Description
The T-1 3/4 HLMP-40xx and 2 mm by 5 mm rectangular
HLMP-08xx are three leaded bicolor light sources de-
signed for a variety of applications where dual state illu-
mination is required in the same package. There are two
LED chips, mounted on a central common cathode lead
for maximum on-axis viewability. Colors between the two
chips can be generated by independently pulse width
modulating the LED chips.
Features
• Two color operation
• Three leads with one common cathode
• Option of straight or spread leads conguration
• Diused, wide visibility range
Selection Guide
Min. Luminous Intensity Iv (mcd)
Package Part Number Color Green Red Yellow IF (mA)
T-1 3/4 HLMP-4000 Green/HER 4.2 2.1 10
HLMP-4000#xxx 4.2 2.1 10
HLMP-4015 Green/Yellow 20.0 20 20
Rectangular HLMP-0800 Green/HER 2.6 2.1 20
HLMP-0805 Green/Yellow 2.6 1.4 20
HLMP-40xx, HLMP-08xx
T-1 3/4, 2 mm x 5 mm Rectangular Bicolor LED Lamps
Data Sheet
2
Part Numbering System
Package Dimensions
HLMP-40xx Straight Leads HLMP-08xx Straight Leads
6.10 (0.240)
5.59 (0.220)
25.40
(1.00)MIN.
0.508 (0.020)
SQ. TYP.
RED OR YELLOW ANODE
(SHORT LEAD)
1.27 (0.050)
NOM.
0.89 (0.035)
0.64 (0.025)
9.19 (0.362)
8.43 (0.332)
5.08 (0.200)
4.57 (0.180)
HLMP-40xx Pkg a
1.27 (0.050)
NOM.
2.54 (0.100)
NOM.
FLAT INDICATES
ANODE
COMMON CATHODE
GREEN ANODE
2.54 (0.100)
NOM.
1.27 (0.050)
NOM.
0.508 (0.020)
SQ. TYP.
2.41 (0.095)
2.03 (0.085)
5.46 (0.215)
4.98 (0.196)
8.00 (0.315)
7.37 (0.290)
2.23 (0.088)
1.98 (0.078)
5.18 (0.204)
4.93 (0.194)
1.27 (0.050)
NOM.
25.40
(1.00)MIN.
COMMON
CATHODE COMMON
CATHODE
RED OR YELLOW ANODE
(SHORT LEAD)
COMMON CATHODE
GREEN
ANODE
SIDE VIEW
Notes:
1. All dimensions are in millimeters (inches).
2. Epoxy meniscus may extend about 1 mm (0.040") down the leads.
HLMP - X X X X # X X X
Mechanical Options
002: Tape & Reel, Straight Leads
010: Right Angle Housing, Even Leads
Color Options
00: High Eciency Red (HER)/High Eciency Green
05/15: Yellow/High Eciency Green
Package Options
40: T-1 3/4 (5 mm)
08: Rectangular
3
Absolute Maximum Ratings at TA = 25°C
Parameter HER/Green Yellow/Green Units
Peak Forward Current 90 60 mA
Average Forward Current[1,2] (Total) 25 20 mA
DC Current[2] (Total) 30 20 mA
Power Dissipation[3] (Total) 135 135 mW
Operating Temperature Range –20 to +100 –20 to +100 °C
Storage Temperature Range –40 to +100 –40 to +100 °C
Reverse Voltage (IR = 100 µA) 5 5 V
Transient Forward Current[4] 500 500 mA
(10 µsec Pulse)
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2. The combined simultaneous current must not exceed the maximum.
3. The combined simultaneous current must not exceed the maximum.
4. The transient peak current is the maximum non-recurring current that can be applied to the device without damaging the LED die and wirebond.
It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings.
Notes:
1. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the single wavelength which denes the color of the
device.
2. q1/2 is the o-axis angle at which the luminous intensity is half the axial luminous intensity.
3. Radiant intensity, le, in watts steradian, may be found from the equation le = Iv/hV, where Iv is the luminous intensity in candelas and h V is the
luminous ecacy in lumens/watt.
