 2 Index Mark (if needed) 2,40 2,00 1,52 0,76 2,10 1,90 0,20 0,10 2,32 1,96 5,59 5,21 ALL LINEAR DIMENSIONS IN MILLIMETERS MDXXBHA 13 TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 MECHANICAL DATA tape dimensions SMB Package Single-Sprocket Tape 4,10 3,90 1,65 1,55 2,05 1,95 1,85 1,65 0,40 MAX. 5,55 5,45 8,10 7,90 Direction of Feed o 1,5 MIN. 0 MIN. Carrier Tape 8,20 MAX. Cover Tape 4,5 MAX. Embossment 20 Index Mark (if needed) 12,30 11,70 Maximium component rotation Typical component cavity centre line Typical component centre line ALL LINEAR DIMENSIONS IN MILLIMETERS NOTES: A. The clearance between the component and the cavity must be within 0,05 mm MIN. to 0,65 mm MAX. so that the component cannot rotate more than 20 within the determined cavity. B. Taped devices are supplied on a reel of the following dimensions:Reel diameter: 330 3,0 mm Reel hub diameter 75 mm MIN. Reel axial hole: 13,0 0,5 mm C. 3000 devices are on a reel. 14 MDXXBJ TISP4070H3BJ THRU TISP4115H3BJ, TISP4125H3BJ THRU TISP4220H3BJ, TISP4240H3BJ THRU TISP4400H3BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED OCTOBER 2000 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage ("Critical Applications"). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. Copyright (c) 2000, Texas Instruments Incorporated 15