CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Super fast recovery time for high efficiency
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
RRM
50 100 150 200 300 400 500 600 V
V
RMS
35 70 105 140 210 280 350 420 V
V
DC
50 100 150 200 300 400 500 600 V
I
F(AV)
A
Trr ns
Cj pF
T
JO
C
T
STG O
C
Document Number: DS_D1405037 Version: H14
ES2A thru ES2J
Surface Mount Su
p
er Fast Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
Taiwan Semiconductor
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: DO-214AA (SMB) DO-214AA (SMB)
Polarity: Indicated by cathode band
Weight: 0.09 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL ES
2A
ES
2B
ES
2C
ES
2D
ES
2F
ES
2G
ES
2H
ES
2J Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 2
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
50 A
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
V
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
μA
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Maximum instantaneous forward voltage (Note 1)
@ 2 A V
F
1.7
O
C/W
Operating junction temperature range
Storage temperature range - 55 to +150
Maximum reverse recovery time (Note 2) 35
Typical thermal resistance R
θJL
R
θJA
20
75
Note 1: Pulse test with PW=300μs, 1% duty cycle
0.95 1.3
10
350
Typical junction capacitance (Note 3) 25 20
- 55 to +150
PART NO.
PART NO.
ES2J
ES2J
ES2J
(TA=25℃ unless otherwise noted)
Document Number: DS_D1405037 Version: H14
ES2A thru ES2J
ORDERING INFORMATION
AEC-Q101
QUALIFIED
PACKING COD E GREEN COMPOUND
CODE
PACKAGE PACKING
Taiwan Semiconductor
Prefix "H"
R5
Suffix "G"
SMB 850 / 7" Plastic reel
R4 SMB 3,000 / 13" Paper reel
M4 SMB 3,000 / 13" Plastic reel
Note 1: "xx" defines voltage from 50V (ES2A) to 600V (ES2J)
EXAMPLE
PREFERRED P/N AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
ES2x
(Note 1)
ES2J R5 R5
ES2J R5G R5 G Green compound
ES2JHR5 H R5 AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
0
1
2
3
80 90 100 110 120 130 140 150
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1- MAXIMUM FORWARD CURRENT
DERATING CURVE
RESISTER OR
INDUCTIVE LOAD
0
10
20
30
40
50
60
110100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3- MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
0.01
0.1
1
10
100
1000
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2- TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
TJ=75℃
0.1
1
10
100
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 4- TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
ES2H-2J
Pulse Width=300μs
1% Duty Cycle
ES2F-2G
ES2A-2D
Min Max Min Max
A 1.95 2.10 0.077 0.083
B 4.25 4.75 0.167 0.187
C 3.48 3.73 0.137 0.147
D 1.99 2.61 0.078 0.103
E 0.90 1.41 0.035 0.056
F 5.10 5.30 0.201 0.209
G 0.10 0.20 0.004 0.008
H 0.15 0.31 0.006 0.012
P/N = Specific Device Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1405037 Version: H14
ES2A thru ES2J
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
SUGG ESTED PAD LAYOUT
Symbol Unit (mm) Unit (inch)
A 2.3 0.091
B 2.5 0.098
C 4.3 0.169
MARKING DIAGRAM
D 1.8 0.071
E 6.8 0.268
0
10
20
30
40
50
60
0.1 1 10 100
JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5- TYPICAL JUNCTION CAPACITANCE
ES2A-D
ES2F-J
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405037 Version: H14
ES2A thru ES2J
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