Electrical/Optical Characteristics at TA = 25˚C
High Eciency Red Green Yellow
Symbol Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units Test Condition
lPEAK Peak 635 568 583 nm 20 mA
Wavelength
ld Dominant 626 570 585 nm 20 mA
Wavelength[1]
ts Speed of 90 260 90 ns
Response
C Capacitance 11 18 15 pF VF = 0, f = 1 MHz
VF Forward 1.9 2.6 2.2 3.0 2.1 2.6 V 20 mA
Voltage
VR Reverse 5 5 5 V IR = 100 µA
Voltage
RqJ-PIN Thermal 210 210 210 °C/W Junction-to-
Resistance Cathode Lead
2q1/2 Included Angle
between half
luminous
intensity points[2]
HLMP-40xx 65 65 65 degree
HLMP-08xx 100 100 100
hV Luminous 145 595 500 lm/W
Ecacy[3]
4
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage characteristics. Figure 3. Relative luminous intensity vs. DC forward current.
HLMP-C115 Figure 2b
0
100
80
60
40
20
I
F
– FORWARD CURRENT – mA
2.0 4.03.01.0
V
F
– FORWARD VOLTAGE – V
0 5.0
YELLOW
HIGH EFFICIENCY RED, ORANGE,
YELLOW, AND HIGH PERFORMANCE
GREEN, EMERALD GREEN
HIGH
EFFICIENCY
RED/ORANGE
HIGH
PERFORMANCE
GREEN,
EMERALD GREEN
HLMP-C115 fig 3b
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0
I
DC
– DC CURRENT PER LED – mA
10 20
1.6
0.8
0.4
5 15 30
1.2
25
0.2
0.6
1.0
1.4
HER, ORANGE, YELLOW, AND HIGH
PERFORMANCE GREEN, EMERALD GREEN
ORANGE
HIGH EFFICIENCY RED
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0
500 550 600 650 700 750
YELLOW
EMERALD GREEN
HIGH
PERFORMANCE
GREEN
TA = 25° C
Figure 4. Relative eciency (luminous intensity per unit current) vs. peak
LED current.
Figure 5. Maximum tolerable peak current vs. pulse duration. (IDC Max. as per
maximum ratings.)
RATIO OF MAXIMUM TOLERABLE
PEAK CURRENT TO MAXIMUM
TOLERABLE DC CURRENT
1.0
t
P
– PULSE DURATION – µs
1
3
4
10,0001000
6
5
2
10010
I
PEAK
MAX.
I
DC
MAX.
100 KHz 3 KHz 100 Hz
30 KHz 1 KHz
10 KHz 300 Hz
HLMP-40xx fig 5
HLMP-C115 Figure 4c
η
PEAK
– RELATIVE EFFICIENCY
(NORMALIZED AT 20 mA)
0
I
PEAK
– PEAK SEGMENT CURRENT – mA
0.4
0.6
0.8
1.0
9020 705040
1.3
1.1
HIGH PERFORMANCE GREEN
YELLOW
HIGH EFFICIENCY
RED/ORANGE
HER, ORANGE, YELLOW, HIGH
PERFORMANCE GREEN, EMERALD GREEN
0.5
0.7
0.9
1.2
30 60 8010
EMERALD GREEN
5
Note:
All categories are established for classication of products. Products may not be available in all categories. Please contact your local Avago represen-
tative for further clarication/information.
Mechanical Option Matrix
Mechanical Option Code Denition
002 Tape & Reel, straight leads, minimum increment 1300 pcs/bag
010 Right Angle Housing, even leads, minimum increment 500 pcs/bag
Figure 6. Relative luminous intensity vs. angular displacement for HLMP-40xx.
10° 100°40° 70°20° 60° 80°30° 50° 90°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
1.0
0.6
0.8
0.2
0.4
HLMP-40xx fig 6
Figure 7. Relative luminous intensity vs. angular displacement for HLMP-08xx.
10° 100°40° 70°20° 60° 80°30° 50° 90°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
1.0
0.6
0.8
0.2
0.4
HLMP-40xx fig 7
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Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4264E
AV02-1552EN - September 23, 2008
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.
• Recommended soldering conditions:
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105 °C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on solder-
ing LED components.
Figure 8. Recommended wave soldering prole.